$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

[미국특허] Vacuum processing apparatus and operating method therefor 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F26B-005/04
출원번호 US-0766587 (2001-01-23)
우선권정보 JP-2-225321 (1990-08-29)
발명자 / 주소
  • Shigekazu Kato JP
  • Kouji Nishihata JP
  • Tsunehiko Tsubone JP
  • Atsushi Itou JP
출원인 / 주소
  • Hitachi, Ltd. JP
대리인 / 주소
    Antonelli, Terry, Stout & Kraus, LLP
인용정보 피인용 횟수 : 0  인용 특허 : 46

초록

This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber

대표청구항

1. A method of using a conveyor system for processing substrates in plural vacuum processing chambers, the conveyor system including:a loader; a vacuum loader; and double lock chambers, having an loader side and a vacuum loader side, and having a gate valve for said loader side and another gate valv

이 특허에 인용된 특허 (46) 인용/피인용 타임라인 분석

  1. Savage Richard N. (Livermore CA), Apparatus and method for automatically identifying chemical species within a plasma reactor environment.
  2. Hijikata Isamu (Tokyo JPX) Uehara Akira (Yokohama JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for the treatment of semiconductor wafers by plasma reaction.
  3. Niwa Kazuo (Yokohama JPX), Apparatus for the treatment of semiconductors.
  4. Petz Andreas (Bruchkoebel DEX) Costescu Dan (Hainburg DEX), Apparatus on the carousel principle for the coating of substrates.
  5. Takahashi Nobuyuki (Tokyo JPX) Sugimoto Ryuji (Tokyo JPX) Shirai Yasuyuki (Tokyo JPX), Automatic loader.
  6. Davies John T. (El Sobrante CA) Reichelderfer Richard F. (Castro Valley CA), Computer controlled system for processing semiconductor wafers.
  7. Michael Klaus (Gelnhausen-Haitz DEX) Petz Andreas (Bruchkbel DEX), Device for cleaning, testing and sorting of workpieces.
  8. Nagata Yuichi (Hamamatsu JPX) Yoshida Masao (Hamamatsu JPX) Kitano Mikio (Hamamatsu JPX), Effect adaptor attachable to karaoke machine to create harmony chorus.
  9. Hutchinson Martin A. (Santa Clara CA), Gate valve for wafer processing system.
  10. Jakubiec Antoni F. (San Mateo CA) Daley Thomas M. (San Jose CA), Isolation valve for vacuum and non-vacuum application.
  11. Jovanovic Dejan (Dallas TX) Randall John N. (Richardson TX), Lateral resonant tunneling device having gate electrode aligned with tunneling barriers.
  12. Ackley James W. (Los Altos CA), Load lock pumping mechanism.
  13. Giles Brian A. (Honeoye Falls NY) Schwab Frederick J. (Churchville NY), Method and apparatus for cleaning semiconductor wafers.
  14. Eror Miroslav (Old Tappan NJ) Biehl Richard E. (Pearl River NY), Method and apparatus for handling and processing wafer-like materials.
  15. Hurwitt Steven D. (Park Ridge NJ) Eror Miroslav (Old Tappan NJ) Biehl Richard E. (Pearl River NY), Method and apparatus for handling and processing wafer-like materials.
  16. Brooks Ray G. (Irving TX) Brooks Timothy W. (Irving TX) Corris C. James (Elkmont AL), Method and apparatus for maintaining clean articles.
  17. Shibata Fumio (Kudamatsu JPX) Nagatomo Katsuaki (Kudamatsu JPX) Fukuhara Hidetomo (Kudamatsu JPX) Marumoto Gen (Kudamatsu JPX) Okudaira Sadayuki (Oume JPX), Method and apparatus for plasma process.
  18. Lin Jung-Hui (Gilbert AZ), Method for forming a tapered opening in silicon.
  19. Bajor George (Melbourne FL) Rivoli Anthony L. (Palm Bay FL), Method for forming recessed oxide isolation containing deep and shallow trenches.
  20. Nishida Masami (Kyoto JPX) Himoto Masahiro (Kyoto JPX) Hamada Tetsuya (Kyoto JPX) Yokono Noriaki (Kyoto JPX) Okamoto Takeo (Kyoto JPX), Method of and device for transporting semiconductor substrate in semiconductor processing system.
  21. Coleman John H. (Locust Valley NY), Method of forming semiconducting materials and barriers.
  22. Kawasaki Yoshinao (Kumage JPX) Kawahara Hironobu (Kudamatsu JPX) Sato Yoshiaki (Kudamatsu JPX) Fukuyama Ryooji (Kudamatsu JPX) Nojiri Kazuo (Higashimurayama JPX) Torii Yoshimi (Tachikawa JPX), Method of removing residual corrosive compounds by plasma etching followed by washing.
  23. Fukuyama Ryooji (Kudamatsu JPX) Nawata Makoto (Kudamatsu JPX) Kakehi Yutaka (Hikari JPX) Kawahara Hironobu (Kudamatsu JPX) Sato Yoshiaki (Kudamatsu JPX) Torii Yoshimi (Tachikawa JPX) Kawaraya Akira (, Method of treating samples.
  24. Stark Lawrence R. (San Jose CA) Turner Frederick (Sunnyvale CA), Modular wafer transport and processing system.
  25. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multi-chamber integrated process system.
  26. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multichamber integrated process system.
  27. Yano Kensaku (Kanagawa JPX) Furukawa Akihiko (Tokyo JPX) Miyagawa Ryohei (Kanagawa JPX) Iida Yoshinori (Tokyo JPX), Photo chemical reaction apparatus.
  28. Miyamura Tadashi (Osaka JPX) Sugawara Shigeo (Osaka JPX), Plasma apparatus.
  29. Gallagher James P. (Newburgh NY) Schmidt ; Jr. Howard W. (Walden NY), Plasma etch cleaning in low pressure chemical vapor deposition systems.
  30. Davis Cecil J. (Greenville TX) Abernathy Joseph V. (Wylie TX) Matthews Robert T. (Plano TX) Hildenbrand Randall C. (Richardson TX) Simpson Bruce (Dallas TX) Bohlman James G. (Forney TX) Loewenstein L, Processing apparatus.
  31. Iwabuchi Katsuhiko (Sagamihara JPX), Processing apparatus.
  32. Bramhall ; Jr. Robert B. (Gloucester MA) Cloutier Richard M. (Salisbury MA) Laber Albert P. (Revere MA) Muka Richard S. (Topsfield MA), Sealing apparatus for a vacuum processing system.
  33. Maydan Dan (Los Altos Hills CA) Somekh Sasson R. (Redwood City CA) Ryan-Harris Charles (La Honda CA) Seilheimer Richard A. (Pleasanton CA) Cheng David (San Jose CA) Abolnikov Edward M. (San Francisco, Semiconductor processing system with robotic autoloader and load lock.
  34. Hutchinson Martin A. (Santa Clara CA), Sputter module for modular wafer processing machine.
  35. Graves ; Jr. Walter E. (San Jose CA) Boys Donald (Cupertino CA) Turner Frederick T. (Sunnyvale CA), Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor.
  36. Aylwin Pedro A. (Santa Barbara CA) Corb Brinton W. (Goleta CA), Thin film magnetic recording head for minimizing undershoots.
  37. Aylwin Pedro A. (Santa Barbara CA) Corb Brinton W. (Goleta CA), Thin film magnetic recording head for minimizing undershoots and a method for manufacturing the same.
  38. Hiroki Tutomu (Yamanashi JPX), Vacuum processing apparatus.
  39. Kakehi Yutaka (Hikari JPX) Nakazato Norio (Kudamatsu JPX) Fukushima Yoshimasa (Hikari JPX) Shibata Fumio (Kudamatsu JPX) Tsubone Tsunehiko (Kudamatsu JPX) Kanai Norio (Kudamatsu JPX), Vacuum processing unit and apparatus.
  40. Rosvold Warren C. (Sunnyvale CA), Vacuum sputtering apparatus.
  41. Flint Alan G. (Los Gatos CA) Jacobs William G. (San Jose CA), Wafer loading apparatus.
  42. Layman Frederick P. (Fremont CA) Huntley David A. (Mountain View CA) Dick Paul H. (San Jose CA) Coad George L. (Lafayette CA) Kuhlman Michael J. (Fremont CA) Vecta Roger M. (San Jose CA) Hobson Phill, Wafer processing system.
  43. Coad George L. (Lafayette CA) Shaw R. Howard (Palo Alto CA) Hutchinson Martin A. (Santa Clara CA), Wafer transfer system.
  44. Hertel Richard J. (Bradford MA), Wafer transfer system.
  45. Hertel Richard J. (Bradford MA) Delforge Adrian C. (Rockport MA) Mears Eric L. (Rockport MA) MacIntosh Edward D. (Gloucester MA) Jennings Robert E. (Nethuen MA) Bhargava Akhil (Reading MA), Wafer transfer system.
  46. Hertel Richard J. (Bradford MA) MacIntosh Edward D. (Gloucester MA), Wafer transfer system.

활용도 분석정보

상세보기
다운로드
내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로