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Method of making integrated circuit having a micromagnetic device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0511343 (2000-02-23)
발명자 / 주소
  • Anatoly Feygenson
  • Dean P. Kossives
  • Ashraf W. Lotfi
  • Lynn F. Schneemeyer
  • Michael L. Steigerwald
  • R. Bruce Van Dover
출원인 / 주소
  • Agere Systems Guardian Corporation
인용정보 피인용 횟수 : 67  인용 특허 : 11

초록

A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (

대표청구항

1. A method of manufacturing an integrated circuit formed on a substrate having an insulator coupled thereto, comprising:conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor; depositing an adhesive over said insulator; and forming s

이 특허에 인용된 특허 (11)

  1. Yano Yoshihiko,JPX ; Noguchi Takao,JPX, Film structure, electronic device, recording medium, and process of preparing ferroelectric thin films.
  2. Brzezinski Dennis (Sunnyvale CA), Integrated multi-chip module having a conformal chip/heat exchanger interface.
  3. Verbunt Johannes P. M. (Eindhoven NLX), Lamellar magnetic core utilizing low viscosity epoxy adhesive.
  4. Lamping John O. (Los Altos CA) Rao Ramana B. (San Francisco CA), Layout of node-link structures in space with negative curvature.
  5. Kossives Dean P. ; Lotfi Ashraf W. ; Schneemeyer Lynn F. ; Steigerwald Michael L. ; Van Dover R. Bruce, Micromagnetic device for data transmission applications and method of manufacture therefor.
  6. Kossives Dean P. ; Lotfi Ashraf W. ; Schneemeyer Lynn F. ; Steigerwald Michael L. ; Van Dover R. Bruce, Micromagnetic device for power processing applications and method of manufacture therefor.
  7. Kossives Dean P. ; Lotfi Ashraf W. ; Schneemeyer Lynn F. ; Steigerwald Michael L. ; Van Dover R. Bruce, Micromagnetic device having an anisotropic ferromagnetic core and method of manufacture therefor.
  8. Uemura Kazuyoshi (Tokyo JPX), Molded semiconductor device.
  9. Imakoshi Shigeyoshi (Kanagawa JPX) Soda Yutaka (Kanagawa JPX) Suyama Hideo (Kanagawa JPX), Thin film type magnetic transducer head.
  10. Jones ; Jr. Robert E. (San Jose CA) Kryder Mark H. (Bradford Woods PA) Mountfield Keith R. (Pittsburgh PA) Guzman Javier I. (Pittsburgh PA), Unshielded horizontal magnetoresistive head and method of fabricating same.
  11. Leighton Larry C. ; Moller Thomas W. ; Ahl Bengt,SEX, Wire bond attachment of a integrated circuit package to a heat sink.

이 특허를 인용한 특허 (67)

  1. Yan, Wenguang; Lotfi, Ashraf W., Asymmetric power flow controller for a power converter and method of operating the same.
  2. Yan, Wenguang; Lotfi, Ashraf W., Asymmetric power flow controller for a power converter and method of operating the same.
  3. Lin, Mou-Shiung; Lee, Jin-Yuan, Chip packages having dual DMOS devices with power management integrated circuits.
  4. Lin, Mou-Shiung, Chip structure with a passive device and method for forming the same.
  5. Lint, James Douglas; Jin, Fuxue; Aldaco, Victor; Machado, Russell L., Current sensing devices and methods.
  6. Lint, James Douglas; Jin, Fuxue; Michel, Francisco; Aldaco, Victor, Current sensing devices and methods.
  7. Lint, James Douglas; Jin, Fuxue; Aldaco, Victor; Machado, Russell L., Current sensing devices with integrated bus bars.
  8. Lint, James Douglas; Jin, Fuxue; Michel, Francisco; Aldaco, Victor, Current sensing inductive devices.
  9. Kalistaja, Esa; Lambacka, Riku; Annamaa, Petteri, Deposited three-dimensional antenna apparatus and methods.
  10. Kuehler, Dan; Hamilton, Bruce; Benjamin, Alan; Annamaa, Petteri; Kalistaja, Esa, Deposition antenna apparatus and methods.
  11. Urbach, Peter; Feiler, Wolfgang; Raica, Thomas; Hornung, Stefan, Electric motor comprising an electronic unit with a punched grid.
  12. Liakopoulos, Trifon M.; Filas, Robert W., Electrolyte and method of producing the same.
  13. Liakopoulos, Trifon M.; Filas, Robert W.; Panda, Amrit, Electroplating cell and tool.
  14. Lin, Mou-Shiung, High performance system-on-chip inductor using post passivation process.
  15. Lin, Mou-Shing, High performance system-on-chip using post passivation process.
  16. Lin, Mou-Shiung, High performance system-on-chip using post passivation process.
  17. Lin,Mou Shiung, High performance system-on-chip using post passivation process.
  18. Lin,Mou Shiung, High performance system-on-chip using post passivation process.
  19. Feygenson, Anatoly; Kossives, Dean P.; Lotfi, Ashraf W.; Schneemeyer, Lynn F.; Steigerwald, Michael L.; Van Dover, R. Bruce, Integrated circuit having a micromagnetic device and method of manufacture therefor.
  20. Kossives, Dean P.; Lotfi, Ashraf W.; Schneemeyer, Lynn F.; Steigerwald, Michael L.; Van Dover, R. Bruce, Integrated circuit having a micromagnetic device and method of manufacture therefor.
  21. Dinh, Thuyen; Saboori, Mohammad; Greene, Mark; Abedmamoore, Hamlet, Integrated connector modules for extending transformer bandwidth with mixed-mode coupling using a substrate inductive device.
  22. Lotfi, Ashraf W.; Wilkowski, Mathew A.; Liakopoulos, Trifon M.; Weld, John D., Magnetic device having a conductive clip.
  23. Lotfi, Ashraf W.; Wilkowski, Mathew A.; Liakopoulos, Trifon M.; Weld, John D., Magnetic device having a conductive clip.
  24. Lin, Mou-Shiung; Lee, Jin-Yuan, Method for making high-performance RF integrated circuits.
  25. Lin, Mou-Shiung; Lee, Jin-Yuan, Method for making high-performance RF integrated circuits.
  26. Lotfi, Ashraf W.; Wilkowski, Mathew A.; Liakopoulos, Trifon M.; Weld, John D., Method of forming a magnetic device having a conductive clip.
  27. Lotfi, Ashraf W.; Liakopoulos, Trifon M.; Filas, Robert W., Method of forming a micromagnetic device.
  28. Lotfi, Ashraf W.; Wilkowski, Mathew A.; Liakopoulos, Trifon M.; Weld, John D., Method of forming a power module with a magnetic device having a conductive clip.
  29. Lotfi, Ashraf W.; Wilkowski, Mathew; Weld, John D., Method of manufacturing a power module.
  30. Lotfi,Ashraf W.; Wilkowski,Mathew; Weld,John D., Method of manufacturing a power module.
  31. Lotfi, Ashraf W.; Wilkowski, Mathew; Weld, John D., Method of manufacturing an encapsulated package for a magnetic device.
  32. Lotfi,Ashraf W.; Wilkowski,Mathew; Weld,John D., Method of manufacturing an encapsulated package for a magnetic device.
  33. Kalistaja, Esa; Galla, Elli; Kuehler, Dan; Childers, Winthrop, Methods and apparatus for conductive element deposition and formation.
  34. Kalistaja, Esa; Galla, Elli; Kuehler, Dan; Childers, Winthrop, Methods and apparatus for conductive element deposition and formation.
  35. Takahashi, Ken; Liakopoulos, Trifon M., Methods of processing a substrate and forming a micromagnetic device.
  36. Lotfi, Ashraf W.; Liakopoulos, Trifon M.; Filas, Robert W.; Panda, Amrit, Micromagnetic device and method of forming the same.
  37. Lotfi, Ashraf W.; Liakopoulos, Trifon M.; Filas, Robert W.; Panda, Amrit, Micromagnetic device and method of forming the same.
  38. Lotfi, Ashraf W.; Liakopoulos, Trifon M.; Filas, Robert W.; Panda, Amrit, Micromagnetic device and method of forming the same.
  39. Lotfi, Ashraf W.; Lopata, Douglas Dean; Weld, John David; Wilkowski, Mathew A., Module having a stacked magnetic device and semiconductor device and method of forming the same.
  40. Lotfi, Ashraf W.; Lopata, Douglas Dean; Weld, John David; Wilkowski, Mathew A., Module having a stacked magnetic device and semiconductor device and method of forming the same.
  41. Lotfi, Ashraf W.; Lopata, Douglas Dean; Weld, John David; Wilkowski, Mathew A., Module having a stacked passive element and method of forming the same.
  42. Lotfi, Ashraf W.; Lopata, Douglas Dean; Weld, John David; Wilkowski, Mathew A., Module having a stacked passive element and method of forming the same.
  43. Lin, Mou-Shiung; Chou, Chiu-Ming; Chou, Chien-Kang, Post passivation interconnection process and structures.
  44. Lin, Mou-Shiung; Chou, Chiu-Ming; Chou, Chien-Kang, Post passivation interconnection structures.
  45. Lotfi, Ashraf W.; Liakopoulos, Trifon M.; Filas, Robert W., Power converter employing a micromagnetic device.
  46. Lotfi, Ashraf W.; Liakopoulos, Trifon M.; Filas, Robert W.; Panda, Amrit, Power converter employing a micromagnetic device.
  47. Mera, Narciso; Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter for a memory module.
  48. Mera, Narciso; Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter for a memory module.
  49. Abou-Alfotouh, Ahmed Mohamed; Dwarakanath, Mirmira Ramarao; Demski, Jeffrey, Power converter with a dynamically configurable controller and output filter.
  50. Dwarakanath, Mirmira Ramarao; Demski, Jeffrey; Abou-Alfotouh, Ahmed Mohamed, Power converter with a dynamically configurable controller based on a power conversion mode.
  51. Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter with controller operable in selected modes of operation.
  52. Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter with controller operable in selected modes of operation.
  53. Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter with controller operable in selected modes of operation.
  54. Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter with controller operable in selected modes of operation.
  55. Lotfi, Ashraf W.; Wilkowski, Mathew A.; Liakopoulos, Trifon M.; Weld, John D., Power module with a magnetic device having a conductive clip.
  56. Schaffer, Christopher P.; Gutierrez, Aurelio J., Substrate inductive devices and methods.
  57. Schaffer, Christopher P.; Gutierrez, Aurelio J.; Lindner, Alan, Substrate inductive devices and methods.
  58. Schaffer, Christopher P.; Lindner, Alan, Substrate inductive devices and methods.
  59. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  60. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  61. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  62. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  63. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  64. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  65. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  66. Lin, Mou-Shiung; Wei, Gu-Yeon, Voltage regulator integrated with semiconductor chip.
  67. Schaffer, Christopher P.; Gutierrez, Aurelio J., Wire-less inductive devices and methods.
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