초록 ▼

The invention provides a resin-sealing apparatus that is operated with a low pressure and with a low clamping force without void generation and that is favorable for shortening the molding time and reduction of sealing resin consumption. In the resin-sealing apparatus of the present invention, a res

The invention provides a resin-sealing apparatus that is operated with a low pressure and with a low clamping force without void generation and that is favorable for shortening the molding time and reduction of sealing resin consumption. In the resin-sealing apparatus of the present invention, a resin injection inlet of a pot has an opening at the center of the cavity surface of a cavity of a bottom mold that is a component of a mold unit, and a plunger for injecting molten resin in the pot from the opposite side to the resin injection inlet side is provided slidably and airtightly with the inside wall of the pot.

대표청구항 ▼

1. A resin-sealing apparatus comprising:a pair of a top mold and a bottom mold one of which is movable; heaters disposed on the top mold and under the bottom mold respectively; and a cavity formed between the pair of the top mold and the bottom mold, wherein: the resin-sealing apparatus is provided

1. A resin-sealing apparatus comprising:a pair of a top mold and a bottom mold one of which is movable; heaters disposed on the top mold and under the bottom mold respectively; and a cavity formed between the pair of the top mold and the bottom mold, wherein: the resin-sealing apparatus is provided with: a pot having a resin injection inlet that opens directly to the cavity of the bottom mold that supplies at least one of resin tablets and powder resin and for melting the same by the heaters to form molten resin; and a plunger for injecting molten resin in the pot into the cavity from the opposite side to the resin injection inlet side of the pot, and the plunger is disposed slidably in the pot and airtightly with the inside wall of the pot.