초록 ▼

An embodiment of the present invention includes a disposable print head for ejecting controlled amounts of liquid (e.g., solder) at a high rate onto the surface (e.g., an integrated circuit) in close proximity to the ejecting source. The embodiment involves the use of a controlled burst of gas that

An embodiment of the present invention includes a disposable print head for ejecting controlled amounts of liquid (e.g., solder) at a high rate onto the surface (e.g., an integrated circuit) in close proximity to the ejecting source. The embodiment involves the use of a controlled burst of gas that is developed by rapidly heating a metallic hydride film with a laser to disassociate the hydrogen therefrom. The pressure created by the burst of a hydrogen gas is used to eject an amount of a liquid (e.g., a solder) from an appropriate conduit that is fed liquid from a reservoir. The surfaces in the print head that contact the liquid are coated to assist in priming the print head for a subsequent ejection event.

대표청구항 ▼

1. A method for ejecting a liquid material from an ejection port in a print head, the print head including a solid film from which a gas disassociates when the solid film is heated and a conduit in communication with the ejection port which contains the liquid material to be ejected, the method comp

1. A method for ejecting a liquid material from an ejection port in a print head, the print head including a solid film from which a gas disassociates when the solid film is heated and a conduit in communication with the ejection port which contains the liquid material to be ejected, the method comprising:positioning the solid film in the print head in a location discrete from the liquid; heating the solid film to cause the gas to become disassociated therefrom; and directly contacting the disassociated gas to the liquid material in the conduit to eject the liquid material from the ejection port.