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Double gated transistor 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/94
출원번호 US-0302768 (1999-04-30)
발명자 / 주소
  • Gerhard Enders
  • Thomas Schulz DE
  • Dietrich Widmann DE
  • Lothar Risch DE
출원인 / 주소
  • Infineon Technologies Richmond, LP
대리인 / 주소
    Stanton Braden
인용정보 피인용 횟수 : 87  인용 특허 : 6

초록

A semiconductor body having a pair of vertical, double-gated CMOS transistors. An insulating layer extending horizontally beneath the surface of the semiconductor body such insulating layer being disposed beneath the pair of transistors. The transistors, together with additional such transistors, ar

대표청구항

1. A semiconductor body, comprising:a transistor having a gate channel region disposed between a source region and a drain region, such regions being disposed in the body and extending vertically beneath a surface of the body; a pair of dielectric layers, each one thereof being disposed on a corresp

이 특허에 인용된 특허 (6)

  1. Sunami Hideo (Nishitama JPX) Ohkura Makoto (Fuchu JPX) Kimura Shinichiro (Hachioji JPX), Complementary MOS integrated circuits having vertical channel FETs.
  2. Lee Yong H. (Seoul KRX), Method of constructing reduced size highly integrated static random access memory with double vertical channel structure.
  3. Beilstein ; Jr. Kenneth Edward (Essex Junction VT) Bertin Claude Louis (So. Burlington VT) Cronin John Edward (Milton VT) White Francis Roger (Essex Junction VT), Three-dimensional SRAM trench structure and fabrication method therefor.
  4. Tsutsumi Kazuhito (Hyogo-ken JPX), Vertical field effect transistor with a trench structure.
  5. Mikata Yuuichi (Kawasaki JPX) Usami Toshiro (Yokohama JPX), Vertical field effect transistor with an extended polysilicon channel region.
  6. Iwamatsu Toshiaki (Tokyo JPX) Inoue Yasuo (Tokyo JPX), Vertical mosfet including a back gate electrode.

이 특허를 인용한 특허 (87)

  1. Kavalieros,Jack T.; Shah,Uday; Rachmady,Willy; Doyle,Brian S., Apparatus and method for selectively recessing spacers on multi-gate devices.
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  4. Scheuerlein, Roy E., Continuous mesh three dimensional non-volatile storage with vertical select devices.
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  6. Scheuerlein, Roy E., Continuous mesh three dimensional non-volatile storage with vertical select devices.
  7. Brask, Justin K.; Datta, Suman; Doczy, Mark L.; Blackwell, James M.; Metz, Matthew V.; Kavalieros, Jack T.; Chau, Robert S., Dielectric interface for group III-V semiconductor device.
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  21. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors in same process flow.
  22. Chang, Peter L. D., Integration of planar and tri-gate devices on the same substrate.
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  25. Datta,Suman; Doyle,Brian S.; Chau,Robert S.; Kavalieros,Jack; Zheng,Bo; Hareland,Scott A., Method and apparatus for improving stability of a 6T CMOS SRAM cell.
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  29. Shah,Uday; Doyle,Brian S.; Brask,Justin K.; Chau,Robert S., Method of fabricating a multi-cornered film.
  30. Doyle,Brian S.; Datta,Suman; Kavalieros,Jack T.; Majumdar,Amlan, Method of ion implanting for tri-gate devices.
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  32. Brask, Justin K.; Kavalieros, Jack; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S.; Doyle, Brian S., Methods for patterning a semiconductor film.
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  34. Brask,Justin K.; Kavalieros,Jack T.; Doyle,Brian S.; Chau,Robert S., Non-planar microelectronic device having isolation element to mitigate fringe effects and method to fabricate same.
  35. Doyle,Brian S; Datta,Suman; Jin,Been Yih; Zelick,Nancy M; Chau,Robert, Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow.
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  48. Brask,Justin K.; Doyle,Brian S.; Kavalieros,Jack; Doczy,Mark; Shah,Uday; Chau,Robert S., Nonplanar transistors with metal gate electrodes.
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  50. Kavalieros,Jack T.; Brask,Justin K.; Doyle,Brian S.; Shah,Uday; Datta,Suman; Doczy,Mark L.; Metz,Matthew V.; Chau,Robert S., Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby.
  51. Walker, Darryl G., Random access memory cell having reduced current leakage and having a pass transistor control gate formed in a trench.
  52. Rachmady, Willy; Shah, Uday; Kavalieros, Jack T.; Doyle, Brian S., Selective anisotropic wet etching of workfunction metal for semiconductor devices.
  53. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  54. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
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  58. Hudait, Mantu K.; Shaheen, Mohamad A.; Chow, Loren A.; Tolchinsky, Peter G.; Fastenau, Joel M.; Loubychev, Dmitri; Liu, Amy W. K., Stacking fault and twin blocking barrier for integrating III-V on Si.
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  83. Konevecki, Michael; Dunton, Vance; Radigan, Steve, Vertical bit line non-volatile memory with recessed word lines.
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