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A sputter source has at least two electrically mutually isolated stationar bar-shaped target arrangements mounted one alongside the other and separated by respective slits. Each of the target arrangements includes a respective electric pad so that each target arrangement may be operated electrically

A sputter source has at least two electrically mutually isolated stationar bar-shaped target arrangements mounted one alongside the other and separated by respective slits. Each of the target arrangements includes a respective electric pad so that each target arrangement may be operated electrically independently from the other target arrangement. Each target arrangement also has a controlled magnet arrangement for generating a time-varying magnetron field upon the respective target arrangement. The magnet arrangements may be controlled independently from each others. The source further has an anode arrangement with anodes alongside and between the target arrangements and/or along smaller sides of the target arrangements.

대표청구항 ▼

1. A sputter coating chamber with a sputter source, comprising: at least two electrically mutually isolated stationary bar-shaped target arrangements, mounted one alongside the other and separated by respective slits; each of said target arrangements comprising a respective electric pad so that each

1. A sputter coating chamber with a sputter source, comprising: at least two electrically mutually isolated stationary bar-shaped target arrangements, mounted one alongside the other and separated by respective slits; each of said target arrangements comprising a respective electric pad so that each of said target arrangements may be operated electrically independently from the other target arrangement; each target arrangement comprising a controlled magnet arrangement generating a time varying magnetron field upon the respective target arrangement and thus forming a magnetron sputtering source; a substrate holder for at least one substrate to be sputter-coated, said holder being arranged distant and opposite to said magnetron sputtering source, the ratio VQS of a sputtering surface (FQ) said sputter source to a surface (FS) of a substrate held by said substrate holder and to be sputter-coated being VQS.ltoreq.3.