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Flexible heat pipe 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0625301 (2000-07-25)
발명자 / 주소
  • John H. Rosenfeld
  • Nelson J. Gernert
  • David B. Sarraf
  • Peter Wollen
  • Frank Surina
  • John Fale
출원인 / 주소
  • Thermal Corp.
대리인 / 주소
    Duane Morris LLP
인용정보 피인용 횟수 : 36  인용 특허 : 15

초록

The invention is a very flexible heat pipe which is constructed of multiple layers of material laminated into the final structure. The center of the symmetrical structure is a coarse screen which creates a vapor space. The layers on either side of the screen are copper felt pads, and the outer casin

대표청구항

1. A flexible heat pipe comprising:a separator comprising at least one flexible layer with holes for multidirectional movement of vapor; wick layers in contact with and located on both sides of the separator, with the wick layers comprising flexible porous material; and two outer walls enclosing the

이 특허에 인용된 특허 (15)

  1. Faghri Amir (Dayton OH), Centrifugal heat pipe vapor absorption heat pump.
  2. Meyer ; IV George A. (Conestoga PA) Garner Scott D. (Lititz PA), Electrically insulated envelope heat pipe.
  3. Reinmuller Donald L. (Enon OH), Expandable radiator.
  4. Larson Ralph (Bolton MA) Phillips Richard J. (Alachua FL), Flexible heat pipe for integrated circuit cooling apparatus.
  5. Jean Amigo (No. 18 ; Alley S ; Lane 19 ; Nu-Chung Rd. I-Lan City TWX), Flexible heat transfer device.
  6. Sakaya Masuji (Narashino JPX) Okiai Ryuichi (Yotsukaido JPX) Mochizuki Masataka (Nagareyama JPX) Mashiko Kouichi (Tokyo JPX), Heat pipe and method of manufacturing the same.
  7. Fitzpatrick Peter R. (Glastonbury CT) Meyerand ; Jr. Russell G. (Glastonbury CT) Shotwell Kenneth E. (Stafford Springs CT), Heat pipe bag system.
  8. Honda ; Ichiro ; Takasu ; Shigetoshi ; Onuki ; Yoshio, Heat pipes, process and apparatus for manufacturing same.
  9. Salt Harry (North Caulfield AUX), Heat transfer device.
  10. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL), Method of making a two-phase thermal bag component cooler.
  11. Walter Karl H. (Henley South AUX) Hill Robert L. (Panorama AUX), Production of particulate solids in rotary fluidizer.
  12. Tanzer Herbert J. (Topanga CA), Space vehicle thermal rejection system.
  13. Danielson Richard D. (Hastings MN) Hesselroth David A. (St. Paul Park MN) Stein ; Jr. Ralph J. (So. St. Paul MN), Thermal transfer bag.
  14. Eastman George Y. (Lancaster PA), Unfurlable heat pipe.
  15. Lamp Thomas R. (Torrance CA), Water heat pipe with improved compatability.

이 특허를 인용한 특허 (36)

  1. Halbert, David D.; Kuslich, Christine; Poste, George; Klass, Michael; Spetzler, David; Pawlowski, Traci; Tasinato, Andrea; Holterman, Daniel, Biomarkers for theranostics.
  2. Valenzuela, Javier A., Capillary condenser/evaporator.
  3. Valenzuela, Javier A., Capillary evaporator.
  4. Kuslich, Christine; Poste, George; Klass, Michael; Spetzler, David; Pawlowski, Traci, Circulating biomarkers for metastatic prostate cancer.
  5. Ohmi, Motosuke; Kato, Eisaku; Tonosaki, Minehiro, Cooling device, electronic apparatus, display unit, and method of producing cooling device.
  6. Ohmi,Motosuke; Kato,Eisaku; Tonosaki,Minehiro, Cooling device, electronic apparatus, display unit, and method of producing cooling device.
  7. Yang, Ronggui; Lee, Yung-Cheng; Bright, Victor M.; Li, Chen; Oshman, Christopher; Shi, Bo; Cheng, Jen- Hau; Peterson, George P., Flexible thermal ground plane and manufacturing the same.
  8. Yang, Ronggui; Lee, Yung-Cheng; Bright, Victor M.; Li, Chen; Oshman, Christopher; Shi, Bo; Cheng, Jen-Hau; Peterson, George P., Flexible thermal ground plane and manufacturing the same.
  9. Yang, Ronggui; Lee, Yung-Cheng; Bright, Victor M.; Li, Chen; Oshman, Christopher; Shi, Bo; Cheng, Jen-Hau; Peterson, George P., Flexible thermal ground plane and manufacturing the same.
  10. Rylewski,Eugeniusz, Heat exchange unit, in particular for ventilating a building.
  11. Hsu,Hul Chun, Heat pipe assembly.
  12. Todd, John J.; Longsderff, David R.; Toth, Jerome E., Heat pipe fin stack with extruded base.
  13. Todd,John J.; Longsderff,David R.; Toth,Jerome E., Heat pipe fin stack with extruded base.
  14. Semenov, Sergey Y.; Thayer, John Gilbert; Gernert, Nelson J., Heat pipe having a wick with a hybrid profile.
  15. Chau, David S.; Sauciuc, Ioan, Heat pipe having an inner retaining wall for wicking components.
  16. Hsu,Hul Chun, Heat pipe having fiber wick structure.
  17. Chen, Ga-Lane, Heat pipe with hydrophilic layer and/or protective layer.
  18. Hsieh, Yi-Shih, Heat pipe with sealed vesicle.
  19. Shirakami, Takashi; Yamazaki, Naoya; Iino, Kazuhiro; Tada, Yoshiaki; Ueda, Satoshi, Heat transfer mechanism, heat dissipation system, and communication apparatus.
  20. Shin, Sung Ho, LED lighting device.
  21. Bakke, Allan P, Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability.
  22. Yang, Hsiu-Wei; Chang, Fu-Kuei, Manufacturing method of vapor chamber.
  23. Yeh,Lan Kai; Lin,Che Wei; Chen,Shao Wen; Shyu,Jin Cherng; Tsai,Ming Jye, Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device.
  24. Li,Jia Hao, Method for fabricating multi-layer wick structure of heat pipe.
  25. Lee, Jeong Hyun, Method for heat transfer and device therefor.
  26. Touzov,Igor Victorovich, Multi-surface heat sink film.
  27. Wadley, Haydn N. G.; Haj-Hariri, Hossein; Zok, Frank; Norris, Pamela M., Multifunctional thermal management system and related method.
  28. Hendricks, Terry Joseph; Thoensen, Thomas, Passive cooling system for a vehicle.
  29. Ueki, Tatsuhiko; Yamamoto, Masaaki; Kimura, Yuichi, Plate-type heat pipe and method for manufacturing the same.
  30. Lewis, Ryan John; Lee, Yung-Cheng; Liew, Li-Anne; Wang, Yunda, Polymer-based microfabricated thermal ground plane.
  31. Strehlow, Russell H.; Bobgan, Peter M., Thermal energy storage assembly.
  32. Strehlow, Russell H.; Bobgan, Peter M., Thermal ground plane with tension elements.
  33. Francis, William; Hulse, Michael, Thermal ground planes and light-emitting diodes.
  34. Voth, David William; Delano, Andrew Douglas, Thermal management system including an elastically deformable phase change device.
  35. Sasaki,Yasumi; Ooi,Yasuyuki, Thin sheet type heat pipe.
  36. Park, Kyungui; Kim, Donghyun; Lee, Joseph; Ahn, Wonkee; Kim, Donghyun; Song, Changwoo, Watch type mobile terminal.
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