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Method and apparatus for laser ablation of a target material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/46
  • H01L-021/78
  • H01L-021/301
출원번호 US-0385676 (1999-08-27)
발명자 / 주소
  • James H Morris
  • Michael Powers
  • Harry Rieger
출원인 / 주소
  • JMAR Research, Inc.
대리인 / 주소
    Baker & McKenzie
인용정보 피인용 횟수 : 88  인용 특허 : 18

초록

A method and apparatus for laser cutting a target material is disclosed. The method includes the steps of generating laser pulses from a laser system and applying the laser pulses to the target material so that the laser pulses cut through the material. The laser pulses have an approximately ellipse

대표청구항

1. A method for laser cutting a target material comprising:generating laser pulses from a laser system-the laser pulses having a spot shape-the spot shape having a major axis and a minor axis, the major axis being substantially longer than the minor axis; and applying the laser pulses in a cutting d

이 특허에 인용된 특허 (18)

  1. Schueller Randolph D., Chip scale ball grid array for integrated circuit packaging.
  2. Neiheisel Gary L., Descaling metal with a laser having a very short pulse width and high average power.
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  6. Unternahrer Josef Robert, Laser shock peening method and reflective laser beam homogenizer.
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  35. Troitski, Igor, Laser-dynamic system for using in games.
  36. Grzybowski, Richard Robert; Pambianchi, Michael S; Streltsov, Alexander Mikhailovich, Light-weight strengthened, low-emittance vacuum insulated glass (VIG) windows.
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  38. Liang, Jiuh-Ming, Localized heat treatment of battery component films.
  39. Ehrmann,Jonathan S.; Cordingley,James J.; Smart,Donald V.; Svetkoff,Donald J., Method and apparatus for laser marking by ablation.
  40. Zhang, Haibin; Shan, Fang; Rekow, Mathew; Zhang, Min; Simenson, Glenn; Xu, Qian; Brookhyser, James; Frankel, Joe; Darwin, Michael; Rundel, Jack; Pysher, Matthew, Method and apparatus for separation of workpieces and articles produced thereby.
  41. Agarwal,Vishnu K.; Stanton,William A., Method and apparatus to increase throughput of processing using pulsed radiation sources.
  42. Couch, Bruce L.; Erhmann, Jonathan S.; Chu, Yun Fee; Lento, Joseph V.; Johnson, Shepard D., Method and system for high-speed, precise micromachining an array of devices.
  43. Ehrmann, Jonathan S.; Cordingley, James J.; Smart, Donald V.; Svetkoff, Donald J., Method and system for processing one or more microstructures of a multi-material device.
  44. Sun, Yunlong; Swenson, Edward J.; Harris, Richard S., Method for processing a memory link with a set of at least two laser pulses.
  45. Furui,Toshikazu; Matsushita,Naohisa, Method of cutting laminate with laser and laminate.
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  48. Mulloy, Michael; Scott, Graeme, Method of forming substrate for fluid ejection device.
  49. Tanaka,Koichiro, Method of manufacturing semiconductor device.
  50. Bovatsek, James; Arai, Alan Y.; Yoshino, Fumiyo, Methods and systems for laser welding transparent materials with an ultrashort pulsed laser.
  51. Cordingley, James J.; Griffiths, Joseph J.; Smart, Donald V., Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure.
  52. Cordingley,James J.; Griffiths,Joseph J.; Smart,Donald V., Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure.
  53. Cordingley,James J.; Dowd,Roger D.; Ehrmann,Jonathan S.; Griffiths,Joseph J.; Lee,Joohan; Smart,Donald V.; Svetkoff,Donald J., Methods and systems for processing a device, methods and systems for modeling same and the device.
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  55. Cordingley, James J.; Ehrmann, Jonathan S.; Filgas, David M.; Johnson, Shepard D.; Lee, Joohan; Smart, Donald V.; Svetkoff, Donald J., Methods and systems for thermal-based laser processing a multi-material device.
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  59. Masters, Leonard Thomas; Streltsov, Alexander Mikhailovich, Methods for controlled laser-induced growth of glass bumps on glass articles.
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  64. Sun,Yunlong; Swenson,Edward J.; Harris,Richard S., Processing a memory link with a set of at least two laser pulses.
  65. Cali, Douglas S.; Myers, Keith E., Prosthetic heart valve assemblies.
  66. Li, Jianchao; Nieh, Kai-Wei; Makhar, Sandeep, Pulsed laser cutting of thin film battery.
  67. Shih, Tung-Hsiu; Nieh, Kai Wei; Krasnov, Victor, Pulsed mode apparatus with mismatched battery.
  68. Bloom,Scott H.; Rieger,Harry; Alwan,James J., Rotating shutter for laser-produced plasma debris mitigation.
  69. Lappalainen, Reijo; Myllymäki, Vesa; Pulli, Lasse; Ruuttu, Jari; Mäkitalo, Juha, Semiconductor and an arrangement and a method for producing a semiconductor.
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  73. Sercel, Patrick J.; Sercel, Jeffrey P.; Park, Jongkook, System and method for cutting using a variable astigmatic focal beam spot.
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  77. Liang, Jiuh-Ming; Nieh, Kai Wei, Thin film battery packaging formed by localized heating.
  78. Krasnov, Victor; Nieh, Kai-Wei, Thin film battery with electrical connector connecting battery cells.
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