$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Foam semiconductor polishing belts and pads 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-011/00
출원번호 US-0317973 (1999-05-25)
발명자 / 주소
  • Lombardo, Brian
출원인 / 주소
  • Peripheral Products Inc.
대리인 / 주소
    Proskauer Rose LLP
인용정보 피인용 횟수 : 10  인용 특허 : 64

초록

A method for making high density foam semiconductor polishing pads and belts with controlled, reproducible microcellular structure by mechanical frothing. The method involves agitating a liquid polymer resin at a controlled temperature and pressure in order to produce a stable froth. Next, the resin

대표청구항

1. A high density, microcellular polishing pad or belt with consistent cell structure and properties, produced by combining a thermosettable liquid polymer or prepolymer resin and a nucleation surfactant, agitating the resin mixture in the presence of a frothing agent at a controlled temperature and

이 특허에 인용된 특허 (64)

  1. Hartfelt Jorgen (36 Berkeley Dr. Horsholm MA DKX) Hoehn Ralf (36 Berkeley Dr. Chelmsford MA 01824), Abrasive of a microporous polymer matrix with inorganic particles thereon.
  2. Hyde Thomas C. (Chandler AZ) Roberts John V. H. (Newark DE), Apparatus for interlayer planarization of semiconductor material.
  3. Cote William J. (Poughquag NY) Ryan James G. (Newtown CT) Okumura Katsuya (Poughkeepsie NY) Yano Hiroyuki (Wappingers Falls NY), Apparatus for processing semiconductor wafers.
  4. Klein Rudolf (Oberhausen DEX), Coating method.
  5. Breivogel Joseph R. (Beaverton OR) Louke Sam F. (Portland OR) Oliver Michael R. (Tigard OR) Yau Leo D. (Portland OR), Composite polishing pad for semiconductor process.
  6. Corbett John M. (Midland MI), Compositions and process for making rigid plastic foams of modified vinyl ester resins and silicone compounds.
  7. Englund Richard L. (St. Paul MN) Schwartz Thomas W. (St. Paul MN), Compounding, glazing or polishing pad.
  8. Page John K. R. (Camberley GBX) Kalthod Dilip G. (St. Louis MO), Control of dissolved gases in liquids.
  9. Simpson, Scott S.; Yeznach, Anthony; Barton, Carlos L., Epoxy foam.
  10. Thicke Ricky P. (Stewartville MN) O\Brien Stanley B. (Hayfield MN) Nordyke David M. (Rochester MN) Fox Dennis L. (Rochester MN) Folkert Thomas E. (Hammond MN) Diemer Bruce R. (LeRoy MN), Fixed abrasive polishing media.
  11. Shukla Jayendra G. (Marietta GA) Sohn Ki G. (Penn Yan NY) Twickler Carl (Milford CT) de Pierne Otto S. (E. Norwalk CT), Fixed ophthalmic lens polishing pad.
  12. Hermann Paul F. (Boothbay Harbor ME), Foam substrate and micropackaged active ingredient particle composite dispensing materials.
  13. Kumagai Yasushi (Uji JPX) Ban Sukeo (Kusatsu JPX) Sasatani Yuichi (Kyoto JPX), Foamed polyurethane-forming composition, foamed polyurethane and process making the same.
  14. Barth Bruce P. (Bridgewater NJ) Johnson Robert N. (Basking Ridge NJ) Mayer Walter P. (Lebanon NJ), Frothable polyurethane composition and a cellular foam produced therefrom suitable for use in joints between wallboards.
  15. Hoffstein Mark F. (Newark DE) Shinagawa Takehisa (Sakai JPX), Inverted cell pad material for grinding, lapping, shaping and polishing.
  16. Talieh Homayoun (Santa Clara County CA) Weldon David Edwin (Santa Cruz County CA), Linear polisher and method for semiconductor wafer planarization.
  17. Cravens Thomas E. (Lake Jackson TX), Low density rapid-setting polyurethanes.
  18. Bergvist Robert C. (Fort Mill SC), Mechanically frothed plastisols.
  19. Veiga Manuel J. (Tewksbury MA) Satin Richard J. (Swampscott MA), Method for forming a sound attenuation composite.
  20. Budinger William D. ; Jensen Elmer William ; McClain Harry George ; Roberts John V. H. ; Reinhardt Heinz F., Method for planarizing a semiconductor device surface with polymeric pad containing hollow polymeric microelements.
  21. Schultz Laurence D. (Boise ID) Tuttle Mark E. (Boise ID) Doan Trung T. (Boise ID), Method for planarizing semiconductor wafers with a non-circular polishing pad.
  22. Stanga Michael Allen ; Stevens Robert Edward ; Wiese Kevin Dale ; Rauscher Wanda Wells ; Whitmarsh Robert H. ; Cobb Vicky Sue, Method for preparing flexible polyurethane foams.
  23. Hermann Paul F. (Boothbay Harbor ME), Method of forming a foam substrate and micropackaged active ingredient particle composite.
  24. Bessette Michael D. (Storrs CT) Jerard Robert B. (Hanover NH), Method of molding a mechanically frothed urethane resin foam and an open-top injection mold therefore.
  25. Burkhart Georg,DEX ; Langenhagen Rolf-Dieter,DEX ; Weier Andreas,DEX, Method of preparing polyurethane foam utilizing block copolymers having linked siloxane blocks.
  26. Schisler Robert C. (Akron OH) Downey Raymond E. (Copley OH), Method of producing a foam from a radiation-curable composition.
  27. Schisler Robert C. (Akron OH) Downey Raymond E. (Copley OH), Method of producing a foam from a radiation-curable composition.
  28. Eisen Norbert,DEX ; Heinemann Torsten,DEX ; McCullough Dennis ; Klan Walter,DEX, Method of producing hydrocarbon-expanded rigid polyurethane foams.
  29. Blizard Kent ; Okamoto Kelvin T. ; Anderson Jere R., Microcellular articles and methods of their production.
  30. Prokai Bela (Mahopac NY) Kanner Bernard (West Nyack NY), Organosilicone polymers.
  31. Prokai Bela (Mahopac NY) Kanner Bernard (West Nyack NY), Organosilicone polymers in polyurethane foams for carpet backing.
  32. Budinger William D. (Kennett Square PA) Jensen Elmer W. (Wilmington DE), Pad material for grinding, lapping and polishing.
  33. Borel Georg (Reutlingen DEX), Papermachine fabric in the form of a spiral link belt covered with nonwoven fabric.
  34. Jensen Elmer W. (New Castle DE), Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear p.
  35. Tuttle Mark E. (Boise ID), Polishing pad.
  36. Pierce John M. (Palo Alto CA) Renteln Peter H. (Cupertino CA), Polishing pad and method for polishing semiconductor wafers.
  37. Thomas Michael E. (Milpitas CA), Polishing pad for planarization.
  38. Takiyama Masahiro (Shiojiri JPX) Miyazaki Kunihiro (Shiojiri JPX) Shiozawa Kenichiro (Ashiya JPX), Polishing pad for semiconductor wafers.
  39. Tuttle Mark E. (Boise ID), Polishing pad with uniform abrasion.
  40. Roberts John V. H. (Newark DE), Polishing pads.
  41. Cook Lee M. (Steelville PA) Roberts John V. H. (Newark DE) Jenkins Charles W. (Newark DE) Pillai Raj R. (Newark DE), Polishing pads and methods for their use.
  42. Yu Chris C. (Austin TX), Polishing pads used to chemical-mechanical polish a semiconductor substrate.
  43. Kimura Tsuguji (5-7-17 Asahi-Chou Souka-City ; Saitama Prefec. 340 JPX) Watanabe Shinichi (4-4 Enkaiji Touyo-City ; Ehime Prefec. 799-13 JPX), Polishing sheet material and method for its production.
  44. Rowlands Jeffrey P. (Jona S. Gallen CHX), Polymer-modified polyols useful in polyurethane manufacture.
  45. Reinhardt Heinz F. (Chadds Ford PA) Roberts John V. H. (Newark DE) McClain Harry G. (Middletown DE) Budinger William D. (Newark DE) Jensen Elmer W. (New Castle DE), Polymeric polishing pad containing hollow polymeric microelements.
  46. Blevins ; II Charles H. (Beacon NY) Herdle William B. (Greenburgh NY) Murphy Gerald J. (Wappingers Falls NY), Polysiloxane-polyoxyalkylene terpolymers for polyurethane foam manufacture.
  47. Otto Jeffrey B. (Brooklyn CT), Polyurethane foam product and process of manufacture thereof from thermosetting frothed mixture.
  48. Fishbein John (Marlow EN) Bell Raymond William Henry (Great Kings Hill EN) Clarke Anthony James (Chinnor EN) Merriman Peter (Stratford-On-Avon EN), Polyurethane foams.
  49. Prokai Bela (Mahopac NY) Kanner Bernard (West Nyack NY), Polyurethane foams stabilized with hydrolyzable polysiloxane copolymers.
  50. Sulzbach Hans-Michael,DEX ; Althausen Ferdinand,DEX ; Raffel Reiner,DEX ; Eiben Robert,DEX ; Ebeling Wilfried,DEX, Process for foam production using carbon dioxide dissolved under pressure.
  51. Grier Laura A. (Brazoria TX) Neill Paul L. (Lake Jackson TX) Priester Ralph D. (Lake Jackson TX) Mobley Larry W. (Cohutta GA) Skaggs Kenneth W. (Lake Jackson TX) Turner Robert B. (Lake Jackson TX), Process for preparation of polyurethanes utilizing novel catalysts.
  52. Prokai Bela (Mahopac NY) Kanner Bernard (West Nyack NY), Process for preparing shaped, foamed polyurethane articles.
  53. Duffy Robert D., Process for producing froth polyurethane foam.
  54. Duffy Robert D. (West Chester PA), Process for producing froth polyurethane foam.
  55. Lamberts Wilhelm (Leverkusen DEX) Eisen Norbert (Koln DEX) Thompson-Colon James (Clara MXX), Process for the production of hard polyurethane foams.
  56. Neuhaus Alfred (Leverkusen DEX) Ganster Otto (Odenthal DEX) Mengal Manfred (Odenthal DEX), Process for the production of polyurethane foam moldings.
  57. McVey Susan B., Silicone surfactant compositions useful in inert gas blown polyurethane foams.
  58. Chojnacki Jennifer Ann ; Sabram Karla Asuncion, Silicone surfactants for rigid polyurethane foam made with third generation blowing agents.
  59. Gerkin Richard M. (Kanawha WV) Harakal Mark E. (Kanawha WV) Lawler Lee F. (Kanawha WV) Miller Glenn A. (Kanawha WV), Silicone surfactants for use in inert gas blown polyurethane foams.
  60. Lefferts Johannes (Enschede NLX), Spiral link belt with composite helices.
  61. Lefferts Johannes (Enschede NLX), Spiral link belt with low permeability to air and method for its production.
  62. Jensen ; Jr. Elmer W. (Norwalk CT), Substrate containing fibers of predetermined orientation and process of making the same.
  63. Budnik Richard A. (Mount Kisco NY) Blevins ; II Charles H. (San Jose CA) Murphy Gerald J. (Wappingers Falls NY) Grabowski Wojciech (Versoix TX CHX) Cobb Raymond L. (Buda TX), Surfactants for manufacture of urethane foams.
  64. Lee Byoung-hun,KRX, Wafer polishing device.

이 특허를 인용한 특허 (10)

  1. Koetas,Joseph P.; Leviton,Alan E.; Norton,Kari Ell; November,Samuel J.; Robertson,Malcolm W.; Saikin,Alan H., Apparatus for forming a polishing pad having a reduced striations.
  2. Kolesar,David M.; Post,Robert L.; Saikin,Alan H.; Sarafinas,Aaron, Apparatus for forming a striation reduced chemical mechanical polishing pad.
  3. Kulp,Mary Jo, Chemical mechanical polishing pad.
  4. Kulp,Mary Jo, Chemical mechanical polishing pad.
  5. Huang, David Picheng; Zhou, Ming; Moser, Timothy Dale, Damping polyurethane CMP pads with microfillers.
  6. Balijepalli, Sudhakar; Aldrich, Dale J.; Grier, Laura A., Materials and methods for chemical-mechanical planarization.
  7. Koetas,Joseph P.; Leviton,Alan E.; Norton,Kari Ell; November,Samuel J.; Robertson,Malcolm W.; Saikin,Alan H., Method of forming a polishing pad having reduced striations.
  8. Balijepalli,Sudhakar; Aldrich,Dale J.; Grier,Laura A.; Erdem,Bedri; Meyers,Gregory F., Method of manufacturing a fixed abrasive material.
  9. Litke, Brian; Koss, Michele K., Polishing pad, composition for the manufacture thereof, and method of making and using.
  10. Zhang, Yong; Huang, David; Sun, Lu, Polyurethane composition for CMP pads and method of manufacturing same.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로