IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0853605
(2001-05-14)
|
우선권정보 |
JP-0143990 (2000-05-16) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Nippon Electric Glass Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
9 인용 특허 :
11 |
초록
▼
Glass, for encapsulating a semiconductor, which is substantially free of lead or other harmful ingredients, but which exhibits a sealing temperature of not higher than 710° C., and which stably seals with Dumet. Further, when the glass has a viscosity of 106dPa·s, the temperature of said glass is no
Glass, for encapsulating a semiconductor, which is substantially free of lead or other harmful ingredients, but which exhibits a sealing temperature of not higher than 710° C., and which stably seals with Dumet. Further, when the glass has a viscosity of 106dPa·s, the temperature of said glass is not higher than 710° C., and includes two or more of Li2O, Na2O and K2O and B2O3. Also, the glass may comprise: SiO2,B2O3and Al2O3in an amount of from 40 to 70%, from 5 to 20% and from 0 to 15% by weight, respectively; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; and Li2O, Na2O and K2O in a total amount of from 5 to 25% by weight.
대표청구항
▼
1. An encapsulator, for encapsulating a semiconductor, wherein the encapsulator is in the form of a glass tube and capable of hermetically encapsulating the semiconductor which is clamped by an electrode material in the glass tube, and wherein the encapsulator comprises a glass tube including:
1. An encapsulator, for encapsulating a semiconductor, wherein the encapsulator is in the form of a glass tube and capable of hermetically encapsulating the semiconductor which is clamped by an electrode material in the glass tube, and wherein the encapsulator comprises a glass tube including: SiO2in an amount of from 40 to 70% by weight; B2O3in an amount of from 5 to 20% by weight; Al2O3in an amount of from 0 to 10% by weight; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; and at least two of Li2O, Na2O and K2O in a total amount of from 5 to 25% by weight, each based on the total amount of said glass, wherein said glass tube is free of lead. 2. The encapsulator, for encapsulating a semiconductor, according to claim 1, wherein the glass tube is produced by: melting a glass material to prepare molten glass; forming the molten glass to be a glass tube; cutting the glass tube to have a predetermined size, wherein the glass material is prepared to give the glass tube including: SiO2in an amount of from 40 to 70% by weight; B2O3in an amount of from 5 to 20% by weight; Al2O3in an amount of from 0 to 10% by weight; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% b weight; and at least two of Li2O, Na2O and K2O in a total amount of from 5 to 25% b weight, each based on the total amount of said glass, wherein said glass tube is free of lead. 3. The encapsulator, for encapsulating a semiconductor, according to claim 1, wherein the glass tube includes: SiO2in an amount of from 40 to 70% by weight; B2O3in an amount of from 5 to 20% by weight; Al2O3in an amount of from 0 to 10% by weight; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; at least two of Li2O, Na2O and K2O in a total amount of from 5 to 25% by weight; and TiO2in an amount of from 0 to 1.5% by weight, each based on the total amount of said glass, wherein said glass tube is free of lead. 4. The encapsulator, for encapsulating a semiconductor, according to claim 1, wherein the glass tube includes: SiO2in an amount of from 50.7 to 70% by weight; B2O3in an amount of from 5 to 20% by weight; Al2O3in an amount of from 0 to 10% by weight; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; and at least two of Li2O, Na2O and K2O in a total amount of from 5 to 25% by weight, each based on the total amount of said glass, wherein said glass tube is free of lead. 5. The encapsulator, for encapsulating a semiconductor, according to claim 1, wherein the glass tube includes: SiO2in an amount of from 40 to 70% by weight; B2O3in an amount of from 5 to 20% by weight; Al2O3in an amount of from 0 to 10% by weight; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; SrO in an amount of from 1 to 20% by weight; and at least two of Li2O, Na2O and K2O in a total amount of from 5 to 25% by weight, each based on the total amount of said glass, wherein said glass tube is free of lead.
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