초록 ▼

In accordance with the objectives of the invention a new package is provided that is provided with a cavity that is shaped such that more than one semiconductor device can in a vertical direction be mounted in the cavity of the package. The devices that are mounted inside the cavity of the package a

In accordance with the objectives of the invention a new package is provided that is provided with a cavity that is shaped such that more than one semiconductor device can in a vertical direction be mounted in the cavity of the package. The devices that are mounted inside the cavity of the package are separated by separate components of insulation, the overlying devices are electrically interconnected by horizontally positioned solder bumps and vertical interconnect plugs.

대표청구항 ▼

or more semiconductor supporting units that provide mechanical support for mounting said one or more semiconductor devices and that further function as electrical insulators and heat conductor units between said one or more semiconductor devices, said one or more semiconductor supporting units havin

or more semiconductor supporting units that provide mechanical support for mounting said one or more semiconductor devices and that further function as electrical insulators and heat conductor units between said one or more semiconductor devices, said one or more semiconductor supporting units having a top surface having a size and bottom surface having a size, whereby the plane of said top surface is parallel to the plane of said bottom surface, whereby therefore the size of said top surface is equal to the size of said bottom surface, whereby the size of the top surface of at least one of said one or more semiconductor supporting units can be matched with the size of an active side of at least one of said one or more semiconductor devices, whereby the size of a matching semiconductor supporting unit is smaller than the size of the top surface of a matching semiconductor device by a measurable amount; matching and joining at least one of said one or more semiconductor devices with at least one of said matching semiconductor support units in a plane that is parallel with the plane of said bottom surface of said package, whereby the size of the combined surface of said one or more matched semiconductor devices is about equal to the size of at least one semiconductor supporting unit, creating matched semiconductor device and device support units; inserting said matched semiconductor device and device support units into said cavity, whereby the size of the surface of a cross section of the cavity is about equal to said size of the surface of said one or more semiconductor device support units, overlaying said semiconductor device support unit with a matching semiconductor device attached thereto over a surface of said contoured sidewalls of said cavity that is parallel with the surface of said bottom surface of said package, establishing points of electrical contact of said solder bumps of said one or more semiconductor devices with said contact points provided in said horizontal surfaces in said cavity of said semiconductor package, establishing electrical contact between said solder bumps provided in said one or more semiconductor devices and said conductive plugs provided in the bottom surface of said semiconductor package, completing the overlaying of said surfaces inside said cavity that are parallel with said bottom surface of said package with matched semiconductor device and device support units; providing a metallic cover that has a top surface having a size and a bottom surface that is parallel to the plane of said top surface having a size that is equal to said size of said top surface of said metallic cover, whereby the size of said top surface of said metallic cover is about equal to the size of said top opening of said cavity in said semiconductor package; and inserting said metallic cover into said top opening of said cavity.