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Thermal bus for cabinets housing high power electronics equipment 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0902088 (2001-07-10)
발명자 / 주소
  • Khrustalev, Dmitry
  • Zuo, Jon
출원인 / 주소
  • Thermal Corp.
대리인 / 주소
    Duane Morris LLP
인용정보 피인용 횟수 : 77  인용 특허 : 37

초록

A thermal bus is provided for cabinets housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators interconnected in flow communication with a condenser. Each evaporator is mounted in a support having a central recess and each having a tube havi

대표청구항

A thermal bus is provided for cabinets housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators interconnected in flow communication with a condenser. Each evaporator is mounted in a support having a central recess and each having a tube havi

이 특허에 인용된 특허 (37)

  1. Cutchaw John M. (7333 E. Virginia Ave. Scottsdale AZ 85257), Apparatus for cooling high-density integrated circuit packages.
  2. Tippmann Vincent P. (8605 N. River Rd. New Haven IN 46774) Tippmann Joseph R. (HRC-33 ; Box 8419 Rapid City SD 57701), Apparatus for heating and cooling food articles having removable plates with fluid sealed therein.
  3. Porter Warren W. (Escondido CA), Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices.
  4. Swanson Theodore D. ; Wren ; deceased Paul, Capillary pumped loop body heat exchanger.
  5. Edelstein Fred (Hauppauge NY) Haslett Robert A. (Dix Hills NY) Kosson Robert L. (Massapequa NY) Harwell William (Coram NY), Capillary-pumped heat transfer panel and system.
  6. Lebailly Michel (Bollene FRX) Taverdet Jean-Claude (Issirac FRX), Carrier for a card carrying electronic components and of low heat resistance.
  7. Martin Jacob (Wellesley MA), Combination conductive and convective heatsink.
  8. Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA), Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec.
  9. Kondou Yoshihiro (Ibaraki JPX) Matsushima Hitoshi (Ryugasaki JPX) Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Komatsu Toshihiro (Ibaraki JPX) Ohba Takao (Hadano JPX) Yamagiwa Akira (Ha, Cooling apparatus of electronic equipment.
  10. Osakabe Hiroyuki (Chita-gun JPX) Kawaguchi Kiyoshi (Toyota JPX) Suzuki Masahiko (Hoi-gun JPX), Cooling apparatus using boiling and condensing refrigerant.
  11. Osakabe Hiroyuki,JPX ; Furukawa Takashi,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Suzuki Manji,JPX, Cooling apparatus using boiling and condensing refrigerant.
  12. Osakabe Hiroyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX, Cooling apparatus using boiling and condensing refrigerant.
  13. Osakabe Hiroyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Sugito Hajime,JPX ; Kobayashi Kazuo,JPX ; Kadota Shigeru,JPX, Cooling apparatus using boiling and condensing refrigerant.
  14. Iversen Arthur H. (Saratoga CA), Cooling of large high power semi-conductors.
  15. Leyssens Francois J. C. (Mortsel BEX) Rombouts Hendrikus M. J. (Zoersel BEX), Cooling system.
  16. Hatada Toshio (Tsuchiura JPX) Atarashi Takayuki (Tsuchiura JPX) Daikoku Takahiro (Ushiku NY JPX) Kobayashi Satomi (New York NY) Zushi Shizuo (Hadano JPX) Kobayashi Fumiyuki (Sagamihara JPX) Iwai Susu, Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system.
  17. Morrison Robert A. (Long Beach CA), Cooling system for electronic modules.
  18. Takahiro Katoh JP; Kiyoo Amako JP, Electronic components cooling apparatus.
  19. LaViolette Kerry D. (Liverpool NY) Uhl Robert F. (Manlius NY) Vinkenvleugel Lucius T. (Eindhoven NLX), Electronics housing with improved heat rejection.
  20. Crowe Lawrence E. (Lindenwood IL), Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling.
  21. Chu Richard C. ; Chrysler Gregory M., Evaporator for use in an extended air cooling system for electronic components.
  22. Chu Richard C. ; Chrysler Gregory M., Extended air cooling with heat loop for dense or compact configurations of electronic components.
  23. Lynes Kenneth W. (Lindsay CAX) Nepovim Zdenek (Lindsay CAX), Finned housing.
  24. Cirrito Vincent (Massapequa Park NY) Koubek Kevin J. (South Setauket NY) Quadrini John A. (Northport NY), Heat pipe cooled electronic circuit card.
  25. Koizumi Hisao (Zushi JPX), Heat transfer apparatus.
  26. Berndlmaier Erich (Wappingers Falls NY) Clark Bernard T. (Poughquag NY) Dorler Jack A. (Wappingers Falls NY), Heat transfer structure for integrated circuit package.
  27. Lijoi Bruno (Farmingdale NY) Cirrito Vincent (Massapequa Park NY) Edelstein Fred (Hauppauge NY), Heat-pipe cooled electronic circuit card.
  28. Baum Walter (Hanover DEX) Still Michael (Langenhagen DEX) Becker Erich (Seeheim-Jugenheim DEX), Heat-producing elements with heat pipes.
  29. Budelman Gerald A. (Aloha OR), High efficiency heat removal system for electric devices and the like.
  30. Austin Thomas A. ; Greer Stephen ; Low Andrew, Integral heat pipe enclosure.
  31. Carlsten Ronald W. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Integrated heat pipe and circuit board structure.
  32. Bartilson Bradley W., Large area, multi-device heat pipe for stacked MCM-based systems.
  33. Balan Albert L. (Endwell NY), Multileveled electronic assembly with cooling means.
  34. Diggelmann Hans (Neuenegg CHX) Ulrich Bohdan (Kehrsatz CHX), Process and apparatus for dissipating the heat loss of at least one assembly of electrical elements.
  35. Ohashi Shigeo (Chiyoda JPX) Kuwabara Heikichi (Minori JPX) Nakajima Tadakatsu (Chiyoda JPX) Nakayama Wataru (Kashiwa JPX) Sato Motohiro (Minori JPX) Kasai Kenichi (Ushiku JPX), Semiconductor cooling apparatus and cooling method thereof.
  36. Larson Ralph I. ; Phillips Richard L., Two-phase thermal bag component cooler.
  37. Cima Richard M. (Palo Alto CA), Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system.

이 특허를 인용한 특허 (77)

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  10. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
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