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Apparatus for liquid cooling of specific computer components 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/20
  • H05K-007/20
출원번호 US-0896401 (2001-06-29)
발명자 / 주소
  • Daniel N. Donahoe
  • Michael T. Gill
출원인 / 주소
  • Compaq Information Technologies Group, L.P.
대리인 / 주소
    Akin Gump Strauss Hauer & Feld LLP
인용정보 피인용 횟수 : 15  인용 특허 : 60

초록

Apparatus is provided for a heat transfer assembly for direct attachment to a high heat generating chip, which assembly includes a pump, air side heat exchanger mounted adjacent to a fan and a heat transfer plate which is attached to the high heat generating component for dissipating heat from such

대표청구항

1. Electronic apparatus, comprising:a generally rectangular chassis having first and second sets of opposing sides; a plurality of electronic components mounted on said chassis, including a hard disk drive, said hard disk drive having a generally rectangular box-like container; a heat exchange syste

이 특허에 인용된 특허 (60)

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  2. Denney ; Jr. Donald L. ; Pais Martinho R., Apparatus and method for cooling an electrical component.
  3. Donahoe Daniel N. ; Gill Michael T., Apparatus for liquid cooling of specific computer components.
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  6. Seki Hideki (Saijo JA), Chassis device having vented base and radiation member for supporting heat sources.
  7. Brown Candice H. (San Jose CA), Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to th.
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  12. Francovich Walter,CAX ; Shaanan Gad,CAX ; Hunziker Derek,CAX ; Girard Joseph Germain Maurice Paul,CAX ; Ircha Vladislav,CAX, Computer case having slidably insertable drive housing with U-shaped mounting bracket having inwardly projecting pins on.
  13. Cree Roger W. (Stillwater MN), Computer cooling system.
  14. Lin Chun Hsiung, Computer hard drive heat sink assembly.
  15. Feinberg Jay H. (Deerfield IL) Roberts William N. (Niles IL), Conformable pad with thermally conductive additive for heat dissipation.
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  31. Herrell Dennis J. (Austin TX) Gibson David A. (Austin TX), Fluid-cooled integrated circuit package.
  32. Horbach Stephen (40 Glen Road Mountain Lakes NJ 07046), Heat sink casing for circuit board components.
  33. Kucharek Andrzej (Mountain View CA), High density multi-chip interconnection and cooling package.
  34. Budelman Gerald A. (Aloha OR), High efficiency heat removal system for electric devices and the like.
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  36. Cray ; Jr. Seymour R. (Chippewa Falls WI), Immersion cooled high density electronic assembly.
  37. Curtis Ronald L. (Chippewa Falls WI) Mandelert James S. (Chippewa Falls WI) Nesja Christopher T. (Chippewa Falls WI), Immersion cooling safety monitoring system.
  38. Nakanishi Keiichirou (Kokubunji JPX) Yamada Minoru (Iruma JPX), Integrated circuit chips cooling module having coolant leakage prevention device.
  39. Braun Robert E. (Norristown PA) Jones Richard H. (Wayne PA) Sprenkle George J. (Phoenixville PA) Stopper Herbert (Orchard Lake MI), Island assembly employing cooling means for high density integrated circuit packaging.
  40. Stefani Gary G. (Endicott NY), Leak isolating apparatus for liquid cooled electronic units in a coolant circulation system.
  41. Donahoe Daniel N. ; Gill Michael T., Liquid cooled computer apparatus and associated methods.
  42. Benton Ronald E. (Galesburg IL) Senner Kurt C. (Galesburg IL), Liquid dispensing assembly for a refrigerator.
  43. Sherwood Gregory J. (Colorado Springs CO) Quaderer Chris M. (Colorado Springs CO), Logic module assembly for confining and directing the flow of cooling fluid.
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  45. Taraci Richard (Phoenix AZ) Taraci Brian (Laguna Niguel CA) Gorgenyi Imre (Scottsdale AZ), Method and apparatus for maintaining electrically operating device temperatures.
  46. Braunisch Eckart (Kimstad SEX) nnegren Jan (Norrkping SEX), Microwave oven with adaptable power module.
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  48. Mayer Hartwig (Neckargerach DEX), Power supply.
  49. Mon George (Potomac MD), Pulsatile impinging cooling system for electronic IC modules and systems using fluidic oscillators.
  50. Bowen Stephen A. (Chippewa Falls WI) August Melvin C. (Chippewa Falls WI) Cermak ; III Stephen (Elk Mound WI) Collins David R. (Eau Claire WI) Dean Steven J. (Chippewa Falls WI) Franz Perry D. (Elk M, Quick disconnect system for circuit board modules.
  51. Baker Don L. (Johnson City NY) Gilda Glenn D. (Endicott NY) Quinn Terrence A. (Poughkeepsie NY) Shaukatullah Hussain (Endwell NY), Removable thermocouple template for monitoring temperature of multichip modules.
  52. Perry Michael W. (Ocean NJ), Repeater housing and circuit mounting structure.
  53. Davidson Howard L. (San Carlos CA) Nishtala Satyanarayana (Santa Clara CA), Stacking heatpipe for three dimensional electronic packaging.
  54. Young Glen C. (Fort Wayne IN), System for conditioning air, method of operating such, and circuit.
  55. Korinsky George K. (Houston TX), Thermal packaging for natural convection cooled electronics.
  56. Korinsky George K. (Woodlands TX), Thermal packaging for natural convection cooled electronics.
  57. Danielson Richard D. (Hastings MN) Hesselroth David A. (St. Paul Park MN) Stein ; Jr. Ralph J. (So. St. Paul MN), Thermal transfer bag.
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  60. Yoshikawa Tomio (Shimizu JPX) Yamashita Tetsuji (Shizuoka JPX) Murakami Kyoshiro (Shimizu JPX) Kato Takashi (Shimizu JPX) Yasuda Hiromu (Shizuoka JPX) Zushi Shizuo (Hadano JPX), Water chilling method and apparatus for the same.

이 특허를 인용한 특허 (15)

  1. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E.; Singh, Prabjit; Zhang, Jing, Cooling method with automated seasonal freeze protection.
  2. Ishinabe,Minoru; Uchida,Hiroki; Tokuhira,Hideshi; Date,Hiroaki; Tanaka,Wataru, Cooling structure for electronic equipment.
  3. Ippoushi, Shigetoshi; Yamada, Akira; Maekawa, Hirotoshi; Yabunaka, Fumiharu, Cooling structure, heatsink and cooling method of heat generator.
  4. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E.; Singh, Prabjit; Zhang, Jing, Cooling system with automated seasonal freeze protection.
  5. Atarashi, Takayuki; Fukuda, Hiroshi; Fujita, Kenji, Dish array apparatus with improved heat energy transfer.
  6. Neho, Yasushi; Hotta, Daichi, Electric device with liquid cooling system and method of manufacturing thereof.
  7. Iijima, Masayuki; Ikeda, Tomoaki; Miyazawa, Masashi; Ueno, Kouji; Gwin, Paul J.; Long, Brian J.; Davison, Peter A.; Konstad, Rolf A., Electronic component cooling apparatus.
  8. Satou, Kaoru; Kouno, Haruhiko, Heatsink apparatus and electronic device having the same.
  9. Hu, Xiu-Quan; Wu, Lin-Han; Hou, Li; Wang, Wei, Housing with rotation arm and panel for securing hard disk drive therein.
  10. Attlesey, Chad Daniel; Klum, R. Daren; Berning, Allen James, Liquid submersion cooling system.
  11. Attlesey,Chad Daniel; Klum,R. Daren; Berning,Allen James, Liquid submersion cooling system.
  12. Hardesty, Robert E., Micro-channel pulsating heat pipe.
  13. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Multi-fluid cooling system and method with freeze protection for cooling an electronic device.
  14. Malone,Christopher Gregory; Simon,Glenn Cochran, One or more heat exchanger components in major part operably locatable outside computer chassis.
  15. Chainer, Timothy Joseph; Parida, Pritish Ranjan; Schultz, Mark Delorman, Two-phase liquid cooled electronics.
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