초록 ▼

To manage heat generated by an electric circuit, a fan is provided to generate an air flow through a ducting structure over the electric circuit. For example, in a graphics accelerator card, a fan is placed in a void in the card and a ducting structure is placed over the fan and the graphics control

To manage heat generated by an electric circuit, a fan is provided to generate an air flow through a ducting structure over the electric circuit. For example, in a graphics accelerator card, a fan is placed in a void in the card and a ducting structure is placed over the fan and the graphics controller IC chip of the card. Air flow generated by the fan travels over the IC chip via the ducting structure to reduce the ambient temperature around the IC chip. The height of the ducting structure from a surface of the graphics accelerator card may be made sufficiently small so as to satisfy height requirements set forth in specifications such as the Peripheral Component Interconnect (PCI) and Accelerated Graphics Port (AGP) specifications.

대표청구항 ▼

1. A system including at least one electric circuit comprising:a card; an electric circuit on said card; a fan attached to said card; and a ducting structure coupled to said card and over said fan, where said fan is adapted to generate an air flow from one side of said card to another side of said c

1. A system including at least one electric circuit comprising:a card; an electric circuit on said card; a fan attached to said card; and a ducting structure coupled to said card and over said fan, where said fan is adapted to generate an air flow from one side of said card to another side of said card in said ducting structure directing the air flow over said electric circuit.