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[미국특허] Probe card for probing wafers with raised contact elements 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-031/26
출원번호 US-0204740 (1998-12-02)
발명자 / 주소
  • Benjamin N. Eldridge
  • Gary W. Grube
  • Gaetan L. Mathieu
출원인 / 주소
  • Formfactor, Inc.
인용정보 피인용 횟수 : 72  인용 특허 : 41

초록 ▼

A probe card is provided for contacting an electric componet with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact element

대표청구항 ▼

1. A probe card assembly for contacting a semiconductor device, the probe card assembly comprising:a probe card having interposer-contacting terminals disposed on a surface thereof; an interposer with opposing surfaces, having opposing pairs of contact structures extending from the opposing surfaces

이 특허에 인용된 특허 (41) 인용/피인용 타임라인 분석

  1. Small Gary L. (Los Gatos CA), Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations.
    상세보기
  2. Driller Hubert (Schmitten DEX) Mang Paul (Schmitten DEX), Adapter arrangement for electrically connecting flat wire carriers.
    상세보기
  3. Ott Albert,DEX ; Tamm Wilhelm,DEX ; Laur Steffen,DEX ; Harr Volker,DEX, Adapter arrangement for electrically testing printed circuit boards.
    상세보기
  4. Ott Rainer,DEX, Adapter system for component assembly circuit boards, for use in a test device.
    상세보기
  5. Pivnichny John R. ; Underwood Joseph H., Apparatus and method for testing integrated circuit components of a multi-component card.
    상세보기
  6. Malladi Deviprasad (Campbell CA) Hanson Lee Frederick (Cupertino CA) Kahahane Jean (Redwood City CA), Apparatus for testing flip chip or wire bond integrated circuits.
    상세보기
  7. Buol Douglas A. (Dallas TX) Mize Dean N. (Garland TX) Pattschull John W. (Garland TX) Wallace Robert M. (Dallas TX), Apparatus for testing integrated circuits.
    상세보기
  8. Pasiecznik ; Jr. John (Malibu CA), Apparatus for testing integrated circuits.
    상세보기
  9. Yojima Masayuki,JPX ; Tsujide Tohru,JPX ; Nakaizumi Kazuo,JPX, Apparatus for testing semiconductor wafer.
    상세보기
  10. Takahashi Tadashi,JPX, Circuit board inspection apparatus and method.
    상세보기
  11. Kwon Oh-Kyong (Richardson TX) Malhi Satwinder (Garland TX) Hashimoto Masahi (Garland TX), Compliant contact pad.
    상세보기
  12. Khandros Igor Y. ; Mathieu Gaetan L., Composite interconnection element for microelectronic components, and method of making same.
    상세보기
  13. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L. ; Dozier Thomas H. ; Smith William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
    상세보기
  14. Pih David, High density test connector for disk drives in a high volume manufacturing environment.
    상세보기
  15. Martel Anthony Paul ; McQuade Francis T., Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment.
    상세보기
  16. Khandros Igor Y. ; Pedersen David V. ; Eldridge Benjamin N. ; Roy Richard S. ; Mathieu Gaetan, Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device.
    상세보기
  17. Kasukabe Susumu (Yokohama JPX) Takagi Ryuichi (Tokyo JPX), Manufacturing method of a probe head for semiconductor LSI inspection apparatus.
    상세보기
  18. O'Connell Richard W., Method and apparatus for testing a semiconductor wafer.
    상세보기
  19. Hogl Erik ; Fiedler Ulrich, Method and system for synchronizing multiple subsystems using one voltage-controlled oscillator.
    상세보기
  20. Palagonia Anthony Michael, Method for forming an interposer for making temporary contact with pads of a semiconductor chip.
    상세보기
  21. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Method of fabricating an interconnection element.
    상세보기
  22. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.
    상세보기
  23. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.
    상세보기
  24. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
    상세보기
  25. Akram Salman ; Farnworth Warren M. ; Wood Alan G. ; Hembree David R., Method, apparatus and system for testing bumped semiconductor components.
    상세보기
  26. Maddix John Thomas ; Palagonia Anthony Michael ; Pikna Paul Joseph ; Vallett David Paul, Micro probe ring assembly and method of fabrication.
    상세보기
  27. Sugihara Osamu (Nagasaka JPX), Microprobe provided circuit substrate and method for producing the same.
    상세보기
  28. Carney Eric Lane, Planarity verification system for integrated circuit test probes.
    상세보기
  29. Higgins H. Dan ; Pandey Rajiv ; Armendariz Norman J. ; Bates R. Dennis, Probe card assembly for high density integrated circuits.
    상세보기
  30. Trenary Dale T. (San Jose CA), Probe card for integrated circuit chip.
    상세보기
  31. Liu Jui-Hsiang (Chandler AZ) Olsen Dennis R. (Scottsdale AZ), Probe card for testing unencapsulated semiconductor devices.
    상세보기
  32. Mizuta Masaharu,JPX, Probe card with vertical needle for enabling improved wafer testing and method of manufacturing the same.
    상세보기
  33. Nakano Shoukichi (Kawasaki JPX), Prober for semiconductor integrated circuit element wafer.
    상세보기
  34. Hembree David R. ; Akram Salman, Semiconductor probe card having resistance measuring circuitry and method fabrication.
    상세보기
  35. Schmid Rainer,DEX ; Giringer Klaus,DEX ; Gauss Ulrich,DEX ; Deusch Heinz,DEX, Test head for microstructures with interface.
    상세보기
  36. Barrett Keith E., Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods.
    상세보기
  37. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.
    상세보기
  38. Barabi Nasser, Test socket for an IC device.
    상세보기
  39. Nishikawa Hideo,JPX ; Miki Takashi,JPX, Universal printed circuit board inspection apparatus, and method of using same.
    상세보기
  40. Mizuta Masaharu,JPX, Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card.
    상세보기
  41. Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.
    상세보기

이 특허를 인용한 특허 (72) 인용/피인용 타임라인 분석

  1. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.
    상세보기
  2. Chen, Richard T.; Kruglick, Ezekiel J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.
    상세보기
  3. Chen,Richard T.; Kruglick,Ezekiel J. J.; Bang,Christopher A.; Smalley,Dennis R.; Lembrikov,Pavel B., Cantilever microprobes for contacting electronic components and methods for making such probes.
    상세보기
  4. Karavakis,Konstantine N.; Nguyen,Tom T., Connecting a probe card and an interposer using a compliant connector.
    상세보기
  5. Mok, Sammy; Chong, Fu Chiung; Swiatowiec, Frank John; Lahiri, Syamal Kumar; Haemer, Joseph Michael, Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs.
    상세보기
  6. Eldridge, Benjamin N., Electrical contactor, especially wafer level contactor, using fluid pressure.
    상세보기
  7. Eldridge, Benjamin N., Electrical contactor, especially wafer level contactor, using fluid pressure.
    상세보기
  8. Eldridge,Benjamin N., Electrical contactor, especially wafer level contactor, using fluid pressure.
    상세보기
  9. Eldridge,Benjamin N., Electrical contactor, especially wafer level contactor, using fluid pressure.
    상세보기
  10. Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Electrochemical fabrication process for forming multilayer multimaterial microprobe structures.
    상세보기
  11. Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Electrochemical fabrication process for forming multilayer multimaterial microprobe structures.
    상세보기
  12. Arat,Vacit; Cohen,Adam L.; Smalley,Dennis R.; Kruglick,Ezekiel J. J.; Chen,Richard T.; Kim,Kieun, Electrochemically fabricated microprobes.
    상세보기
  13. Haemer,Joseph Michael; Chong,Fu Chiung; Modlin,Douglas N., Enhanced compliant probe card systems having improved planarity.
    상세보기
  14. Cohen, Adam L.; Arat, Vacit; Lockard, Michael S.; Bang, Christopher A.; Lembrikov, Pavel B., Fabrication process for co-fabricating multilayer probe array and a space transformer.
    상세보기
  15. Bottoms, Wilmer R.; Chong, Fu Chiung; Mok, Sammy; Modlin, Douglas, High density interconnect system for IC packages and interconnect assemblies.
    상세보기
  16. Chong, Fu Chiung; Kao, Andrew; McKay, Douglas; Litza, Anna; Modlin, Douglas; Mok, Sammy; Parekh, Nitin; Swiatowiec, Frank John; Shan, Zhaohui, High density interconnect system having rapid fabrication cycle.
    상세보기
  17. Chong, Fu Chiung; Kao, Andrew; McKay, Douglas; Litza, Anna; Modlin, Douglas; Mok, Sammy; Parekh, Nitin; Swiatowiec, Frank John; Shan, Zhaohui, High density interconnect system having rapid fabrication cycle.
    상세보기
  18. Chong,Fu Chiung; Kao,Andrew; McKay,Douglas; Litza,Anna; Modlin,Douglas; Mok,Sammy; Parekh,Nitin; Swiatowiec,Frank John; Shan,Zhaohui, High density interconnect system having rapid fabrication cycle.
    상세보기
  19. Lee, Sang-hoon; Ko, Chang-woo; An, Young-soo; Oh, Se-jang, Interface structure of wafer test equipment.
    상세보기
  20. Kister, January, Layered probes with core.
    상세보기
  21. Kister, January, Low profile probe having improved mechanical scrub and reduced contact inductance.
    상세보기
  22. Chong, Fu Chiung; Mok, Sammy, Massively parallel interface for electronic circuit.
    상세보기
  23. Chong,Fu Chiung; Mok,Sammy, Massively parallel interface for electronic circuit.
    상세보기
  24. Di Stefano, Thomas H.; Di Stefano, Peter T., Method and apparatus for aligning and/or leveling a test head.
    상세보기
  25. Di Stefano, Thomas H.; Di Stefano, Peter T., Method and apparatus for aligning and/or leveling a test head.
    상세보기
  26. Eldridge, Benjamin N., Method of designing a probe card apparatus with desired compliance characteristics.
    상세보기
  27. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S., Method of making a contact.
    상세보기
  28. Tunaboylu,Bahadir; Hicklin,Jeff; Pipps,Ivan; Dang,Son; Back,Gerry, Method of probe tip shaping and cleaning.
    상세보기
  29. Derderian, James M., Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween.
    상세보기
  30. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.
    상세보기
  31. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.
    상세보기
  32. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Methods of creating probe structures from a plurality of planar layers.
    상세보기
  33. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S., Microprobe tips and methods for making.
    상세보기
  34. Kim,Kieun; Cohen,Adam L.; Larsen,Willa M.; Chen,Richard T.; Kumar,Ananda H.; Kruglick,Ezekiel J. J.; Arat,Vacit; Zhang,Gang; Lockard,Michael S.; Bang,Christopher A., Microprobe tips and methods for making.
    상세보기
  35. Wu, Ming Ting; Larsen, III, Rulon Joseph; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
    상세보기
  36. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
    상세보기
  37. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
    상세보기
  38. Kister, January, Multiple contact probes.
    상세보기
  39. Kister, January, Multiple contact probes.
    상세보기
  40. Kister, January; Beatson, David; Laurent, Edward, Prefabricated and attached interconnect structure.
    상세보기
  41. Kister,January; Beatson,David; Laurent,Edward, Prefabricated and attached interconnect structure.
    상세보기
  42. Kister, January, Probe bonding method having improved control of bonding material.
    상세보기
  43. Deguchi, Yoshinori, Probe card.
    상세보기
  44. Lee, Chung-Tse; Wu, Chien-Chou; Chen, Tsung-Yi; Chen, Ming-Chi, Probe card and manufacturing method thereof.
    상세보기
  45. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
    상세보기
  46. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Probe card assembly having an actuator for bending the probe substrate.
    상세보기
  47. Shinde, Makarand S.; Larder, Richard A.; Cooper, Timothy E.; Shenoy, Ravindra V.; Eldridge, Benjamin N., Probe card configuration for low mechanical flexural strength electrical routing substrates.
    상세보기
  48. Shinde,Makarand S.; Larder,Richard A.; Cooper,Timothy E.; Shenoy,Ravindra V.; Eldridge,Benjamin N., Probe card configuration for low mechanical flexural strength electrical routing substrates.
    상세보기
  49. Satou,Katsuhiko; Mori,Chikaomi; Nakashima,Masanari, Probe card for examining semiconductor devices on semiconductor wafers.
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  50. Chen, Richard T.; Kruglick, Ezekiel J. J.; Bang, Christopher A.; Smalley, Dennis R.; Lembrikov, Pavel B., Probe devices formed from multiple planar layers of structural material with tip regions formed from one or more intermediate planar layers.
    상세보기
  51. Salmon, Jay; Swart, Roy E.; Liew, Brandon, Probe head assemblies and probe systems for testing integrated circuit devices.
    상세보기
  52. Kister, January; Shtarker, Alex, Probe retention arrangement.
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  53. Kister, January; Shtarker, Alex, Probe retention arrangement.
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  54. Kister, January, Probe skates for electrical testing of convex pad topologies.
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  55. Karavakis, Konstantine N.; Nguyen, Tom T., Probe structures using clamped substrates with compliant interconnectors.
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  56. Kister, January, Probes with high current carrying capability and laser machining methods.
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  57. Kister, January, Probes with offset arm and suspension structure.
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  58. Kister, January, Space transformers employing wire bonds for interconnections with fine pitch contacts.
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  59. Karavakis, Konstantine N.; Nguyen, Tom T., Structures for testing circuits and methods for fabricating the structures.
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  60. Karavakis,Konstantine N.; Nguyen,Tom T., Structures for testing circuits and methods for fabricating the structures.
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  61. Mok, Sammy; Chong, Fu Chiung; Milter, Roman, Systems for testing and packaging integrated circuits.
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  62. Bohm,Gunther, Test device for electrical testing of a unit under test.
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  63. Bucksch,Thorsten, Test device for wafer testing digital semiconductor circuits.
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  64. Miller, Charles A.; Cooper, Timothy E.; Hatsukano, Yoshikazu, Test method for yielding a known good die.
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  65. Chen, Richard T.; Arat, Vacit; Folk, Chris; Cohen, Adam L., Two-part microprobes for contacting electronic components and methods for making such probes.
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  66. Kister, January, Vertical guided layered probe.
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  67. Kister, January, Vertical probe array arranged to provide space transformation.
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  68. Kister, January, Vertical probe array arranged to provide space transformation.
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  69. Eldridge, Benjamin N.; Reynolds, Carl V., Wafer level interposer.
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  70. Eldridge,Benjamin N.; Reynolds,Carl V., Wafer level interposer.
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  71. Johnson, Morgan T., Wafer prober integrated with full-wafer contacter.
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  72. Johnson, Morgan T., Wafer prober integrated with full-wafer contactor.
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