초록 ▼

Elastomeric stamps facilitate direct patterning of electrical, biological, chemical, and mechanical materials. A thin film of material is deposited on a substrate. The deposited material, either originally present as a liquid or subsequently liquefied, is patterned by embossing at low pressure using

Elastomeric stamps facilitate direct patterning of electrical, biological, chemical, and mechanical materials. A thin film of material is deposited on a substrate. The deposited material, either originally present as a liquid or subsequently liquefied, is patterned by embossing at low pressure using an elastomeric stamp having a raised pattern. The patterned liquid is then cured to form a functional layer. The deposition, embossing, and curing steps may be repeated numerous times with the same or different liquids, and in two or three dimensions. The various deposited layers may, for example, have varying electrical characteristics, interacting so as to produce an integrated electronic component.

대표청구항 ▼

Elastomeric stamps facilitate direct patterning of electrical, biological, chemical, and mechanical materials. A thin film of material is deposited on a substrate. The deposited material, either originally present as a liquid or subsequently liquefied, is patterned by embossing at low pressure using

Elastomeric stamps facilitate direct patterning of electrical, biological, chemical, and mechanical materials. A thin film of material is deposited on a substrate. The deposited material, either originally present as a liquid or subsequently liquefied, is patterned by embossing at low pressure using an elastomeric stamp having a raised pattern. The patterned liquid is then cured to form a functional layer. The deposition, embossing, and curing steps may be repeated numerous times with the same or different liquids, and in two or three dimensions. The various deposited layers may, for example, have varying electrical characteristics, interacting so as to produce an integrated electronic component. c horn. The ultrasonic horn and anvil are collectively mounted and configured such that the ultrasonic horn and anvil can be brought together to define the nip. The frame, anvil support apparatus, and horn support apparatus collectively are sufficiently rigid that the horn and anvil can be brought together with interference levels of about 0.000 to about 0.008 inch at a raised bonding portion in combination with defining sufficient nip pressure to develop ultrasonic bonds in work piece segments passing through the nip. The method comprehends bringing a back-up roll, mounted above the ultrasonic horn, into engagement with the ultrasonic horn, to directly support the horn. First and second support rolls can be used to releasably support opposing sides of the outer surface of the ultrasonic horn, preferably below the axis of the horn, whereby the support rolls can be used to lift the horn into engagement with the back-up roll.