Method and apparatus for cleaning flat workpieces within a semiconductor manufacturing system
원문보기
IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0202795
(2002-07-24)
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발명자
/ 주소 |
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인용정보 |
피인용 횟수 :
6 인용 특허 :
5 |
초록
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A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably includes a wafer rotating mechanism, a ste
A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably includes a wafer rotating mechanism, a steam inlet for applying steam to the active surface of the wafer as it is rotated and a liquid inlet for simultaneously applying a liquid to the back side surface of the wafer. A method for manufacturing an integrated circuit in accordance with the present invention includes subjecting an active surface of the wafer to a plurality of processes selected from a group including deposition, patterning, doping, planarization, ashing and etching, and steam cleaning the active surface at least once before, during, and after the plurality of processes. Preferably, an aqueous vapor phase is applied to the first surface of the wafer as an aqueous liquid phase is applied to the other surface of the wafer. Spinning the wafer urges condensate from the vapor phase to move toward the edge of the wafer as the wafer surfaces are cleaned.
대표청구항
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A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably includes a wafer rotating mechanism, a ste
A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably includes a wafer rotating mechanism, a steam inlet for applying steam to the active surface of the wafer as it is rotated and a liquid inlet for simultaneously applying a liquid to the back side surface of the wafer. A method for manufacturing an integrated circuit in accordance with the present invention includes subjecting an active surface of the wafer to a plurality of processes selected from a group including deposition, patterning, doping, planarization, ashing and etching, and steam cleaning the active surface at least once before, during, and after the plurality of processes. Preferably, an aqueous vapor phase is applied to the first surface of the wafer as an aqueous liquid phase is applied to the other surface of the wafer. Spinning the wafer urges condensate from the vapor phase to move toward the edge of the wafer as the wafer surfaces are cleaned. , Paluch; US-4919132, 19900400, Miser; US-5163424, 19921100, K.o slashed.hnke; US-5359998, 19941100, Lloyd; US-5485835, 19960100, Vande Streek et al.; US-5520173, 19960500, Kuhn; US-6098621, 20000800, Esnouf, 128/205.13
이 특허에 인용된 특허 (5)
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Toshima Masato, Apparatus and method for cleaning semiconductor wafers.
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Franca Daniel L. ; Ouimet ; Jr. George F. ; Ziemins Uldis A., Method and apparatus for ozone generation and surface treatment.
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Ham William E. (Mercerville NJ), Method for cleaning and drying semiconductors.
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Kunze-Concewitz Horst,DEX, Method of cleaning surfaces with water and steam.
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Peterson Ronald V. (Thousand Oaks CA) Krone-Schmidt Wilfried (Fullerton CA), System for precision cleaning by jet spray.
이 특허를 인용한 특허 (6)
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Breiling,Patrick; Rasberry,John D; Schlegel,Steve C, Active rinse shield for electrofill chemical bath and method of use.
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Breiling,Patrick; Rasberry,John D; Schlegel,Steve C, Active rinse shield for electrofill chemical bath and method of use.
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Cavazza, Gilbert, Method and device for treating a substrate.
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Sung, Chien-Min, Methods for enhancing chemical mechanical polishing pad processes.
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Shindo, Naoki; Iino, Tadashi, Substrate processing apparatus and substrate processing method.
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Emesh, Ismail; Epshteyn, Yakov; Gopalan, Periya; Chen, Guangshum; Yang, Xingbo, System and method for cleaning workpieces.
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