초록 ▼

A circuit module mounting structure and a method for mounting an IC chip in the circuit module applicable to electronic equipment with a slim body. To increase radiation efficiency of the heat emitted from the IC chip, a heat conducting element including a plurality of thin plates is provided betwee

A circuit module mounting structure and a method for mounting an IC chip in the circuit module applicable to electronic equipment with a slim body. To increase radiation efficiency of the heat emitted from the IC chip, a heat conducting element including a plurality of thin plates is provided between a radiation plate of a heat sink unit and a surface of the IC chip. Further, the plurality of thin plates of the heat conducting element have sufficient flexibility to absorb stresses appearing at coupling portions of the elements due to dimensional tolerances of the elements.

대표청구항 ▼

1. A circuit module structure, comprising:a wiring base board provided with a wiring pattern; an electronic element mounted on the wiring base board; a heat sink unit fixed on the wiring base board for radiating heat emitted from the electronic element, the heat sink unit including a radiation panel

1. A circuit module structure, comprising:a wiring base board provided with a wiring pattern; an electronic element mounted on the wiring base board; a heat sink unit fixed on the wiring base board for radiating heat emitted from the electronic element, the heat sink unit including a radiation panel having a notching portion facing toward the electronic element and having a heat conductivity; and a heat conducting element provided between a surface of the heat sink unit facing the electronic element and a surface of the electronic element, the heat conducting element comprising a plurality of thin plate-like members for transferring heat emitted from the surface of the electronic element to the radiation panel, having a heat conductivity substantially the same as that of the radiation panel and a predetermined flexibility for absorbing stresses generated due to dimensional tolerances of the electronic element, wherein a mounting position of the heat conducting element is determined by the notching portion.