[특허]Base material for a printed circuit board formed from a three-dimensional woven fiber structure

[미국특허] Base material for a printed circuit board formed from a three-dimensional woven fiber structure 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B32B-003/00
출원번호	US-0528621 (2000-03-20)
발명자 / 주소	Mansour H. Mohamed R. Bradley Lienhart Pu Gu
출원인 / 주소	3Tex, Inc.
대리인 / 주소	Jenkins & Wilson, P.A.
인용정보	피인용 횟수 : 23 인용 특허 : 9

초록 ▼

A base material for a printed circuit board, and a printed circuit board constructed therefrom. The base material is formed from a three-dimensional orthogonally woven fabric having a crimp-free fiber architecture in the x-y plane and an integrated multi-layer structure. The base material comprises a first system of straight first fibers extending along a first direction in a first plane, a second system of straight second fibers extending along a second direction in a second plane parallel to the first plane, and a third system of third fibers extending along a third direction through the first and second systems and binding the first and second fibers thereof. A filler material coats a portion of the first, second and third systems. The printed circuit board comprises the base material and one or more conductive layers attached to surfaces of the base material.

대표청구항 ▼

1. A printed circuit board comprising:(a) a base material formed from a three-dimensional woven fabric having a crimp-free fiber architecture in an x-y plane and including a first system of straight first fibers extending along a first direction in a first plane, a second system of straight second fibers extending along a second direction in a second plane parallel to the first plane, and a third system of third fibers extending along a third direction through the first and second systems and binding the first and second fibers thereof; and (b) a first layer of conductive material attached to a first surface of the base material.

이 특허에 인용된 특허 (9) 인용/피인용 타임라인 분석

Sanville ; Jr. Robert J. (Northfield NH) Kernander Carl P. (Lee NH), Circuit board prepreg with reduced dielectric constant.
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Hohman Alvin E. (Dallas TX), Composite products and method of preparation.
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Van Skyhawk Norman J. (Sandy UT) Mebius Don (Sandy UT), Composite structures incorporating multiple resin-based systems.
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Middelman Erik (Arnhem NLX), Continuous process for the manufacture of substrates for printed wire boards.
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Scari Diego Armando,ITX ; Scari Marco,ITX, Laminates for printed circuits using unidirectional glass fabric.
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Becker Robert (Leverkusen DEX) Goldmann Gerd (Krefeld DEX) von Gizycki Ulrich (Leverkusen DEX) von Bonin Wulf (Odenthal DEX), Lightweight composite material.
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Mohamed Mansour H. (Raleigh NC) Zhang Zhong-Huai (Shanghai CNX), Method of forming variable cross-sectional shaped three-dimensional fabrics.
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Mohamed Mansour H. (Raleigh NC) Bilisik A. Kadir (Raleigh NC), Multi-layer three-dimensional fabric and method for producing.
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Hirokawa Tetsuro (Omihachiman JPX), Textile structure for reinforced composite material.
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이 특허를 인용한 특허 (23) 인용/피인용 타임라인 분석

Whinnery, Joseph P. W.; Chung, Dennis B., 3-D woven active fiber composite.
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Morin, Brian G., Composite materials including amorphous thermoplastic fibers.
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Lakrout, Hamed; Anderson, Stephanie K.; Valette, Ludovic; Verghese, Nikhil Eapen, Device and method for assessing the machinability of laminates.
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Retz, Kevin Matthew; Prichard, Alan Keith, Electrically conductive structure.
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Bhattacharya, Rabin; Van Pieterson, Liesbeth; Van Os, Koen; Schuler, Thomas; Lamerichs, Guido; Altewischer, Erwin, Electronic textile.
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Chu, Andrew W.; Dobbins, Justin A.; Scully, Robert C.; Trevino, Robert C.; Lin, Greg Y.; Fink, Patrick W., Fabric circuits and method of manufacturing fabric circuits.
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Park, Sung Mee; Cho, Kwang Su; Chung, Kyung Hee, Flexible printed conductive fabric and method for fabricating the same.
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Crawford, Jr., James A., Helical textile with uniform thickness.
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Crawford, Jr., James A., Helical textile with uniform thickness.
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Goering, Jonathan, Hybrid three-dimensional woven/laminated struts for composite structural applications.
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Goering, Jonathan, Hybrid three-dimensional woven/laminated struts for composite structural applications.
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Goering, Jonathan, Hybrid three-dimensional woven/laminated struts for composite structural applications.
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Lozier, Antony J.; Rich, David B.; Parrott, Russell M., Implant sensors.
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Rose, Donald; Goering, Jonathan; Biddle, Steve, Multidirectionally reinforced shape woven preforms for composite structures.
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Lin, Yu-Hsu; Tai, Chan-Fei; Wu, Jeng-Da; Chao, Chih-Hang, Printed circuit board.
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Wasielewski, Ray C.; Komistek, Richard D.; Mahfouz, Mohamed R., Smart joint implant sensors.
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Falahee,Mark H., Surgical smoke field evacuators.
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Naigertsik, Oleg; Fischman, Alex; Engleman, Ian; Kettner, Isaac Jak, Thermal management of printed circuit board components.
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Esser-Kahn, Aaron P.; Dong, Hefei; Thakre, Piyush R.; Patrick, Jason F.; Sottos, Nancy R.; Moore, Jeffrey S.; White, Scott R., Thermally degradable polymeric fibers.
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Feldman, Jay D.; Wilkinson, Curt G.; Mercer, Kenneth J.; Venkatapathy, Ethiraj, Three-dimensional multifunctional ablative thermal protection system.
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Wasielewski, Ray C., Use of micro and miniature position sensing devices for use in TKA and THA.
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Mohamed,Mansour H., Wind blade spar cap and method of making.
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Morita, Yoshihiro; Ooi, Takahiro; Yamada, Tetsuro; Matsui, Akiko; Sugane, Mitsuhiko; Mukoyama, Takahide, Wiring substrate and method for manufacturing the wiring substrate.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Base material for a printed circuit board formed from a three-dimensional woven fiber structure 원문보기