초록 ▼

A multi-leaded, filter feed-thru assembly for implantable medical devices, such as heart pacemakers, defibrillators, and neurostimulators, which integrates both multi-element semiconductor devices and passive component devices, or multi-element combinations thereof, together with a discoidal capacit

A multi-leaded, filter feed-thru assembly for implantable medical devices, such as heart pacemakers, defibrillators, and neurostimulators, which integrates both multi-element semiconductor devices and passive component devices, or multi-element combinations thereof, together with a discoidal capacitive filter device to provide filtration of electromagnetic interference is provided. The assembly additionally provides for the suppression of high voltage transients from defibrillation and electrocautery procedures, as well as providing additional circuit and network functions.

대표청구항 ▼

1. A filtered feed-thru assembly for implantable medical devices, the assembly comprising:(a) a header having a supportive surface with a flange on the outer perimeter thereof for attachment to an implantable housing and a first opening defined through said header; (b) multiple electrically conducti

1. A filtered feed-thru assembly for implantable medical devices, the assembly comprising:(a) a header having a supportive surface with a flange on the outer perimeter thereof for attachment to an implantable housing and a first opening defined through said header; (b) multiple electrically conductive terminal pins disposed within and extending through said first opening, said terminal pins each having respective first and second ends; (c) an electrically insulative support for said multiple electrically conductive terminal pins, said electrically insulative support being disposed within said first opening; (d) a discoidal capacitive device with an upper and lower side, said lower side connected to said support surface of said header, comprising a first set of electrode plates arranged to be suitable for parallel connections with said multiple electrically conductive terminal pins, a second set of electrode plates arranged to be suitable for series connections with said multiple electrically conductive terminal pins, and a second set of openings defined through said discoidal capacitive device for passage of said terminal pins, wherein said first opening through said header aligns with said second set of openings in said discoidal capacitive device when they are bonded; and (e) wherein electrically conductive patterns are disposed on said upper side of said discoidal capacitor and an electrical component is connected to said electrically conductive patterns.