[특허]Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same

[미국특허] Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H04R-017/00
출원번호	US-0577342 (2000-05-24)
발명자 / 주소	Flesch Aime FR
출원인 / 주소	Vermon FR
대리인 / 주소	Larson & Taylor, PLC
인용정보	피인용 횟수 : 34 인용 특허 : 24

초록 ▼

This invention is provided a method for making a backing layer for an ultrasonic matrix array transducer useful in diagnostic imaging, non-destructive material testing and treatment of human organs. The method includes placing the grid in a mold, filling the mold with an acoustically absorbent material such that the absorbent material fills the spaces between the contacts, curing the material in the mold so as to form a block formed by the cured absorbent material and the grid, and releasing the block from the mold.

대표청구항 ▼

1. A method for making a stacked, multiple layer backing layer for a transducer array, said method comprising:producing a first backing layer by steps comprising: i) providing a conductive grid comprising a plurality of contacts each having a free end and each being joined together by a common base at an end thereof opposite to said free end so that spaces are provided between the free ends of the contacts; (ii) placing the grid in a mold; (iii) filling the mold with an acoustically absorbent material such that the absorbent material fills said spaces; (iv) curing the material in the mold so as to form a block having a thickness and comprising the cured absorbent material and said grid; (v) releasing the block from the mold; and (vi)removing said common base of the grid in said block so as to separate the contacts from one another within said block and so that the separated contacts extend through the thickness of the block between opposite surfaces thereof, and (vii) processing said block to produce a backing layer having a contact pattern formed by the separated contacts producing a second backing layer having a substantially identical contact pattern to that of said first backing layer by repeating steps (i)-(vii); and, stacking said first and second backing layers so that the separated contacts of the first and second layers are in alignment and provide conductive paths extending through the first and second layers to thereby produce the stacked, multiple layer backing layer.

이 특허에 인용된 특허 (24) 인용/피인용 타임라인 분석

Kunkel ; III Harry A. (State College PA), Acoustic backing with integral conductors for an ultrasonic transducer.
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Miller David G. (Boxford MA) Larson ; III John D. (Palo Alto CA), Backing for acoustic transducer array.
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Gilmore James Michael, Composite transducer with connective backing block.
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Gailus David W., Electroding of ceramic piezoelectric transducers.
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Kalubowila, Prematilaka W.; Wach, Stanislaw P.; Levens, Michael B., Electronic conductor and a method of manufacturing it.
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Lorraine Peter William (Niskayuna NY) Venkataramani Venkat Subramaniam (Clifton Park NY), High density integrated ultrasonic phased array transducer and a method for making.
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Lorraine Peter W. (Niskayuna NY) Smith Lowell S. (Niskayuna NY), High density interconnect for an ultrasonic phased array and method for making.
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Eberle Michael J. ; Finsterwald P. Michael, High resolution intravascular ultrasound transducer assembly having a flexible substrate.
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Glenn William E. (Ft. Lauderdale FL), Matching region for damped piezoelectric ultrasonic apparatus.
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Greenstein Michael (Los Altos CA) Yoshida Henry (San Jose CA), Method for fabricating a Z-axis conductive backing layer for acoustic transducers using etched leadframes.
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Hanafy Amin M. ; Marian Vaughn R., Method for the manufacture of a two dimensional acoustic array.
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Beaman Brain S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Method of forming a three dimensional high performance interconnection package.
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Corbett ; III Scott S. ; Clary Thomas R. ; Yarno John P., Method of producing an ultrasound transducer.
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Takiguchi Yoshimi,JPX ; Egawa Yosuke,JPX ; Watanabe Takayuki,JPX ; Masano Hiroharu,JPX, Porous plastic filter and process for its production.
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De Fraguier Sixte,FRX ; Gelly Jean-Fran.cedilla.ois,FRX ; Bureau Jean-Marc,FRX, Process for manufacturing a multi-element acoustic probe, especially an echograph probe.
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Ekstrom Bernt (Tyringe SEX), Process for production of printed circuit boards and use thereby.
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Gibbons Hugh T. (Louisville CO) Kuester Edward F. (Boulder CO), Pyramidal absorber having multiple backing layers providing improved low frequency response.
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White Timothy E. ; Butler Neal R. ; Hatch Marcus ; Erikson Kenneth R. ; Vock Curtis A. ; Haase Wayne C. ; Martinelli Michael A., Ultrasonic array with attenuating electrical interconnects.
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Lorraine Peter William ; Smith Lowell Scott, Ultrasonic phased array transducer with an ultralow impedance backfill and a method for making.
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Mine Yoshitaka (Ootawara JPX) Hiki Susumu (Ootawara JPX) Hirama Makoto (Ootawara JPX), Ultrasonic probe.
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Gebhardt Wolfgang (Spiesen-Elversberg DEX) Woll Helmut (Dudweiler DEX), Ultrasonic test head.
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Sudol Wojtek (Burlington MA) Gurrie Francis E. (Ipswich MA) Ladd Larry A. (Lawrence MA), Ultrasonic transducer.
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Smith Stephen W. ; Trahey Gregg E. ; Goldberg Richard L. ; Davidsen Richard E., Ultrasound transducer array with transmitter/receiver integrated circuitry.
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Breimesser Fritz (Nrnberg DEX) Gromoll Bernd (Baiersdorf DEX) Heindel Hans-Peter (Frth DEX) Sachs Bertram (Erlangen DEX), Ultrasound transducer device with a one-dimensional or two-dimensional array of transducer elements.
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이 특허를 인용한 특허 (34) 인용/피인용 타임라인 분석

Bhardwaj,Mahesh C., Anisotropic acoustic impedance matching material.
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Chapelon,Pierre Antoine; Berube,Dany; Nguyen,Hiep; Kallel,Faouzi, Apparatus and method for assessing transmurality of a tissue ablation.
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Fischer, Walter; Muhrer, Volker; Pfeiffer, Karl-Friedrich; Roth, Manfred, Attenuating mass for an ultrasonic sensor, use of epoxy resin.
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Woodard,Robert E.; Nguyen,Hiep; Berube,Dany, Catheter having improved steering.
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Sadaka, Alain; Yuan, Jian R., Composite passive materials for ultrasound transducers.
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Appleby,Michael; Fraser,Iain; Atkinson,James E., Devices, methods, and systems involving castings.
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Appleby,Michael; Fraser,Iain; Atkinson,James E., Devices, methods, and systems involving castings.
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Frey,Gregg W.; Sheljaskow,Todor; Wilser,Walt T.; Walters,Worth B.; Oliver,Nelson H., Electrically conductive matching layers and methods.
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Gerlach, Andre; Bartylla, David, Electroacoustic transducer.
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Schlenke,David T., Method and device for ensuring trandsducer bond line thickness.
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Guo, Xiacong, Method for manufacturing an ultrasound imaging transducer assembly.
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Guo, Xiaocong, Method for manufacturing an ultrasound imaging transducer assembly.
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Yoshida, Satoshi; Imahashi, Takuya, Method for manufacturing ultrasound transducer.
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Gelly, Jean Francois; Mills, David Martin; Lanteri, Frederic; Baumgartner, Charles Edward; Calisti, Serge Gerard, Method for optimized dematching layer assembly in an ultrasound transducer.
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Chin,Sing Fatt; Berube,Dany; Mody,Dinesh I.; Norris,Nancy, Method of positioning a medical instrument.
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Appleby, Michael P.; Fraser, Iain; Atkinson, James E., Methods for manufacturing three-dimensional devices and devices created thereby.
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Appleby, Michael P.; Fraser, Iain; Atkinson, James E., Methods for manufacturing three-dimensional devices and devices created thereby.
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Appleby, Michael P.; Fraser, Iain; Atkinson, James E., Methods for manufacturing three-dimensional devices and devices created thereby.
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Appleby,Michael P.; Fraser,Iain; Atkinson,James E., Methods for manufacturing three-dimensional devices and devices created thereby.
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Berube,Dany, Monopole tip for ablation catheter.
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Wu, Zhi-Jiang; Su, Yong-Ze, Silicon based capacitive microphone.
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Mody,Dinesh; Berube,Dany; Morin,Patrick; Chin,Sing Fatt, Surgical microwave ablation assembly.
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Appleby, Michael P.; Randolph, William T.; Klinger, Jill E., Systems for large area micro mechanical systems.
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Appleby, Michael P.; Fraser, Iain; Paulus, John, Systems, devices, and/or methods for manufacturing castings.
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Appleby, Michael; Fraser, Iain; Paulus, John, Systems, devices, and/or methods for manufacturing castings.
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Appleby, Michael; Paulus, John; Fraser, Iain; Klinger, Jill; Heneveld, Benjamin, Systems, devices, and/or methods for producing holes.
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Kent, Lionel William John; Bagshaw, John Martin; Rowe, Duncan Peter, Transducer arrangement.
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Sako, Akifumi; Takenaka, Tomoko; Ishida, Kazunari, Ultasound probe providing dual backing layer.
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Hu, Zhiqiang, Ultrasonic probe and ultrasonic diagnosis apparatus.
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Sakai, Hironori, Ultrasonic transducer.
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Mauchamp, Pascal; Auclair, Philippe; Flesch, Aimé, Ultrasonic transducer apparatus.
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Dunhill,Anthony K, Ultrasonic transducer structures.
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Zipparo,Michael J.; Johnson,Monica P., Ultrasound probe.
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Wildes,Douglas Glenn; Baumgartner,Charles Edward; Moeleker,Petrus Joannes Joseph; Haider,Bruno Hans, Ultrasound transducer with enhanced thermal conductivity.
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연합인증

[미국특허] Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same 원문보기

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[미국특허] Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same 원문보기

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이 특허에 인용된 특허 (24) 인용/피인용 타임라인 분석

이 특허를 인용한 특허 (34) 인용/피인용 타임라인 분석

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