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[미국특허] Super critical drying of low k materials 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/31
출원번호 US-0643531 (2000-08-22)
발명자 / 주소
  • Bharath Rangarajan
  • Ramkumar Subramanian
  • Bhanwar Singh
출원인 / 주소
  • Advanced Micro Devices, Inc.
대리인 / 주소
    Amin & Turocy, LLP
인용정보 피인용 횟수 : 33  인용 특허 : 14

초록

One aspect of the present invention relates to a method of forming a low k material layer on a semiconductor substrate, involving the steps of depositing a mixture containing a low k material and a casting solvent on the semiconductor substrate; optionally contacting the mixture with a transition so

대표청구항

1. A method of forming a low k fluoropolymer layer on a semiconductor substrate, comprising:depositing a mixture comprising a low k fluoropolymer and a casting solvent on the semiconductor substrate, wherein the low k fluoropolymer comprises at least one of a fluorinated polyimide, a fluorinated ben

이 특허에 인용된 특허 (14) 인용/피인용 타임라인 분석

  1. Rosenmayer C. Thomas, Low dielectric constant material for use as an insulation element in an electronic device.
  2. Rosenmayer C. Thomas, Low dielectric constant material with improved dielectric strength.
  3. Morita Kiyoyuki (Osaka JPX) Ishihara Takeshi (Osaka JPX), Method for forming a dielectric thin film or its pattern of high accuracy on a substrate.
  4. Tillotson Thomas M. (Tracy CA) Poco John F. (Livermore CA) Hrubesh Lawrence W. (Pleasanton CA) Thomas Ian M. (Livermore CA), Method for producing metal oxide aerogels having densities less than 0.02 g/cc.
  5. Gnade Bruce E. ; Cho Chih-Chen ; Smith Douglas M., Method of making a low dielectric constant material for electronics.
  6. Hughes Henry G. (Scottsdale AZ) Lue Ping-Chang (Scottsdale AZ) Robinson Frederick J. (Scottsdale AZ), Method of making a semiconductor device having a low permittivity dielectric.
  7. Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX) Smith Douglas M. (Albuquerque NM), Method of making a semiconductor device using a low dielectric constant material.
  8. Yang Hongning ; Nguyen Tue, Method of making low-k fluorinated amorphous carbon dielectric.
  9. Elliott ; Jr. Jarrell R. (Northfield Center OH) Srinivasan Gokul (Akron OH) Dhanuka Manish (Akron OH) Akhaury Ranjan (Akron OH), Microcellular foams.
  10. Nielsen Kenneth A. (Charleston WV) Glancy Charles W. (South Charleston WV), Precursor coating compositions suitable for spraying with supercritical fluids as diluents.
  11. Rostoker Michael D. (San Jose CA) Pasch Nicholas F. (Pacifica CA) Kapoor Ashok K. (Palo Alto CA), Process for forming low dielectric constant insulation layer on integrated circuit structure.
  12. Marsh Gary B. (Pittstown NJ) Fanelli Anthony J. (Rockaway NJ) Armor John N. (Morris Plains NJ) Zambri Patrick M. (Montclair NJ), Spray-dried inorganic oxides from non-aqueous gels or solutions.
  13. DeSimone Joseph M. ; Ni Yizeng, Synthesis of conductive polymers in liquid and supercritical CO.sub.2.
  14. May Charles E. ; Gardner Mark I. ; Fulford ; Jr. H. Jim, Trench isolation structure having low K dielectric spacers arranged upon an oxide liner incorporated with nitrogen.

이 특허를 인용한 특허 (33) 인용/피인용 타임라인 분석

  1. Wagner, Mark Ian, Composition and methods for forming metal films on semiconductor substrates using supercritical solvents.
  2. Wagner, Mark Ian, Composition and methods for forming metal films on semiconductor substrates using supercritical solvents.
  3. Wagner, Mark Ian, Compositions and methods for forming and depositing metal films on semiconductor substrates using supercritical solvents.
  4. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  5. Littrup, Peter J.; Babkin, Alexei V.; Duncan, Robert V.; Kerkar, Pramod; Boldarev, Sergey T., Cryotherapy probe.
  6. Littrup, Peter J.; Babkin, Alexei V.; Duncan, Robert V.; Kerkar, Pramod; Boldarev, Sergey T., Cryotherapy probe.
  7. Arena Foster,Chantal J.; Awtrey,Allan Wendell; Ryza,Nicholas Alan; Schilling,Paul, Developing photoresist with supercritical fluid and developer.
  8. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Developing photoresist with supercritical fluid and developer.
  9. Cotte,John M.; McCullough,Kenneth John; Moreau,Wayne Martin; Petrarca,Kevin; Simons,John P.; Taft,Charles J.; Volant,Richard, Dielectric material.
  10. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Drying resist with a solvent bath and supercritical CO2.
  11. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  12. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  13. Wang,Ching Ya; Tseng,Joshua; Lo,Henry, Method for improving low-K dielectrics by supercritical fluid treatments.
  14. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  15. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  16. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  17. Hillman,Joseph, Method of inhibiting copper corrosion during supercritical COcleaning.
  18. Toma,Dorel Ioan; Schilling,Paul, Method of passivating of low dielectric materials in wafer processing.
  19. Schilling,Paul, Method of treating a composite spin-on glass/anti-reflective material prior to cleaning.
  20. Schilling,Paul, Method of treatment of porous dielectric films to reduce damage during cleaning.
  21. Yu, Chen Hua; Wang, Ching Ya, Method to create damage-free porous low-k dielectric films and structures resulting therefrom.
  22. Littrup, Peter J.; Babkin, Alexei V.; Duncan, Robert; Boldarev, Sergey, Methods and systems for cryogenic cooling.
  23. Swift, Graham, Methods of synthesis of polysuccinimide, copolymers of polysuccinimide and derivatives thereof.
  24. Cotte,John M.; McCullough,Kenneth John; Moreau,Wayne Martin; Petrarca,Kevin; Simons,John P.; Taft,Charles J.; Volant,Richard, Process of insulating a semiconductor device using a polymeric material.
  25. Mullee,William H.; de Leeuwe,Marc; Roberson, Jr.,Glenn A.; Palmer,Bentley J., Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process.
  26. Bertram, Ronald Thomas; Scott, Douglas Michael, Removal of contaminants from a fluid.
  27. DeYoung, James, Repairing and restoring strength of etch-damaged low-k dielectric materials.
  28. Quillen, Michael W.; Holbrook, L Palmer; Moore, John Cleaon, Substrate cleaning processes through the use of solvents and systems.
  29. Okuno, Masahisa; Kakuda, Tooru; Tateno, Hideto; Joda, Takuya; Kurokawa, Masamichi, Substrate processing method, substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium.
  30. Swift, Graham; Doll, Kenneth Michael; Shogren, Randal Lee; Holser, Ronald Alan; Willett, Julious L., Synthesis of polysuccinimide and copoly(succinimide-aspartate) in a supercritical fluid.
  31. Wang, Ching-Ya; Chuang, Ping; Lin, Yu-Liang; Zhou, Mei-Sheng; Lo, Henry, System and method for dampening high pressure impact on porous materials.
  32. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  33. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.

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