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Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-001/00
출원번호 US-0651345 (2000-08-29)
발명자 / 주소
  • Tolles, Robert D.
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Moser, Patterson and Sheridan
인용정보 피인용 횟수 : 73  인용 특허 : 22

초록 ▼

The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from the chemical mechanical polishing process is pr

대표청구항 ▼

The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from the chemical mechanical polishing process is pr

이 특허에 인용된 특허 (22)

  1. Birang Manoocher ; Pyatigorsky Grigory, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations.
    상세보기
  2. Hyde Thomas C. (Chandler AZ) Roberts John V. H. (Newark DE), Apparatus for interlayer planarization of semiconductor material.
    상세보기
  3. Rostoker Michael D. (San Jose CA), Detecting the endpoint of chem-mech polishing and resulting semiconductor device.
    상세보기
  4. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
    상세보기
  5. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
    상세보기
  6. Lustig Naftali E. (Croton-on-Hudson NY) Saenger Katherine L. (Ossining NY) Tong Ho-Ming (Yorktown Heights NY), In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing.
    상세보기
  7. Tang Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical po.
    상세보기
  8. Wiswesser Andreas Norbert,DEX ; Pan Judon Tony ; Swedek Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.
    상세보기
  9. Jairath Rahul ; Pecen Jiri ; Chadda Saket ; Krusell Wilbur C. ; Cutini Jerauld J. ; Engdahl Erik H., Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher.
    상세보기
  10. Schultz Laurence D. (Boise ID), Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer.
    상세보기
  11. Sandhu Gurtej S. (Boise) Doan Trung T. (Boise ID), Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image o.
    상세보기
  12. Birang Manoocher ; Gleason Allan ; Guthrie William L., Method of forming a transparent window in a polishing pad.
    상세보기
  13. Holzapfel Paul ; Schlueter James ; Karlsrud Chris ; Lin Warren, Methods and apparatus for detecting removal of thin film layers during planarization.
    상세보기
  14. Roberts John V. H. ; Pinheiro Barry Scott ; James David B., Molded polishing pad having integral window.
    상세보기
  15. Koos Daniel A. (Boise ID) Meikle Scott (Boise ID), Optical end point detection methods in semiconductor planarizing polishing processes.
    상세보기
  16. Takahashi Tsutomu (Yokohama JPX) Tohyama Keiichi (Kawasaki JPX) Takahashi Tamami (Yamato JPX), Polishing apparatus having endpoint detection device.
    상세보기
  17. Hiyama Hirokuni,JPX ; Wada Yutaka,JPX, Polishing apparatus including thickness or flatness detector.
    상세보기
  18. Moriyama Shigeo (Tama JPX) Kawamura Yoshio (Kokubunji JPX) Homma Yoshio (Hinode-machi JPX) Kusukawa Kikuo (Fujino-machi JPX) Furusawa Takeshi (Hachioji JPX), Polishing method.
    상세보기
  19. Peter W. Freeman ; Stanley E. Eppert, Jr. ; Alan H. Saikin ; Marco A. Acevedo, Polishing pad.
    상세보기
  20. Roberts John V. H. (Newark DE), Polishing pads.
    상세보기
  21. Cook Lee M. (Steelville PA) Roberts John V. H. (Newark DE) Jenkins Charles W. (Newark DE) Pillai Raj R. (Newark DE), Polishing pads and methods for their use.
    상세보기
  22. Bajaj Rajeev ; Litvak Herbert E. ; Surana Rahul K. ; Jew Stephen C. ; Pecen Jiri, Wafer polishing device with movable window.
    상세보기

이 특허를 인용한 특허 (73)

  1. Roberts, John V. H., Anti-scattering layer for polishing pad windows.
    상세보기
  2. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  3. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  4. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  5. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.
    상세보기
  6. Agarwal,Vishnu K., Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  7. Agarwal,Vishnu K., Apparatuses for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
    상세보기
  8. Repper, Angus; Leugers, Mary A.; James, David B.; DeGroot, Marty W., Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad.
    상세보기
  9. Allison, William; Huang, Ping; Scott, Diane; Frentzel, Richard; Kerprich, Robert, CMP pad with local area transparency.
    상세보기
  10. Yun,Hyun Joo; Lim,Young Sam; Boo,Jae Pil, Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity.
    상세보기
  11. Roy, Pradip K.; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
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  12. Roy, Pradip K.; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
    상세보기
  13. Roy, Pradip K.; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
    상세보기
  14. Roy, Pradip K; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
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  15. Wiswesser,Andreas Norbert; Schoenleber,Walter, Endpoint detection with multiple light beams.
    상세보기
  16. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
    상세보기
  17. Redeker,Fred C.; Birang,Manoocher; Li,Shijian; Somekh,Sasson, Linear polishing sheet with window.
    상세보기
  18. Birang, Manoocher; Swedek, Boguslaw A.; Kim, Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
    상세보기
  19. Birang,Manoocher; Swedek,Boguslaw A.; Kim,Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
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  20. Fukuda, Takeshi; Watanabe, Tsuguo; Hirose, Junji; Nakamura, Kenji; Doura, Masato, Method for manufacturing polishing pad.
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  21. Fukuda, Takeshi; Watanabe, Tsuguo; Hirose, Junji; Nakamura, Kenji; Doura, Masato, Method for manufacturing polishing pad.
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  22. Fukuda, Takeshi; Watanabe, Tsuguo; Hirose, Junji; Nakamura, Kenji; Doura, Masato, Method for manufacturing polishing pad.
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  23. Jensen, Michelle; Qian, Bainian; Yeh, Fengji; DeGroot, Marty W.; Islam, Mohammad T.; Van Hanehem, Matthew Richard; String, Darrell; Murnane, James; Hendron, Jeffrey James; Nowland, John G., Method of chemical mechanical polishing a substrate.
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  24. Boldizar,Mark J.; Gamble,Robert T.; Hedrick,Vincent Matthew; Lawhorn,Jason M.; Saikin,Alan H.; Tome,Katherine L., Method of forming a layered polishing pad.
    상세보기
  25. Swedek,Boguslaw A.; Birang,Manoocher, Method of forming a polishing pad for endpoint detection.
    상세보기
  26. Birang, Manoocher; Gleason, Allan; Guthrie, William L., Method of forming a transparent window in a polishing pad.
    상세보기
  27. Wiswesser, Andreas Norbert; Oshana, Ramiel; Hughes, Kerry F.; Rohde, Jay; Huo, David Datong; Benvegnu, Dominic J., Method of making and apparatus having polishing pad with window.
    상세보기
  28. Elledge, Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.
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  29. Elledge,Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.
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  30. Elledge,Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.
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  31. Tsai, Stan D.; Chang, Shou-Sung; Chen, Liang-Yuh, Multi-layer polishing pad.
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  32. Duboust, Alain; Chang, Shou-Sung; Lu, Wei; Neo, Siew; Wang, Yan; Manens, Antoine P.; Moon, Yongsik, Multi-layer polishing pad for low-pressure polishing.
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  33. Prasad, Abaneshwar; Sevilla, Roland K.; Lacy, Michael S., Multi-layer polishing pad material for CMP.
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  34. Prasad,Abaneshwar; Lacy,Michael S., Multi-layer polishing pad material for CMP.
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  35. Murnane, James; Qian, Bainian; Nowland, John G.; Jensen, Michelle K.; Hendron, Jeffrey James; DeGroot, Marty W.; James, David B.; Yeh, Fengji, Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer.
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  36. Tolles, Robert D., Multilayer polishing pad and method of making.
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  37. Takahashi, Shogo; Shimizu, Hajime, Perforated-transparent polishing pad.
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  38. Moore, Scott E., Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates.
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  39. Menk, Gregory E.; McReynolds, Peter; Rondum, Erik S.; Iyer, Anand N.; Prabhu, Gopalakrishna B.; Leung, Garlen C., Polishing article with integrated window stripe.
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  40. Menk, Gregory E.; McReynolds, Peter; Rondum, Erik S.; Iyer, Anand N.; Prabhu, Gopalakrishna B.; Leung, Garlen C., Polishing article with integrated window stripe.
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  41. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing assembly with a window.
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  42. Fukuda, Takeshi; Hirose, Junji; Nakai, Yoshiyuki; Kimura, Tsuyoshi, Polishing pad.
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  46. Prasad,Abaneshwar, Polishing pad comprising hydrophobic region and endpoint detection port.
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  47. Kim,Jin Kook; Boo,Jae Phil; Lee,Sang Seon; Kim,Jong Bok, Polishing pad for chemical mechanical polishing apparatus.
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  48. Swedek, Boguslaw A.; Birang, Manoocher, Polishing pad for endpoint detection and related methods.
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  49. Swedek, Boguslaw A.; Birang, Manoocher, Polishing pad for endpoint detection and related methods.
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  52. Turner,Kyle A.; Beeler,Jeffrey L.; Newell,Kelly J., Polishing pad with recessed window.
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  55. Tolles, Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.
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