초록 ▼

A receive filter receives signals from a communication channel. The received signals correspond to original Walsh covered chip sequences transmitted by a transmit filter through the communication channel to the receive filter. The received signals are processed by an equalizer to generate a soft est

A receive filter receives signals from a communication channel. The received signals correspond to original Walsh covered chip sequences transmitted by a transmit filter through the communication channel to the receive filter. The received signals are processed by an equalizer to generate a soft estimate of chip sequences corresponding to the original Walsh covered chip sequences. An N chip Walsh decover is then utilized to generate a soft estimate of code symbols corresponding to the soft estimate of the chip sequences. A number of symbol slicers are then used in parallel to produce a hard estimate of the code symbols corresponding to the soft estimate of code symbols generated by the N chip Walsh decover. Thereafter an N chip Walsh cover is used as part of a scheme to generate a hard estimate of chip sequences corresponding to the hard estimate of the code symbols generated by the symbol slicers. The hard estimate of the chip sequences generated with the aid of the N chip Walsh cover, and the soft estimate of the chip sequences generated by the equalizer, are used to generate a tracking mode error signal to adapt the response of the equalizer to the received signals.

대표청구항 ▼

A receive filter receives signals from a communication channel. The received signals correspond to original Walsh covered chip sequences transmitted by a transmit filter through the communication channel to the receive filter. The received signals are processed by an equalizer to generate a soft est

A receive filter receives signals from a communication channel. The received signals correspond to original Walsh covered chip sequences transmitted by a transmit filter through the communication channel to the receive filter. The received signals are processed by an equalizer to generate a soft estimate of chip sequences corresponding to the original Walsh covered chip sequences. An N chip Walsh decover is then utilized to generate a soft estimate of code symbols corresponding to the soft estimate of the chip sequences. A number of symbol slicers are then used in parallel to produce a hard estimate of the code symbols corresponding to the soft estimate of code symbols generated by the N chip Walsh decover. Thereafter an N chip Walsh cover is used as part of a scheme to generate a hard estimate of chip sequences corresponding to the hard estimate of the code symbols generated by the symbol slicers. The hard estimate of the chip sequences generated with the aid of the N chip Walsh cover, and the soft estimate of the chip sequences generated by the equalizer, are used to generate a tracking mode error signal to adapt the response of the equalizer to the received signals. inserted into said electrode plate with a defined tolerance between said insulator element and the respective hole in said electrode plate through which the respective duct is inserted. 4. The laser discharge unit according to claim 3, wherein said ducts and holes have a circular cross section. 5. The laser discharge unit according to claim 2, wherein a gas-tight seal is provided between said ducts and said electrode plate. 6. The laser discharge unit according to claim 4, wherein a gas-tight ring-shaped seal is provided between said ducts and said electrode plate. 7. The laser discharge unit according to claim 6, further comprising: a sleeve enclosing, each of the cores, said sleeves having an inner end supported by the electrode plate and an outer free end; wherein said cores have an inner end connected to the high voltage electrode and a threaded outer free end extending beyond the free end of the sleeves, and a nut screwed onto the threaded end of each core thereby pressing the sleeves against the electrode plate and tensioning the cores by pulling them. 8. The laser discharge unit according to claim 7, wherein the inner end of the core is provided with a first shoulder and a sealing element is disposed between the first shoulder and the insulator, and wherein the first shoulder of said core is pressed against the insulator by the tensioned core. 9. The laser discharge unit according to claim 8, wherein the insulator includes a second shoulder positioned to oppose the electrode plate, and a second sealing element is disposed between said second shoulder and said electrode plate, and wherein the second shoulder is pressed by means of the tensioned core via the first shoulder. 10. The laser discharge unit according to claim 1, wherein said high voltage electrode is carried by said ducts. 11. The laser discharge unit according to claim 10, wherein said ducts are carried by said electrode plate. 12. The laser discharge unit according to claim 11, wherein each of said ducts are inserted into said electrode plate with a defined tolerance between said insulator element and the respective hole in said electrode plate through which the respective duct is inserted. 13. The laser discharge unit according to claim 12, wherein said ducts and holes have a circular cross section. 14. The laser discharge unit according to claim 10, wherein a gas-tight seal is provided between said ducts and said electrode plate. 15. The laser discharge unit according to claim 12, wherein a gas-tight ring-shaped seal is provided between said ducts and said electrode plate. 16. The laser discharge unit according to claim 10, wherein said ground electrode is carried by said electrode plate. 17. The laser discharge unit according to claim 16, wherein said ducts are carried by said electrode plate. 18. The laser discharge unit according to claim 17, wherein each of said ducts are inserted into said electrode plate with a defined tolerance between said insulator element and the respective hole in said electrode plate through which the respective duct is inserted. 19. The laser discharge unit according to claim 18, wherein said ducts and holes have a circular cross section. 20. The laser discharge unit according to claim 16, wherein a gas-tight seal is provided between said ducts and said electrode plate. 21. The laser discharge unit according to claim 19, wherein a gas-tight ring-shaped seal is provided between said ducts and said electrode plate. 22. The laser discharge unit according to claim 1, wherein said insulator elements are made of a fluoride material. 23. The laser discharge unit according to claim 1, wherein said insulator elements have a shape which conically expands towards said high voltage electrode and comprise a corrugated surface, so as to increase a creepage path extending along said surface. 24. The laser discharge unit according to claim 1, further comprising a first and a second corona pre-ionizer, located adjacent to opposing edg es of said high voltage electrode, wherein said corona pre-ionizers comprise a conductive core and a surrounding tube-shaped insulator. 25. The laser discharge unit according to claim 1, which is adapted to be used in an excimer laser. 26. A module-type gas laser, comprising a tube containing a gas mixture comprising a laser gas; a discharge unit removably mounted inside said tube, said discharge unit comprising an elongated high voltage electrode and an elongated ground electrode spaced apart from each other so as to generate a gas discharge gap between said two electrodes; laser gas circulation means disposed within said tube; a first laser optical element disposed at one end of said discharge gap; and a second laser optical element disposed at the second end of said discharge gap; wherein said discharge unit is a module-type discharge unit, such that it is removably mountable into said tube as one integrated unit, and said discharge electrodes are adjustable with respect to each other when said discharge unit is completely removed from said tube. 27. The module-type gas laser according to claim 26, wherein said discharge unit further comprises; an elongated electrode plate having a plurality of spaced-apart holes therein; a plurality of coaxial high voltage ducts, each duct extending through one of the holes in said electrode plate, each duct comprising a central conductive core and an insulator element being arranged around said core and electrically insulating said core from said electrode plate; wherein said ducts are carried by said electrode plate; said high voltage electrode is electrically connected to said cores of said ducts and said ground electrode is electrically connected to said electrode plate, said high voltage electrode is carried by said ducts; and said ground electrode is carried by said electrode plate. 28. The module-type gas laser according to claim 27, wherein each of said ducts are inserted into said electrode plate with a defined tolerance between said insulator element and a respective hole in said electrode plate through which the respective duct is inserted. 29. The module-type gas laser according to claim 28, wherein said ducts and holes have a circular cross section. 30. The module-type gas laser according to claim 27, wherein a gas-tight seal is provided between said ducts and said electrode plate. 31. The module-type gas laser according to claim 29, wherein a gas-tight ring-shaped seal is provided between said ducts and said electrode plate. 32. The module-type gas laser according to claim 31, further comprising: a sleeve enclosing the core, said sleeve having an inner end supported by the electrode plate and an outer free end; wherein said cores have an inner end connected to the high voltage electrode and a threaded outer free end extending beyond the free end of the sleeves, and a nut is screwed onto the threaded end of each core thereby pressing the sleeve against the electrode plate and tensioning the cores by pulling them. 33. The module-type gas laser according to claim 32, wherein the inner end of the core is provided with a first shoulder and a sealing element is disposed between the first shoulder and the insulator, and wherein the first shoulder of said core pressed against the insulator by the tensioned core. 34. The module-type gas laser according to claim 34, wherein the insulator includes a second shoulder positioned to oppose the electrode plate, and a second sealing element is disposed between said second shoulder and said electrode plate, and wherein the second shoulder is pressed by means of the tensioned core via the first shoulder. 35. The module-type gas laser of claim 34, wherein a ring surrounds each sleeve, said rings having at their outer circumference a flange that is supported by an outer rim of the holes in the tube through which the respective duct is inserted, and the electrode plate has a mating shoulder supported at an inner rim o