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[미국특허] Method and apparatus for removing a liquid from a surface of a rotating substrate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08D-003/02
  • B08B-003/00
출원번호 US-0159801 (1998-09-23)
우선권정보 EP-988700563 (1998-03-20)
발명자 / 주소
  • Paul Mertens BE
  • Mark Meuris BE
  • Marc Heyns BE
출원인 / 주소
  • Interuniversitair Microelektronics Centrum (IMEC) BE
대리인 / 주소
    McDonnell Boehnen Hulbert & Berghoff
인용정보 피인용 횟수 : 104  인용 특허 : 7

초록

A method and an apparatus for removing a liquid, i.e a wet processing liquid, from a surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter besides the liquid also a gaseous substance can be supplied thereby creating at least loca

대표청구항

1. A method of removing a liquid from at least a portion of one surface of a substrate, the method comprising steps of:subjecting said substrate to a rotary movement; supplying a liquid to at least a part of said surface of said substrate; and supplying a gaseous substance to at least a section of s

이 특허에 인용된 특허 (7) 인용/피인용 타임라인 분석

  1. Lee Je-cheol,KRX ; Kim Byung-jin,KRX, Apparatus for cleaning semiconductor wafers.
  2. Shortes Samuel R. (Plano TX) Millis Edwin Graham (Dallas TX), Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water.
  3. Paul Mertens BE; Marc Meuris BE; Marc Heyns BE, Method and apparatus for removing a liquid from a surface.
  4. Leenaars Adriaan F. M. (Eindhoven NLX) Huethorst Johanna A. M. (Eindhoven NLX) Marra Johannes (Eindhoven NLX), Method for removing in a centrifuge a liquid from a surface of a substrate.
  5. Kunze-Concewitz Horst,DEX, Method of cleaning surfaces with water and steam.
  6. Britten Jerald A. (Oakley CA), Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor.
  7. Kanno Itaru,JPX, Wafer cleaning apparatus.

이 특허를 인용한 특허 (104) 인용/피인용 타임라인 분석

  1. Ravkin,Mike; Boyd,John; Dordi,Yezdi N.; Redeker,Fred C.; de Larios,John M., Apparatus and method for depositing and planarizing thin films of semiconductor wafers.
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  4. Welsh,Christopher M.; Matsumoto,Jack T., Apparatus and method for substrate preparation implementing a surface tension reducing process.
  5. O'Donnell,Robert J., Apparatus and method for utilizing a meniscus in substrate processing.
  6. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C.; Thomas, Clint; Parks, John, Apparatus and system for cleaning a substrate.
  7. Crabb, Kevin Matthew; Engesser, Philipp; Badam, Vijay Kumar, Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus.
  8. Treur,Randolph E.; Boyd,John M.; Anderson,Tom; de Larios,John, Apparatus for oscillating a head and methods for implementing the same.
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  60. Joslyn,Michael J., Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces.
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