초록 ▼

A number of racks make up a stack. An upper rack includes releasable catches received into orifices in the next lower rack to releasably attach the two racks to one another. A loader and receptacle cooperate with one another to release the bottommost rack from the stack and deposit it into the recep

A number of racks make up a stack. An upper rack includes releasable catches received into orifices in the next lower rack to releasably attach the two racks to one another. A loader and receptacle cooperate with one another to release the bottommost rack from the stack and deposit it into the receptacle where pipette cones held therein are accessible for use. The bottom rack is placed into the loader where it is held by catches engaging ribs of the rack. The stack of racks with the loader attached is placed onto the receptacle. The stack of racks is pressed downwardly. The downward movement releases the bottom rack from the loader. At the same time, studs projecting up from the bottom of the receptacle engage catches of the second-from-the-bottom rack and free the bottom rack. The bottom rack now rests freely in the receptacle.

대표청구항 ▼

A number of racks make up a stack. An upper rack includes releasable catches received into orifices in the next lower rack to releasably attach the two racks to one another. A loader and receptacle cooperate with one another to release the bottommost rack from the stack and deposit it into the recep

A number of racks make up a stack. An upper rack includes releasable catches received into orifices in the next lower rack to releasably attach the two racks to one another. A loader and receptacle cooperate with one another to release the bottommost rack from the stack and deposit it into the receptacle where pipette cones held therein are accessible for use. The bottom rack is placed into the loader where it is held by catches engaging ribs of the rack. The stack of racks with the loader attached is placed onto the receptacle. The stack of racks is pressed downwardly. The downward movement releases the bottom rack from the loader. At the same time, studs projecting up from the bottom of the receptacle engage catches of the second-from-the-bottom rack and free the bottom rack. The bottom rack now rests freely in the receptacle. o a corresponding alcohol is achievable. ality of electrostatic actuators that are flexibly suspended from a support frame; etching a mirror support post from a mirror layer substrate; bonding the freely moveable plate in the actuation layer substrate to the mirror support post in the mirror layer substrate; bonding the reference layer substrate to the actuation layer substrate so that the actuation layer substrate is held above the reference layer substrate by the plurality of standoff posts; depositing a reflective layer on the surface of the mirror layer substrate; and etching through the reflective layer and the mirror layer substrate to release the microelectromechanical mirror. 16. The method of claim 15, wherein the step of etching an actuation layer from an actuation layer substrate further comprises etching a plurality of pairs of torsional flexures in the actuation layer substrate to flexibly suspend-each electrostatic actuator from the support frame by a respective pair of torsional flexures. 17. The method of claim 15, wherein the step of etching an actuation layer from an actuation layer substrate further comprises etching a plurality of torsional flexures in the actuation layer substrate to flexibly suspend the freely movable plate from the plurality of electrostatic actuators. 18. The method of claim 15, wherein the step of depositing a plurality of control electrodes on the reference layer substrate further comprises depositing a metallic layer on the surface of the reference layer substrate; and etching the plurality of control electrodes from the metallic layer. 19. The method of claim 18, further comprising etching addressing circuitry out of the metallic layer deposited on the reference layer substrate to address the plurality of control electrodes formed thereon. 20. The method of claim 15, wherein the actuation layer substrate is etched with a high aspect ratio etch. 21. The method of claim 15, further comprising etching a plurality of divots in the surface of the reference layer substrate. 22. The method of claim 15, further comprising depositing a mechanical stopping layer on the surface of the reference layer substrate to electrically isolate the plurality of electrostatic actuators from the plurality of control electrodes. 23. The method of claim 15, wherein the plurality of standoff posts are made from a photoimageable material. 24. The method of claim 23, wherein the step of depositing a plurality of standoff posts on the surface of the reference layer substrate further comprises depositing a polyimide layer on the surface of the reference layer substrate; and etching the polyimide layer to form the plurality of standoff posts. 25. The method of claim 15, wherein the standoff posts serve as both a separation layer to hold the actuation layer substrate above the reference layer substrate, and as a bonding layer to bond the actuation layer substrate to the reference layer substrate. 26. The method of claim 15, wherein a low temperature bonding technique is used to bond the reference layer substrate to the actuation layer substrate. 27. The method of claim 26, wherein the low temperature bonding technique is chosen from the group consisting of solder bonding, eutectic bonding, polymeric bonding, and thermo-compression bonding. 28. The method of claim 15, wherein one or more of the reference, actuation, and mirror layer wafers are chosen with low total thickness variations. 29. The method of claim 15, wherein the reflective layer deposited on the surface of the mirror layer substrate comprises a metallic layer. 30. The method of claim 15, wherein the step of bonding the mirror support post of the mirror layer substrate to the freely movable plate of the actuation layer substrate further comprises fusion bonding the mirror support post to the freely movable plate. 31. The method of claim 15, wherein the step of etching through the reflective layer and the mirror layer substrate to release the microelectromechanical mirror further compris