$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

[미국특허] Electrical contactor especially wafer level contactor using fluid pressure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-004/60
출원번호 US-0376759 (1999-08-17)
발명자 / 주소
  • Benjamin N. Eldridge
출원인 / 주소
  • FormFactor, Inc.
대리인 / 주소
    N. Kenneth Burraston
인용정보 피인용 횟수 : 96  인용 특허 : 26

초록 ▼

An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to the flexible wiring layer. Th

대표청구항 ▼

1. An interconnect assembly comprising:a flexible substrate including a plurality of first electrical contacts, a semiconductor device disposed in proximity to said flexible substrate and having a plurality of second electrical contacts, a fluid chamber, and a pump in fluid communication with said f

이 특허에 인용된 특허 (26) 인용/피인용 타임라인 분석

  1. D\Souza Daniel B. (Santa Clara County CA), Active probe card.
    상세보기
  2. Cherry Robert S. (Redondo Beach CA), Active probe card for high resolution/low noise wafer level testing.
    상세보기
  3. Littlebury Hugh W. (Chandler AZ) Simmons Marion I. (Tempe AZ), Apparatus and method for burning in integrated circuit wafers.
    상세보기
  4. Okubo Masao (Tokyo JPX) Yoshimitsu Yasuro (Tokyo JPX), Complex probe card for testing a semiconductor wafer.
    상세보기
  5. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L. ; Dozier Thomas H. ; Smith William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
    상세보기
  6. Mendenhall David W. (Greenville RI) Goff Jay T. (Cranston RI), Flex dot wafer probe.
    상세보기
  7. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.
    상세보기
  8. Leedy Glenn J. (1061 E. Mountain Dr. Santa Barbara CA 93108), Flexible tester surface for testing integrated circuits.
    상세보기
  9. Knight Alan D. (Newark Valley NY) Petrozello James R. (Endicott NY), Fluid pressure actuated electrical connector.
    상세보기
  10. Ardezzone Frank J. (Santa Clara CA), High density probe-head with isolated and shielded transmission lines.
    상세보기
  11. Kwon On-Kyong (Plano TX) Hashimoto Masashi (Garland TX) Malhi Satwinder (Garland TX), High performance test head and method of making.
    상세보기
  12. Lee Shaw Wei (10410 Miller Ave. Cupertino CA 95014), Known good die test apparatus and method.
    상세보기
  13. Crumly William R. (Anaheim CA), Membrane connector with stretch induced micro scrub.
    상세보기
  14. Lum Thomas F. (Austin TX) Wenzel James F. (Austin TX), Method for probing a semiconductor wafer.
    상세보기
  15. Leedy Glenn J. (1061 E. Mountain Dr. Santa Barbara CA 93108), Method of making a flexible tester surface for testing integrated circuits.
    상세보기
  16. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
    상세보기
  17. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of testing semiconductor.
    상세보기
  18. Swapp Mavin (Mesa AZ), Micromachined semiconductor probe card.
    상세보기
  19. Driller Hubert (Schmitten DEX) Mang Paul (Schmitten DEX), Printed circuit board testing device with foil adapter.
    상세보기
  20. Higgins H. Dan ; Pandey Rajiv ; Armendariz Norman J. ; Bates R. Dennis, Probe card assembly for high density integrated circuits.
    상세보기
  21. Okubo Kazumasa (Kanagawa JPX) Okubo Masao (Nishinomiya JPX) Yoshimitsu Yasuro (Takatsuki JPX) Sugaya Kiyoshi (Amagasaki JPX), Probe card in which contact pressure and relative position of each probe end are correctly maintained.
    상세보기
  22. Sano Kunio (Nakakoma-gun JPX), Probe device.
    상세보기
  23. Thompson Patrick F. ; Williams William M. ; Lindsey Scott E. ; Vasquez Barbara, Semiconductor wafer contact system and method for contacting a semiconductor wafer.
    상세보기
  24. James Marc Leas ; Robert William Koss ; Jody John Van Horn ; George Frederick Walker ; Charles Hampton Perry ; David Lewis Gardell ; Steve Leo Dingle ; Ronald Prilik, Semiconductor wafer test and burn-in.
    상세보기
  25. Brown Candice H. (San Jose CA), Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts.
    상세보기
  26. Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.
    상세보기

이 특허를 인용한 특허 (96) 인용/피인용 타임라인 분석

  1. Strid, Eric; Gleason, K. Reed, Active wafer probe.
    상세보기
  2. Strid,Eric; Gleason,K. Reed, Active wafer probe.
    상세보기
  3. Rashidzadeh, Rashid; Ahmadi, Majid; Kandalaft, Nabeeh, Apparatus for the automated testing and validation of electronic components.
    상세보기
  4. Hanke,Andr챕; Dobritz,Stephan, Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection.
    상세보기
  5. Kellar,Scot A.; Kim,Sarah E.; List,R. Scott, Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack.
    상세보기
  6. Strid, Eric; Campbell, Richard, Calibration structures for differential signal probing.
    상세보기
  7. Rumiantsev, Andrej; Kanev, Stojan; Schott, Steffen; Stoll, Karsten, Chuck for supporting and retaining a test substrate and a calibration substrate.
    상세보기
  8. Rumiantsev, Andrej; Kanev, Stojan; Scott, Steffen; Stoll, Karsten, Chuck for supporting and retaining a test substrate and a calibration substrate.
    상세보기
  9. Kellar, Scot A.; Kim, Sarah E.; List, R. Scott, Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same.
    상세보기
  10. Campbell, Richard; Strid, Eric W.; Andrews, Mike, Differential signal probe with integral balun.
    상세보기
  11. Strid, Eric; Campbell, Richard, Differential signal probing system.
    상세보기
  12. Campbell, Richard L.; Andrews, Michael, Differential waveguide probe.
    상세보기
  13. Burcham, Terry; McCann, Peter; Jones, Rod, Double sided probing structures.
    상세보기
  14. Burcham,Terry; McCann,Peter; Jones,Rod, Double sided probing structures.
    상세보기
  15. Eldridge, Benjamin N., Electrical contactor, especially wafer level contactor, using fluid pressure.
    상세보기
  16. Eldridge, Benjamin N., Electrical contactor, especially wafer level contactor, using fluid pressure.
    상세보기
  17. Eldridge,Benjamin N., Electrical contactor, especially wafer level contactor, using fluid pressure.
    상세보기
  18. Eldridge,Benjamin N., Electrical contactor, especially wafer level contactor, using fluid pressure.
    상세보기
  19. Miller, Charles A., Electronic package with direct cooling of active electronic components.
    상세보기
  20. Miller,Charles A, Electronic package with direct cooling of active electronic components.
    상세보기
  21. Miller,Charles A., Electronic package with direct cooling of active electronic components.
    상세보기
  22. Cheng, Chun-Wen; Peng, Jung-Huei; Liu, Yi-Shao; Lai, Fei-Lung; Tsai, Shang-Ying, Fluid deposition appartus and method.
    상세보기
  23. Lou, Choon Leong; Wang, Li Min, Integrated circuit probing apparatus having a temperature-adjusting mechanism.
    상세보기
  24. Lou, Choon Leong; Wang, Li Min, Integrated circuit probing apparatus having a temperature-adjusting mechanism.
    상세보기
  25. Hanke,Andr？; Dobritz,Stephan, Interconnection element for BGA housings and method for producing the same.
    상세보기
  26. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.
    상세보기
  27. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.
    상세보기
  28. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.
    상세보기
  29. Schwindt,Randy J., Low-current probe card.
    상세보기
  30. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
    상세보기
  31. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
    상세보기
  32. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing structure with laterally scrubbing contacts.
    상세보기
  33. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.
    상세보기
  34. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
    상세보기
  35. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
    상세보기
  36. Smith,Kenneth; Gleason,Reed, Membrane probing system.
    상세보기
  37. Smith,Kenneth; Gleason,Reed, Membrane probing system.
    상세보기
  38. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
    상세보기
  39. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
    상세보기
  40. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
    상세보기
  41. Gleason,K. Reed; Smith,Kenneth R.; Bayne,Mike, Membrane probing system with local contact scrub.
    상세보기
  42. van de Beek, Carel; Kreissig, Stefan; Hansel, Volker; Giessmann, Sebastian; Werner, Frank-Michael; Dietrich, Claus; Kiesewetter, Jorg, Method and apparatus for controlling the temperature of electronic components.
    상세보기
  43. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth, Method for constructing a membrane probe using a depression.
    상세보기
  44. Hayden, Leonard; Martin, John; Andrews, Mike, Method of assembling a wafer probe.
    상세보기
  45. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method of constructing a membrane probe.
    상세보기
  46. Smith, Kenneth R., Method of replacing an existing contact of a wafer probing assembly.
    상세보기
  47. Fredericksen, Ross Thomas; Gilliland, Don Alan, Method of using bonding pad as a gasket for electronic subassemblies.
    상세보기
  48. Staines,David; Kloster,Grant M.; Ramanathan,Shriram, Method to fill the gap between coupled wafers.
    상세보기
  49. Strid,Eric; Campbell,Richard, On-wafer test structures for differential signals.
    상세보기
  50. Tervo,Paul A.; Cowan,Clarence E., POGO probe card for low current measurements.
    상세보기
  51. Yano, Kazuya; Hayashi, Eiji; Nagasaka, Munetoshi, Probe apparatus and wafer mounting table for probe apparatus.
    상세보기
  52. Miller, Charles A., Probe card cooling assembly with direct cooling of active electronic components.
    상세보기
  53. Miller, Charles A., Probe card cooling assembly with direct cooling of active electronic components.
    상세보기
  54. Miller, Charles A., Probe card cooling assembly with direct cooling of active electronic components.
    상세보기
  55. Tatematsu,Tsutomu; Togashi,Kenji; Nanbu,Tetsuhiro; Ishihara,Shigenobu; Hamada,Morihiko; Arisaka,Yoshikazu; Itagaki,Kunihiro; Aoki,Shigekazu, Probe card, having cantilever-type probe and method.
    상세보기
  56. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
    상세보기
  57. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
    상세보기
  58. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
    상세보기
  59. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
    상세보기
  60. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
    상세보기
  61. Campbell,Richard L.; Andrews,Michael; Bui,Lynh, Probe for high frequency signals.
    상세보기
  62. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Probe for testing a device under test.
    상세보기
  63. Smith, Kenneth; Jolley, Michael; Van Syckel, Victoria, Probe head having a membrane suspended probe.
    상세보기
  64. Smith,Kenneth; Jolley,Michael; Van Syckel,Victoria, Probe head having a membrane suspended probe.
    상세보기
  65. Schwindt,Randy, Probe holder for testing of a test device.
    상세보기
  66. Smith, Kenneth R.; Hayward, Roger, Probing apparatus with impedance optimized interface.
    상세보기
  67. Kim,Sarah E.; List,R. Scott; Kellar,Scot A., Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices.
    상세보기
  68. Smith, Kenneth R., Replaceable coupon for a probing apparatus.
    상세보기
  69. Lou, Choon Leong, Semiconductor devices testing apparatus with temperature-adjusting design.
    상세보기
  70. Yamaguchi, Naoko; Tanida, Kazumasa; Numata, Hideo; Hongo, Satoshi; Takahashi, Kenji, Semiconductor manufacturing apparatus and semiconductor manufacturing method.
    상세보기
  71. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for high-frequency testing of a device under test.
    상세보기
  72. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Shielded probe for testing a device under test.
    상세보기
  73. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
    상세보기
  74. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
    상세보기
  75. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
    상세보기
  76. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
    상세보기
  77. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
    상세보기
  78. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
    상세보기
  79. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe with low contact resistance for testing a device under test.
    상세보기
  80. Andrews, Peter; Hess, David, System for testing semiconductors.
    상세보기
  81. Budraa, Nasser K., Systems and methods for bonding using microwave energy.
    상세보기
  82. Ando, Masakazu; Takahashi, Hiroyuki; Yamashita, Tsuyoshi; Hashimoto, Takashi, Temperature control device and temperature control method.
    상세보기
  83. Ataka, Tsuyoshi; Ono, Atsushi, Test apparatus, circuit module and manufacturing method.
    상세보기
  84. Scocchetti, Fabrizio, Test of electronic devices at package level using test boards without sockets.
    상세보기
  85. Campbell, Richard, Test structure and probe for differential signals.
    상세보기
  86. Campbell,Richard, Test structure and probe for differential signals.
    상세보기
  87. Di Lello, Stefano, Testing integrated circuits on a wafer using a cartridge with pneumatic locking of the wafer on a probe card.
    상세보기
  88. Kellar, Scot A.; Kim, Sarah E.; List, R. Scott, Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof.
    상세보기
  89. Kellar,Scot A.; Kim,Sarah E.; List,R. Scott, Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration.
    상세보기
  90. Eldridge, Benjamin N.; Reynolds, Carl V., Wafer level interposer.
    상세보기
  91. Eldridge,Benjamin N.; Reynolds,Carl V., Wafer level interposer.
    상세보기
  92. Hayden, Leonard; Martin, John; Andrews, Mike, Wafer probe.
    상세보기
  93. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
    상세보기
  94. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
    상세보기
  95. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
    상세보기
  96. Campbell, Richard, Wideband active-passive differential signal probe.
    상세보기

활용도 분석정보

상세보기
다운로드
내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

관련 콘텐츠

저작권 관리 안내
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로