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A thermal spray or welding apparatus including a cored wire electrode with a sheath and a multiplex powder composite. The composite comprises micron-sized particles and sub-micron sized particles, including nano-scale particles, the particles mechanically cooperating to promote smooth powder flow, w

A thermal spray or welding apparatus including a cored wire electrode with a sheath and a multiplex powder composite. The composite comprises micron-sized particles and sub-micron sized particles, including nano-scale particles, the particles mechanically cooperating to promote smooth powder flow, which facilitates compaction of the cored wire electrode. The invention also includes a method of manufacture of the apparatus including the cored wire electrode and its method of use to deposit a low porosity coating with high levels of alloyed refractory elements that is adherent and low in oxide content.

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A thermal spray or welding apparatus including a cored wire electrode with a sheath and a multiplex powder composite. The composite comprises micron-sized particles and sub-micron sized particles, including nano-scale particles, the particles mechanically cooperating to promote smooth powder flow, w

A thermal spray or welding apparatus including a cored wire electrode with a sheath and a multiplex powder composite. The composite comprises micron-sized particles and sub-micron sized particles, including nano-scale particles, the particles mechanically cooperating to promote smooth powder flow, which facilitates compaction of the cored wire electrode. The invention also includes a method of manufacture of the apparatus including the cored wire electrode and its method of use to deposit a low porosity coating with high levels of alloyed refractory elements that is adherent and low in oxide content. upper stop portion. 9. The academic carrying apparatus as set forth in claim 8 wherein one of the vertical members of the utensil portions hash a plurality of vertical channels. 10. The academic carrying apparatus as set forth in claim 8 wherein the other of the vertical members of the utensil portions has a plurality of angled channels. 11. The academic carrying apparatus as set forth in claim 1 is formed of wood. 12. The academic carrying apparatus as set forth in claim 1 is formed of plastic. 13. The academic carrying apparatus as set forth in claim 1 is formed of wood and leather. 14. An academic carrying apparatus comprising, in combination: a body portion defining a storage compartment; the body portion having a plurality of panels defining a rear panel, front panel and a pair of side panels; a lid rotatably coupled to the rear panel and adjacent to an upper peripheral edge of the body portion, the lid having a pair of top latches for coupling with the front panel of the body portion to secure the lid thereto, and the lid has a handle portion, the handle portion includes a pair of slits for receiving utility straps; the rear panel having a pair of strap holders; and the pair of side panels defining a right side panel and a left side panel, with each side panel having a utensil portion mounted thereon. 15. An academic carrying apparatus comprising, in combination: a body portion defining a storage compartment; the body portion having a plurality of panels defining a rear panel, front panel and a pair of side panels; a lid rotatably coupled to the rear panel and adjacent to an upper peripheral edge of the body portion, the lid having a pair of top latches for coupling with the front panel of the body portion to secure the lid thereto; the rear panel having a pair of strap holders, and the rear panel further including a backrest attached below a lower set of strap holders; and the pair of side panels defining a right side panel and a left side panel, with each side panel having a utensil portion mounted thereon. . 2. A semiconductor wafer cleaving apparatus as set forth in claim 1, comprising a slide mechanism for connecting said respective fulcrum members to said dynamic load applying means, the connection such that fulcrum tip ends of said respective fulcrum members on the semiconductor wafer are parallel to a plane where said fulcrum force on the semiconductor wafer is applied. 3. A semiconductor wafer cleaving apparatus as set forth in claim 1, comprising a damper member for receiving at least a portion of the semiconductor wafer after a cleaving operation.