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System for constructing a laminate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B30B-015/06
  • B29C-033/02
  • B32B-031/20
출원번호 US-0545563 (2000-04-07)
발명자 / 주소
  • Raymond J. Meilunas
  • Gregory P. Dillon
  • Jerrell A. Nardiello
출원인 / 주소
  • Northrop Grumman Corporation
대리인 / 주소
    Baker Botts L.L.P.
인용정보 피인용 횟수 : 53  인용 특허 : 16

초록

In one form of the present invention, a system for constructing a laminate (122) is disclosed. The system comprises a ply feeder (101) that sequentially stacks one or more plies (100) to form a ply stack (102). A computer (106) directs a laser (104) to cut each ply (100) to a desired shape after bec

대표청구항

1. A system for constructing a laminate, comprising:a plurality of plies formed from composite material; a ply feeder to sequentially stack the plurality of plies to form a ply stack; a laser to cut the plies; a computer to direct the laser to cut the plurality of plies to a desired shape; a reconfi

이 특허에 인용된 특허 (16)

  1. Haas Edwin G. (Seaford NY) Kesselman Martin (Commack NY), Adjustable form die.
  2. Feygin Michael (Rancho Palos Verdes CA) Pak Sung S. (Chula Vista CA), Apparatus for forming an integral object from laminations.
  3. Guez Allon, Automatic reconfigurable die.
  4. Nardiello Jerrell A. ; Christ Robert J. ; Papazian John M., Block-set form die assembly.
  5. Godding Ronald G. (Birmingham GB2), Holder for irregularly shaped articles.
  6. Feygin Michael ; Shkolnik Alexandr ; Diamond Michael N. ; Dvorskiy Emmanuil, Laminated object manufacturing system.
  7. Kawaguchi Noboru (Komaki JPX), Method and apparatus for manufacturing a solid object through sheet laminating.
  8. Cawley James D. ; Heuer Arthur H. ; Newman Wyatt S., Method for constructing three dimensional bodies from laminations.
  9. Hoffman Peter L., Method for forming composite parts using reconfigurable modular tooling.
  10. Kommineni Prasad (Melbourne FL) Hollandsworth Paul E. (Roanoke VA) Jones John W. (Melbourne Beach FL), Method of shaping an antenna panel.
  11. Haas Edwin Gerard ; Schwarz Robert Charles ; Papazian John M., Modularized reconfigurable heated forming tool.
  12. Bernardon Edward (Bedford MA) Foley Michael F. (Cambridge MA), Reconfigurable fiber-forming resin transfer system.
  13. Hoffman Peter L., Reconfigure modular tooling.
  14. Schroeder Thaddeus (Rochester Hills MI) Stevenson Robin (Bloomfield Hills MI), Surface generating device suitable for generating a die, mold or fixture surface.
  15. Douglas William A. (East Lansdowne PA) Ozer Theodore (Wallingford PA), Universal holding fixture.
  16. Berteau Jacques (Calixa-Lavalle CAX), Variable-shape mold.

이 특허를 인용한 특허 (53)

  1. Kidwell, Alexander James; Idziur, Stephen; Zimmermann, Thomas, Apparatus and method for edge sealing of foam boards.
  2. Levers, Andrew; Wiles, Gary, Assembling and shaping laminate panel.
  3. Levers, Andrew; Wiles, Gary, Assembling and shaping laminate panel.
  4. Trezza, John, Chip capacitive coupling.
  5. Trezza, John, Chip capacitive coupling.
  6. Trezza, John; Callahan, John; Dudoff, Gregory, Chip connector.
  7. Trezza, John, Chip-based thermo-stack.
  8. Trezza, John, Chip-based thermo-stack.
  9. Trezza, John, Coaxial through chip connection.
  10. Pinchot, James M., Collimator fabrication.
  11. Pinchot,James M., Collimator fabrication.
  12. Nakhle, Joelle; Huynh Ba, Thanh Van; Clare, Michael T., Composite information display for a part.
  13. Griess, Kenneth Harlan; Georgeson, Gary E., Composite structures having composite-to-metal joints and method for making the same.
  14. Griess, Kenneth Harlan; Georgeson, Gary E., Composite structures having composite-to-metal joints and method for making the same.
  15. Trezza, John; Callahan, John; Dudoff, Gregory, Contact-based encapsulation.
  16. Trezza, John, Electrically conductive interconnect system and method.
  17. Trezza, John; Callahan, John; Dudoff, Gregory, Electronic chip contact structure.
  18. Lea, Scott W.; Georgeson, Gary E.; Fogarty, Michael D.; Evens, Michael W.; Hansen, Jeffrey M., Fitting doublers using gap mapping.
  19. Kuntz, Michael P.; Younie, Mark L., Flexible tooling method and apparatus.
  20. Kuntz, Michael P.; Younie, Mark L., Flexible tooling method and apparatus.
  21. Trezza, John, Front-end processed wafer having through-chip connections.
  22. Trezza, John, Inverse chip connector.
  23. Trezza, John, Inverse chip connector.
  24. Trezza, John, Isolating chip-to-chip contact.
  25. Trezza, John, Isolating chip-to-chip contact.
  26. Kessel, Jamie A.; Fisher, Phillip J.; Shirron, Paul J.; Mullins, Donald M., Method and apparatus for composite part data extraction.
  27. Graf,Daniel, Method and device for the production of a multi-layered three-dimensional component.
  28. Pridie, Jago, Method of moulding a charge.
  29. Georgeson, Gary Ernest; Griess, Kenneth Harlan, Methods for making composite structures having composite-to-metal joints.
  30. Pinchot,James M., Micro-reactor fabrication.
  31. Gallagher, Jeffery M.; Cipra, Raymond J.; Siegmund, Thomas H., Molding processes and tool therefor.
  32. Kanisawa, Shiyuki, Mounting device for electrical component.
  33. Trezza, John; Callahan, John; Dudoff, Gregory, Patterned contact.
  34. Trezza, John; Frushour, Ross, Pin-type chip tooling.
  35. Trezza, John, Plated pillar package formation.
  36. Trezza, John; Callahan, John; Dudoff, Gregory, Post & penetration interconnection.
  37. Trezza, John, Process for chip capacitive coupling.
  38. Georgeson, Gary Ernest; Griess, Kenneth Harlan, Process for inhibiting galvanic corrosion of an aluminum structure connected, without using a splice plate, to a composite structure having a fiber including graphite.
  39. Trezza, John, Processed wafer via.
  40. Trezza, John, Processed wafer via.
  41. Pinchot, James M., Processing apparatus fabrication.
  42. Trezza, John; Callahan, John; Dudoff, Gregory, Profiled contact.
  43. Trezza, John, Remote chip attachment.
  44. Trezza, John, Remote chip attachment.
  45. Trezza, John; Frushour, Ross, Rigid-backed, membrane-based chip tooling.
  46. Misra, Abhay; Trezza, John, Routingless chip architecture.
  47. Trezza, John, Side stacking apparatus and method.
  48. Johnson, Carl Frederick; Kiridena, Vijitha Senaka; Ren, Feng; Xia, Zhiyong Cedric, System and method for incrementally forming a workpiece.
  49. Trezza, John, Thermally balanced via.
  50. Johnson, Brent; Hardman, Ken; Johnson, Leslie; Waugh, Caleb; Woahn, Jonathan; Triplett, Tyson; Radford, Eric; Stolworthy, Dean Keith; Taylor, Karl M.; Hyatt, Brad; Webster, Jeffrey; Kearl, James; Matsumura, David, Three dimensional variable forming apparatus and methods of use thereof.
  51. Dugas, Roger; Trezza, John, Tooling for coupling multiple electronic chips.
  52. Trezza, John, Triaxial through-chip connection.
  53. Trezza, John, Triaxial through-chip connection.
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