[특허]Heat treatment apparatus and method

Heat treatment apparatus and method 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	C23C-016/00
출원번호	US-0989080 (2001-11-21)
우선권정보	JP-2000-360293 (2000-11-27)
발명자 / 주소	Takashi Tanaka JP Shinji Nagashima JP Hiroyuki Sakai JP
출원인 / 주소	Tokyo Electron Limited JP
대리인 / 주소	Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보	피인용 횟수 : 15 인용 특허 : 9

초록 ▼

A heat treatment apparatus for applying a predetermined heat treatment to a substrate includes: for example, a dielectric low oxygen controlled cure unit (DLC unit) for forming an interlayer insulating film on a semiconductor wafer W; a hot plate for supporting the wafer W a predetermined distance apart from the surface thereof; a chamber for housing the wafer W; a gas collecting port formed in that portion of the hot plate which corresponds to the lower side of the wafer W when the wafer W is disposed on the hot plate; and an oxygen sensor for measuring the oxygen concentration in the gas collected from the gas collecting port. Since the oxygen concentration can be measured during the heat treatment to the wafer W, the characteristics of the interlayer insulating film formed can be maintained constant.

대표청구항 ▼

1. A heat treatment apparatus for applying a predetermined heat treatment to a substrate having a coated film formed thereon, comprising:a hot plate on which the substrate is disposed; a chamber for housing the substrate disposed on said hot plate; and an oxygen concentration measuring device for measuring the oxygen concentration within said chamber; wherein the oxygen concentration is measurable by said oxygen concentration measuring device while a heat treatment is being applied to said substrate; a signal input-control device for executing measurement of the oxygen concentration by said oxygen concentration measuring device under one of an automatic control and a manual operation; and a monitor for displaying a result of measurement of the oxygen concentration by said oxygen concentration measuring device under said one of said automatic control and said manual operation.

이 특허에 인용된 특허 (9)

Shinichi Hayashi JP; Shinji Nagashima JP, Apparatus for forming coating film.
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Takeshita Kazuhiro,JPX ; Nagashima Shinji,JPX ; Mizutani Yoji,JPX ; Katayama Kyoshige,JPX, Gas treatment apparatus.
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Matsuyama Yuji,JPX, Heat processing method and apparatus.
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Hirose Osamu,JPX ; Tateyama Kiyohisa,JPX, Heat treating apparatus.
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Ueda Yasuhiro (Tokyo JPX) Takahashi Hironari (Itami JPX), Leak detection in a reduced pressure processing apparatus.
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Yoshikawa Toshiaki,JPX, Method and apparatus for forming a film by sputtering process.
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Murakami Toshiaki (Mito JPX) Moriwaki Kazuyuki (Mito JPX), Method of manufacturing thin compound oxide film and apparatus for manufacturing thin oxide film.
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Takeshita Kazuhiro,JPX ; Nagashima Shinji,JPX ; Muramatsu Makoto,JPX ; Mizutani Yoji,JPX ; Yano Kazutoshi,JPX ; Katayama Kyoshige,JPX, Spin coating apparatus including aging unit and solvent replacement unit.
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Kondo Hiroshi (Tokyo JPX) Tachibana Mitsuhiro (Yamanashi JPX), System for continuously washing and film-forming a semiconductor wafer.
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이 특허를 인용한 특허 (15)

Englhardt, Eric A.; Rice, Michael R.; Hudgens, Jeffrey C.; Hongkham, Steve; Pinson, Jay D.; Salek, Mohsen; Carlson, Charles; Weaver, William T; Armer, Helen R., Cartesian cluster tool configuration for lithography type processes.
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Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Katwyk, Kirk Van; Hoskins, Van; Shah, Vinay, Cartesian robot cluster tool architecture.
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Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
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Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
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Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
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Ishikawa,Tetsuya; Roberts,Rick J.; Armer,Helen R.; Volfovski,Leon; Pinson,Jay D.; Rice,Michael; Quach,David H.; Salek,Mohsen S.; Lowrance,Robert; Backer,John A.; Weaver,William Tyler; Carlson,Charles; Wang,Chongyang; Hudgens,Jeffrey; Herchen,Harald; Lue,Brian, Cluster tool architecture for processing a substrate.
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Volfovski, Leon; Ishikawa, Tetsuya, Cluster tool substrate throughput optimization.
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Nagai, Kouichi, Heat treatment apparatus and method of manufacturing semiconductor device.
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Nagai, Kouichi, Heat treatment apparatus and method of manufacturing semiconductor device.
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Fukuoka, Tetsuo; Kitano, Takahiro; Terada, Kazuo, Heating device, coating and developing system, heating method and storage medium.
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Dhindsa, Rajinder; Srinivasan, Mukund, Process tuning gas injection from the substrate edge.
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Han, Jae Won, Rapid thermal processing apparatus and methods.
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Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Van Katwyk, Kirk; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a Cartesian robot cluster tool.
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Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Katwyk, Kirk Van; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a cartesian robot cluster tool.
상세보기
Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Van Katwyk, Kirk; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a cartesian robot cluster tool.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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Heat treatment apparatus and method 원문보기