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A cooling arrangement facilitates the cooling of a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. In an example embodiment, the cooling arrangement provides cooling for a plurality of integrated circu

A cooling arrangement facilitates the cooling of a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. In an example embodiment, the cooling arrangement provides cooling for a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. The cooling arrangement includes a plurality of U-shaped thermally conductive members, each having a set of leg portions connected with a top portion and an open end disposed over a respective one of the substrates. In addition, a first inner surface of at least one of the leg portions is in thermal contact with at least one of the integrated circuit elements. The cooling arrangement further includes a housing member containing therein the U-shaped members and includes a cooling plate arrangement in thermal contact with the housing and the top portions of the U-shaped members.

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1. An apparatus for cooling a plurality of integrated circuit elements disposed on a plurality of substrates, the plurality of substrates being substantially perpendicularly mounted on a main substrate, the apparatus comprising:a thermally conductive member having a set of leg portions connected wit

1. An apparatus for cooling a plurality of integrated circuit elements disposed on a plurality of substrates, the plurality of substrates being substantially perpendicularly mounted on a main substrate, the apparatus comprising:a thermally conductive member having a set of leg portions connected with a top portion and an open end configured to be disposed over the substrates, a first surface of at least one of the leg portions configured to be in thermal contact with at least one of the integrated circuit elements, the top portion of the conductive member configured to conduct heat from the leg portions of the conductive member; and means for conducting heat from the top portion to a nongaseous thermal medium, the means for conducting being disposed over the top portion.