초록 ▼

The invention encompasses a method of forming a sputtering target. A wear profile for a sputtering target surface is determined. The wear profile corresponds to a shape of the used target surface after the target is subjected to the wear of having material sputtered therefrom. The wear profile is di

The invention encompasses a method of forming a sputtering target. A wear profile for a sputtering target surface is determined. The wear profile corresponds to a shape of the used target surface after the target is subjected to the wear of having material sputtered therefrom. The wear profile is divided amongst a plurality of datapoints across the target surface. A difference in height of the target surface after the wear relative to a height of the target surface prior to the wear is calculated. The difference in height calculations generate a plurality of wear definition datapoints. Target lifetime datapoints are calculated using the wear definition datapoints, and sputtering uniformity datapoints are also calculated using the wear definition datapoints. A difference between the target lifetime datapoints and sputtering uniformity datapoints is calculated. A constant corresponding to the difference between a target lifetime datapoint and a sputtering uniformity datapoint is added to the sputtering uniformity datapoints to generate a desired profile for a sputtering target sputtering surface. A sputtering target is formed having a sputtering surface with the desired profile.

대표청구항 ▼

1. A method of forming a sputtering target, comprising:determining a wear profile for a sputtering target surface, the wear profile corresponding to a shape of the target surface after the target is subjected to the wear of having material sputtered therefrom; calculating an amount of wear at a plur

1. A method of forming a sputtering target, comprising:determining a wear profile for a sputtering target surface, the wear profile corresponding to a shape of the target surface after the target is subjected to the wear of having material sputtered therefrom; calculating an amount of wear at a plurality of positions of the target surface; multiplying the amount of wear at the positions by a sputtering uniformity parameter to obtain sputtering uniformity values for the positions, the sputtering uniformity parameter being from {fraction (1/16)} to 1/6; adding an additive value to the sputtering uniformity values to generate a desired profile for a sputtering target sputtering surface; and forming a sputtering target with a sputtering surface having the desired profile.