초록 ▼

A method of manufacturing a transistor by using two layers of a silicon epitaxial layer is disclosed. In the first step of the manufacturing process, a spacer is formed around gate structures. Then, a first silicon epitaxial layer is grown on the wafer. Then, a second spacer is deposited and then et

A method of manufacturing a transistor by using two layers of a silicon epitaxial layer is disclosed. In the first step of the manufacturing process, a spacer is formed around gate structures. Then, a first silicon epitaxial layer is grown on the wafer. Then, a second spacer is deposited and then etched, such that the second spacer remains around a gate structure. Next a second silicon epitaxial layer is grown on the first silicon epitaxial layer, and the second spacer is etched from around the gate structure. After etching the first oxide spacer, ions are implanted at a first energy level to form four junctions. Then a third spacer is deposited and etched, so that the third spacer remains around the gate structures. Then ions are implanted at a second energy level to form two more junctions, each of these two junctions being located between two of the earlier formed junctions. The junctions and the gate structures provide a transistor structure. The resulting transistor has a good short channel effect because the junction depths are preferably all aligned. It also has good drive current because the junctions created by ion implantation at a second energy level have low parasitic resistance.

대표청구항 ▼

1. A method of manufacturing a transistor from a wafer having gate structures on the wafer, comprising the steps of: depositing a first spacer on the wafer and around the gate structures, and then etching the first spacer from the wafer such that the first spacer remains around the gate structure

1. A method of manufacturing a transistor from a wafer having gate structures on the wafer, comprising the steps of: depositing a first spacer on the wafer and around the gate structures, and then etching the first spacer from the wafer such that the first spacer remains around the gate structures; growing a first silicon epitaxial layer on the wafer; depositing a second spacer on the first silicon epitaxial layer and around the gate structures, and then etching the second spacer from the first silicon epitaxial layer such that the second spacer remains around the gate structures; growing a second silicon epitaxial layer on the first silicon epitaxial layer; etching the second spacer from around the gate structures; implanting ions to create a first, a second, a third and a fourth junction area; depositing a third spacer on the second silicon epitaxial layer and around the gate structures, and etching the third spacer from the second silicon epitaxial layer such that the third spacer remains around the gate structures; and implanting ions to create a fifth and a sixth junction area. 2. The method of claim 1, wherein the first, second, third and fourth junction areas are located near gate structures. 3. The method of claim 2, wherein the fifth junction area is located between the first and the second junction areas and the sixth junction area is located between the third and the fourth junction areas. 4. The method of claim 3, wherein the first, second, third and fourth junction areas have a first set of characteristics and the fifth and sixth junction areas have a second set of characteristics. 5. The method of claim 1, wherein the fifth junction area is located between the first and the second junction areas and the sixth junction area is located between the third and the fourth junction areas. 6. The method of claim 1, wherein the step of implanting ions to create the first, second, third and fourth junction areas uses a first energy level and the step of implanting ions to create the fifth and sixth junction areas uses a second energy level. 7. The method of claim 6, wherein the first, second, third and fourth junction areas have a first set of characteristics and the fifth and sixth junction areas have a second set of characteristics. 8. The method of claim 6, wherein the first energy level is in the range of 1 keV to 10 keV. 9. The method of claim 8, wherein the second energy level is 30 keV. 10. The method of claim 8, wherein the second energy level is in the range of 10 to 30 keV. 11. The method of claim 6, wherein the first energy level is in the range of 5 keV to 10 keV. 12. The method of claim 11, wherein the second energy level is 30 keV. 13. The method of claim 11, wherein the second energy level is in the range of 10 to 30 keV. 14. The method of claim 1, wherein the thickness of the second epitaxial layer of silicon is greater than the thickness of the first epitaxial layer of silicon. 15. The method of claim 14, wherein the thickness of the first epitaxial layer of silicon is in the range of 200 to 300 angstroms and the thickness of the second epitaxial layer of silicon is in the range of 300 to 400 angstroms. 16. The method of claim 1, wherein the first through sixth junction areas all have the same depth.