초록 ▼

An apparatus for cooling circuit components includes a heat sink and circuit components mounted on a base. The heat sink includes a heat receiving portion for receiving heat from the circuit components. The heat sink includes a heat-transfer member provided between the heat sink and the circuit comp

An apparatus for cooling circuit components includes a heat sink and circuit components mounted on a base. The heat sink includes a heat receiving portion for receiving heat from the circuit components. The heat sink includes a heat-transfer member provided between the heat sink and the circuit component. A spacer is provided between the circuit components and the heat sink to support the heat sink.

대표청구항 ▼

1. An apparatus comprising:a wiring board having a surface; a circuit component containing a base of synthetic resin, said base having a first mounting surface, a second mounting surface positioned on an opposite side to the first mounting surface, a plurality of terminals arranged on said second mo

1. An apparatus comprising:a wiring board having a surface; a circuit component containing a base of synthetic resin, said base having a first mounting surface, a second mounting surface positioned on an opposite side to the first mounting surface, a plurality of terminals arranged on said second mounting surface, and a heat generating unit positioned on a central part of the first mounting surface of said base, said plurality of terminals arranged in an area around said heat generating unit; a socket provided on the surface of said wiring board and electrically connected to said plurality of terminals, said socket having a hollow portion at a position corresponding to the central part of said base, said second mounting surface of said base facing the hollow portion of said socket; a heat sink on said circuit component, said heat sink having a heat receiving portion for receiving heat from said heat generating unit; a flexible heat-transfer member provided between said heat generating unit and said heat receiving portion, for thermally connecting said heat generating unit and said heat receiving portion; and a spacer provided between said base of said circuit component and said heat sink, for supporting said heat sink.