초록

A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.

대표청구항 ▼

1. A method of securing a substrate to a carrier head, comprising: positioning the substrate against a flexible membrane of the carrier head, the flexible membrane including an inner portion and a lip portion; evacuating a chamber on a side of the flexible membrane opposite the substrate to pull

1. A method of securing a substrate to a carrier head, comprising: positioning the substrate against a flexible membrane of the carrier head, the flexible membrane including an inner portion and a lip portion; evacuating a chamber on a side of the flexible membrane opposite the substrate to pull the inner portion of the flexible membrane away from the substrate and draw the lip portion of the membrane against the substrate to form a seal therebetween so that the substrate is vacuum-chucked to the carrier head. 2. The method of claim 1, wherein positioning the substrate against a flexible membrane includes positioning a perimeter portion of the substrate against the lip portion of the flexible membrane. 3. The method of claim 2, wherein positioning the substrate against a flexible membrane includes positioning a center portion of the substrate against the inner portion of the flexible membrane. 4. The method of claim 1, further comprising moving a support structure vertically relative to a polishing surface, wherein the flexible membrane is secured to the support structure. 5. The method of claim 4, wherein moving the support structure includes moving the support structure and flexible membrane toward the polishing surface to bring the substrate into contact with the polishing surface. 6. The method of claim 4, wherein moving the support structure includes moving the support structure and flexible membrane away from the polishing surface to remove the substrate from the polishing surface. 7. The method of claim 1, wherein the flexible membrane extends beneath the support structure to define the chamber. 8. The method of claim 7, further comprising pressurizing the chamber to urge the substrate into contact with a polishing surface. 9. The method of claim 8, further comprising creating relative motion between the substrate and the polishing surface to polish the substrate. 10. The method of claim 1, further comprising pressurizing the chamber to force the inner portion of the flexible membrane outwardly and urge the lip portion of the flexible membrane away from the substrate to break the seal. 11. A flexible membrane for use in a carrier head, comprising: an inner portion with a lower surface to provide a mounting surface and a load; a lip portion surrounding and extending outwardly from the inner portion, the lip portion positioned and arranged such that, when a substrate is positioned against the mounting surface and a chamber on a side of the flexible membrane opposite the substrate is evacuated the inner portion of the flexible membrane is pulled away from the substrate and the lip portion is drawn against the substrate to form a seal therebetween. 12. The flexible membrane of claim 11, further comprising a juncture formed between the lip portion and the inner portion, the juncture being thicker than the inner portion. 13. The flexible membrane of claim 12, wherein the lip portion is thicker adjacent the juncture than at an outer rim portion thereof. 14. The flexible membrane of claim 13, wherein the lip portion tapers from a thickness about equal to the thickness of the juncture to a thickness about equal to the thickness of the inner portion. 15. The flexible membrane of claim 12, wherein the flexible membrane includes an edge portion extending from lip portion for connection to the carrier head. 16. The flexible membrane of claim 12, wherein at least part of the edge portion folds over the lip portion. 17. The flexible membrane of claim 12, wherein the edge portion does not extend over the lip portion.