초록 ▼

The invention provides aqueous alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions typically contain (a) one or more metal ion-free bases at sufficien

The invention provides aqueous alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions typically contain (a) one or more metal ion-free bases at sufficient amounts to produce a pH of about 10-13 and one or more bath stabilizing agents having at least one pKa in the range of 10-13 to maintain this pH during use; (b) optionally, about 0.01% to about 5% by weight (expressed as % SiO.sub.2) of a water-soluble metal ion-free silicate; (c) optionally, about 0.01% to about 10% by weight of one or more chelating agents; (d) optionally, about 0.01% to about 80% by weight of one or more water-soluble organic co-solvents; and (e) optionally, about 0.01% to about 1% by weight of a water-soluble surfactant.

대표청구항 ▼

1. A composition for stripping or cleaning integrated circuit substrates, comprising:(a) one or more metal ion-free bases; (b) a water-soluble metal ion-free silicate; (c) one or more chelating agents; and (d) water, wherein the chelating agent is selected from the group consisting of (ethylenedinit

1. A composition for stripping or cleaning integrated circuit substrates, comprising:(a) one or more metal ion-free bases; (b) a water-soluble metal ion-free silicate; (c) one or more chelating agents; and (d) water, wherein the chelating agent is selected from the group consisting of (ethylenedinitrilo)tetraacetic acid, diethylenetriaminepentaacetic acid, triethylenetetraminehexaacetic acid, 1,3-diamino-2-hydroxypropane-N,N,N',N'-tetraacetic acid, N,N,N',N'-ethylenediaminetetra(methylenephosphonic acid), and (1,2-cyclohexyllenedinitrilo)-tetraacetic acid.