IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
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| 국제특허분류(IPC7판) |
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| 출원번호 |
US-0927659
(2001-08-10)
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발명자
/ 주소 |
- Sharp, Anthony C.
- Hudz, Andrew
- Jeffery, Peter
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| 출원인 / 주소 |
|
| 대리인 / 주소 |
|
| 인용정보 |
피인용 횟수 :
76 인용 특허 :
26 |
초록
▼
A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having a
A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having an input port receiving air from the first vertical airflow path of the cabinet, an output port transmitting air to the second vertical air flow path, a heat exchanger positioned in an air flow path extending between the input and the output ports, and a fan assembly for driving air through the heat exchanger and towards the input port. The system further includes at least one air flow distribution device establishing a predetermined flow rate distribution through electronic assemblies supported by the brackets.
대표청구항
▼
A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having a
A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having an input port receiving air from the first vertical airflow path of the cabinet, an output port transmitting air to the second vertical air flow path, a heat exchanger positioned in an air flow path extending between the input and the output ports, and a fan assembly for driving air through the heat exchanger and towards the input port. The system further includes at least one air flow distribution device establishing a predetermined flow rate distribution through electronic assemblies supported by the brackets. housing. 12. The carrier in claim 1, wherein said carrier is positionable relative to a polishing pad by a separate pneumatic movement system. 13. The carrier in claim 1, wherein said carrier is positionable relative to a polishing pad by a separate mechanical movement system. 14. The carrier in claim 1, wherein said spacer has an annular shape and an annular width. 15. The carrier in claim 1, wherein an edge polishing pressure is exerted against a peripheral edge of said substrate by said second force acting through said annular spacer, and wherein a center polishing pressure is exerted against a central portion of said substrate. 16. The carrier in claim 1, wherein said first, second, and third pressures are each established independently of the other pressures. 17. The carrier in claim 1, wherein said substrate comprises a semiconductor wafer. 18. The carrier in claim 1, wherein said membrane comprises a flexible resilient material. 19. The carrier in claim 1, wherein said retaining ring is flexibly coupled to said housing via a first diaphragm. 20. The carrier in claim 1, wherein said subcarrier plate is flexibly coupled to said housing via a second diaphragm. 21. The carrier in claim 1, wherein said retaining ring is flexibly coupled to said housing via a first ring formed of pliable material. 22. The carrier in claim 1, wherein said subcarrier plate is flexibly coupled to said housing via a second ring formed of pliable material. 23. The carrier in claim 1, wherein said pliable material is selected from the group consisting of EPDM, EPR, and rubber. 24. The carrier in claim 1, wherein said retaining ring is flexibly coupled to said housing via a first diaphragm, and said subcarrier plate is flexibly coupled to said housing via a second diaphragm. 25. The carrier in claim 1, wherein said subcarrier plate is further coupled to said housing via a rod and a receptacle for receiving said rod for transferring rotational forces between said housing and said subcarrier plate. 26. The carrier in claim 25, wherein said rod includes a tooling ball at a distal end and said receptacle includes a cylinder for slidably receiving said tooling ball. 27. The carrier in claim 26, wherein a plurality of said rods and said receptacles couple said subcarrier plate to said housing. 28. The carrier in claim 1, wherein said retaining ring is further coupled to said housing via a rod and a receptacle for receiving said rod for transferring rotational forces between said housing and said subcarrier plate. 29. The carrier in claim 28, wherein said rod includes a tooling ball at a distal end and said receptacle includes a cylinder for slidably receiving said tooling ball. 30. The carrier in claim 29, wherein a plurality of said rods and said receptacles couple said retaining ring to said housing. 31. The carrier in claim 1, whereby no insert is provided between said membrane and said substrate thereby reducing process to process variation caused by variation in the properties of the insert. 32. The carrier in claim 1, wherein said membrane includes at least one hole and said third chamber is sealed only upon the mounting of said substrate to said membrane. 33. The carrier in claim 1, wherein said membrane includes at least one hole and said third chamber is formed only upon the mounting of said substrate to said carrier. 34. The carrier in claim 1, wherein said spacer has an annular width of between about 1 mm and about 20 mm. 35. The carrier in claim 1, wherein said spacer has an annular width of between about 2 mm and about 10 mm. 36. The carrier in claim 1, wherein said spacer has an annular width of between about 1 mm and about 5 mm. 37. The carrier in claim 1, wherein said spacer has an annular width of between about 1 mm and about 2 mm. 38. The carrier in claim 1, wherein said spacer has an annular width of between about 2 mm and about 5 mm. 39. The carrier in claim 1, wherein said pressure of said subcarrier plate is the pressure applied to t he peripheral edge of said substrate. 40. The carrier in claim 1, wherein said subcarrier plate does not contact said substrate but provides stability. 41. The carrier in claim 1, wherein said membrane has thickened portion at edge to transfer mechanical force. 42. The carrier in claim 1, wherein said spacer is formed from a metallic material. 43. The carrier in claim 1, wherein said spacer is a substantially non-compressible material. 44. The carrier in claim 1, wherein said spacer is a compressible polymeric material. 45. The carrier in claim 1, wherein said spacer comprises a viscous material. 46. The carrier in claim 1, wherein said spacer is made of a material selected to provide the desired edge pressure to center pressure transition. 47. The carrier in claim 1, wherein said membrane includes a hole and said hole is used to sense whether a substrate is adhered to the membrane based on the ability to create a vacuum in said third chamber of a predetermined magnitude. 48. The carrier in claim 1, wherein said substrate attachment checking hole is disposed proximate the center of said membrane. 49. The carrier in claim 1, wherein said spacer in combination with said membrane provide a somewhat resilient force transfer but need not seal the substrate to the membrane. 50. The carrier in claim 1, wherein said first, said second, and said third pressures may each independently be positive pressures or negative (vacuum) pressures. 51. The carrier in claim 1, wherein said holes have a dimension of between about 1 mm and about 10 mm. 52. The carrier in claim 1, wherein said membrane is a consumable item that requires replacement from time to time and a plurality of holes are provided so that the membrane may be removed without a need to disassemble said carrier. 53. The carrier in claim 1, wherein said subcarrier plate further includes a passage from communicating said third pressure from an external source into said third chamber. 54. The carrier in claim 1, wherein said subcarrier plate further includes a cavity disposed about said passage for providing a reservoir for polishing slurry and preventing said polishing slurry from being drawn into said passage when a vacuum is applied to adhere said substrate to said membrane. 55. The carrier in claim 1, wherein a vacuum is applied to said third chamber to hold said substrate to said membrane before and after polishing. 56. The carrier in claim 1, wherein said cavity has a conical shape to facilitate drainage of said polishing slurry from said cavity and from between said membrane and said subcarrier plate. 57. The carrier in claim 1, wherein a backside substrate support is provided for supporting the substrate during mounting. 58. The carrier in claim 1, wherein a plurality of channels are provided for checking for the presence of a substrate. 59. A carrier for a substrate polishing apparatus, comprising: a subcarrier plate; a first pressure chamber disposed to generate a first downward pressure on said subcarrier plate: a membrane having a substrate receiving surface and coupled to said subcarrier plate, an annular outer peripheral portion of said membrane mounted to said subcarrier plate, an inner circular portion of said membrane separated from said subcarrier plate and defining a second pressure chamber for generating a second pressure; and said substrate being mountable to said membrane at both said annular outer peripheral portion and at said inner circular portion; and said annular outer peripheral portion exerting said first pressure against an outer peripheral edge of said substrate and said inner circular portion exerting said second pressure against said substrate. 60. A method for planarizing a substrate using an apparatus including a substrate subcarrier having a plate with an outer surface, a substrate receiving portion, and a substrate pressing member coupled to said plate and to said substrate receiving portion, said substrate pressing member including a f
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