초록 ▼

A Hall effect sensor and capacitor assembly includes leadless chip type capacitors employed as EMI shielding/ESD protection and bypass capacitors. In a first embodiment, a molded carrier structure provides a housing for mounting a Hall cell element as well as one or more EMI shielding or bypass capa

A Hall effect sensor and capacitor assembly includes leadless chip type capacitors employed as EMI shielding/ESD protection and bypass capacitors. In a first embodiment, a molded carrier structure provides a housing for mounting a Hall cell element as well as one or more EMI shielding or bypass capacitors. The carrier housing facilitates interconnection of the Hall cell and the chip capacitor. Additionally, this structure simplifies the manufacturing process for connection of the smaller leadless chip capacitor components. In an alternate embodiment, an insulated, molded encapsulation is applied and surrounds the chip capacitors and the connections to the Hall effect sensor leads.

대표청구항 ▼

1. A hall element and capacitor assembly for holding a hall element with a hall cell and electrical leads, comprising:a carrier housing mounting the hall cell and having at least one cavity separate from the hall cell and within which one or more leads of the Hall element are located; and a leadless

1. A hall element and capacitor assembly for holding a hall element with a hall cell and electrical leads, comprising:a carrier housing mounting the hall cell and having at least one cavity separate from the hall cell and within which one or more leads of the Hall element are located; and a leadless chip capacitor having a defined height located within said cavity connected to one of said leads of the hall element; and wherein the cavity is defined by solid walls having a greater height then the capacitor.