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[미국특허] CVD ruthenium seed for CVD ruthenium deposition 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/40
출원번호 US-0827878 (2001-04-05)
발명자 / 주소
  • Xiaoliang Jin
  • Christopher P. Wade
  • Xianzhi Tao
  • Elaine Pao
  • Yaxin Wang
  • Jun Zhao
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Adler & Associates
인용정보 피인용 횟수 : 30  인용 특허 : 5

초록

The present invention provides a method of forming a ruthenium seed layer on a substrate comprising the steps of introducing a ruthenium-containing compound into a CVD apparatus; introducing oxygen into the CVD apparatus; maintaining an oxygen rich environment in the process chamber for the initial

대표청구항

1. A method of forming a ruthenium seed layer on a substrate comprising the steps of:(a) vaporizing a ruthenium-containing compound; (b) introducing the vaporized ruthenium-containing compound into a CVD apparatus; (c) introducing oxygen into the CVD apparatus to form an oxygen rich environment; whe

이 특허에 인용된 특허 (5) 인용/피인용 타임라인 분석

  1. Kang Chang-seok,KRX, Fabricating method of making a fin shaped capacitor.
  2. Eguchi Kazuhiro (Yokohama JPX) Kiyotoshi Masahiro (Sagamihara JPX) Imai Keitaro (Kawasaki JPX), Method of manufacturing a perovskite thin film dielectric.
  3. Vaartstra Brian A., Precursor chemistries for chemical vapor deposition of ruthenium and ruthenium oxide.
  4. Ueda Michihito,JPX ; Ohtsuka Takashi,JPX, Semiconductor memory device and method for fabricating the same.
  5. Chapple-Sokol Jonathan D. (Poughkeepsie NY) Conti Richard A. (Mt. Kisco NY) Gambino Jeffrey P. (Gaylordsville CT), Storage capacitor with a conducting oxide electrode for metal-oxide dielectrics.

이 특허를 인용한 특허 (30) 인용/피인용 타임라인 분석

  1. Hendrix, Bryan C.; Chen, Philip S. H.; Li, Weimin; Jang, Woosung; Guo, Dingkai, ALD processes for low leakage current and low equivalent oxide thickness BiTaO films.
  2. Ma, Paul; Shah, Kavita; Wu, Dien-Yeh; Ganguli, Seshadri; Marcadal, Christophe; Wu, Frederick C.; Chu, Schubert S., Apparatus and process for plasma-enhanced atomic layer deposition.
  3. Ma, Paul; Shah, Kavita; Wu, Dien-Yeh; Ganguli, Seshadri; Marcadal, Christophe; Wu, Frederick C.; Chu, Schubert S., Apparatus and process for plasma-enhanced atomic layer deposition.
  4. Ma, Paul; Shah, Kavita; Wu, Dien-Yeh; Ganguli, Seshadri; Marcadal, Christophe; Wu, Frederick C.; Chu, Schubert S., Apparatus and process for plasma-enhanced atomic layer deposition.
  5. Hendrix, Bryan C.; Welch, James J.; Bilodeau, Steven M.; Roeder, Jeffrey F.; Xu, Chongying; Baum, Thomas H., Chemical vapor deposition of high conductivity, adherent thin films of ruthenium.
  6. Hendrix, Bryan C.; Welch, James J.; Bilodeau, Steven M.; Roeder, Jeffrey F.; Xu, Chongying; Baum, Thomas H., Chemical vapor deposition of high conductivity, adherent thin films of ruthenium.
  7. Hendrix,Bryan C.; Welch,James J.; Bilodeau,Steven M.; Roeder,Jeffrey F.; Xu,Chongying; Baum,Thomas H., Chemical vapor deposition of high conductivity, adherent thin films of ruthenium.
  8. Xu, Chongying; Li, Weimin; Cameron, Thomas M., In situ generation of RuO4 for ALD of Ru and Ru related materials.
  9. Lubguban, Jr., Jorge A.; Cameron, Thomas M.; Xu, Chongying; Li, Weimin, Method and composition for depositing ruthenium with assistive metal species.
  10. Yang,Sam, Method for forming a ruthenium metal layer.
  11. Yang, Sam, Method for forming a ruthenium metal layer and a structure comprising the ruthenium metal layer.
  12. Park, Kyung Woong; Choi, Jung Hwan; Han, Young Ki, Method of forming ruthenium thin film using plasma enhanced process.
  13. Park,Soon Yeon; Yoo,Cha Young; Won,Seok Jun, Method of forming thin ruthenium-containing layer.
  14. Chu, Schubert S.; Wu, Frederick C.; Marcadal, Christophe; Ganguli, Seshadri; Wu, Dien-Yeh; Shah, Kavita; Ma, Paul, Method of recovering valuable material from exhaust gas stream of a reaction chamber.
  15. Xia, Bin; Misra, Ashutosh, Methods for forming a ruthenium-based film on a substrate.
  16. Won, Seok-jun; Yoo, Cha-young; Kim, Sung-tae; Park, Young-wook; Lee, Yun-jung; Park, Soon-yeon, Methods of chemical vapor depositing ruthenium by varying chemical vapor deposition parameters.
  17. Won, Seok-jun; Yoo, Cha-young, Methods of forming ruthenium film by changing process conditions during chemical vapor deposition and ruthenium films formed thereby.
  18. Won,Seok jun; Yoo,Cha young, Methods of forming ruthenium film by changing process conditions during chemical vapor deposition and ruthenium films formed thereby.
  19. Chang, Mei; Chen, Ling, Noble metal layer formation for copper film deposition.
  20. Chang,Mei; Chen,Ling, Noble metal layer formation for copper film deposition.
  21. Xu, Chongying; Chen, Tianniu; Cameron, Thomas M.; Roeder, Jeffrey F.; Baum, Thomas H., Precursor compositions for atomic layer deposition and chemical vapor deposition of titanate, lanthanate, and tantalate dielectric films.
  22. Chung,Hua; Ganguli,Seshadri; Marcadal,Christophe; Yu,Jick M., Reduction of copper dewetting by transition metal deposition.
  23. Gandikota,Srinivas; Moorthy,Madhu; Khandelwal,Amit; Gelatos,Avgerinos V.; Chang,Mei; Shah,Kavita; Ganguli,Seshadri, Ruthenium as an underlayer for tungsten film deposition.
  24. Wang, Zheng; Wang, Connie; Wilson, Erik; Yu, Wen; Chiu, Robert, Ruthenium interconnect with high aspect ratio and method of fabrication thereof.
  25. Chang,Mei; Ganguli,Seshadri; Maity,Nirmalya, Ruthenium layer formation for copper film deposition.
  26. Gandikota, Srinivas; Moorthy, Madhu; Khandelwal, Amit; Gelatos, Avgerinos V.; Chang, Mei; Shah, Kavita; Ganguli, Seshadri, Ruthenium or cobalt as an underlayer for tungsten film deposition.
  27. Felthouse, Timothy R.; Bino, Abraham, Ruthenium oxide catalysts for conversion of sulfur dioxide to sulfur trioxide.
  28. Lyons, Karen Swider; Rolison, Debra Rose, Selective deposition of hydrous ruthenium oxide thin films.
  29. Cameron, Thomas M.; DiMeo, Susan V.; Hendrix, Bryan C.; Li, Weimin, Silylene compositions and methods of use thereof.
  30. Gatineau, Julien; Dussarrat, Christian, Use of ruthenium tetroxide as a precursor and reactant for thin film depositions.

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