초록 ▼

The cooling device of an electronic part including a substrate and first and second electronic elements. The first element (processor) is higher than the second element, and the first element generates more heat than the second element. A cooling device includes a heat conductive plate to which heat

The cooling device of an electronic part including a substrate and first and second electronic elements. The first element (processor) is higher than the second element, and the first element generates more heat than the second element. A cooling device includes a heat conductive plate to which heat is transferred from the first element and radiation fins mounted on the heat conductive plate. The radiation fins extend toward the second element, so that at least part of heat transferred from the first element is radiated in the neighborhood of the second element. Even in the case where the electronic part is arranged in a limited space, the cooling efficiency of the electronic part can be improved by alleviating the difference in heat generation density between the neighborhood of the first element and the neighborhood of the second element.

대표청구항 ▼

1. A cooling device of an electronic part having a substrate, a first heat generating element mounted on said substrate, and a second heat generating element mounted on said substrate and generating less heat than said first heat generating element, a height of said first heat generating element whe

1. A cooling device of an electronic part having a substrate, a first heat generating element mounted on said substrate, and a second heat generating element mounted on said substrate and generating less heat than said first heat generating element, a height of said first heat generating element when mounted on said substrate being greater than a height of said second heat generating element when mounted on said substrate, said cooling device comprising:a heat conductive member covering said first and second heat generating elements, said heat conductive member being thermally coupled to said first heat generating element, said conductive member being spaced apart from said second heat generating element, said heat conductive member having a first surface on the side of said first heat generating element and a second surface on the opposite side of said first heat generating element; and radiation members including a first group of radiation members mounted on said first surface of said heat conductive member and a second group of radiation members mounted on said second surface of said heat conductive member, said first group of radiation members extending in the direction from said first heat generating element toward said second heat generating element, said first group of radiation members being formed in a space between said heat conductive member and said second heat generating element.