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A device for measuring parameters of medical fluids having a measurement chamber through which the fluid to be measured passes. The chamber is sealed on one side by a flexible membrane, and it also has a measurement plate that has a peripheral seal on its outer edge and is in contact with the flexib

A device for measuring parameters of medical fluids having a measurement chamber through which the fluid to be measured passes. The chamber is sealed on one side by a flexible membrane, and it also has a measurement plate that has a peripheral seal on its outer edge and is in contact with the flexible membrane. At least one sensor for measuring a parameter of the medical fluid is mounted on the measurement plate, and the measurement plate has a continuous inlet leading to the flexible membrane so that a vacuum can be established between the measurement plate and the flexible membrane.

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A device for measuring parameters of medical fluids having a measurement chamber through which the fluid to be measured passes. The chamber is sealed on one side by a flexible membrane, and it also has a measurement plate that has a peripheral seal on its outer edge and is in contact with the flexib

A device for measuring parameters of medical fluids having a measurement chamber through which the fluid to be measured passes. The chamber is sealed on one side by a flexible membrane, and it also has a measurement plate that has a peripheral seal on its outer edge and is in contact with the flexible membrane. At least one sensor for measuring a parameter of the medical fluid is mounted on the measurement plate, and the measurement plate has a continuous inlet leading to the flexible membrane so that a vacuum can be established between the measurement plate and the flexible membrane. croelectronic device of claim 1, wherein the microelectronic package contains more than one die. 3. The microelectronic device of claim 1, wherein the second transmit/receive circuitry is disposed on a second integrated circuit die. 4. The microelectronic device of claim 1, further comprising a substrate disposed within the housing, and wherein the first and second transmit/receive circuitry are supported on the substrate. 5. The microelectronic device of claim 1, further comprising a printed circuit board substrate disposed within the housing, and wherein the first and second transmit/receive circuitry are supported on the printed circuit board substrate. 6. The microelectronic device of claim 1, wherein the microelectronic device is hand-carriable. 7. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry are disposed within 24 inches of one another within the microelectronic package. 8. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication. 9. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless RF communication. 10. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication, the antennas being disposed within 24 inches of one another within the microelectronic package. 11. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication, the antennas being disposed within one inch of one another within the microelectronic package. 12. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication, the antennas being disposed within one half inch of one another within the microelectronic package. 13. A microelectronic device comprising: a microelectronic package providing a housing within which integrated circuitry is received, and an integrated circuitry-supporting substrate inside the housing; an integrated circuit die received within the microelectronic package and supported by the integrated circuitry-supporting substrate, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry comprising first transmit/receive circuitry configured to transmit and receive wireless communication; and second transmit/receive circuitry, discrete from the first transmit/receive circuitry and contained within the microelectronic package, the second transmit/receive circuitry being configured to transmit and receive wireless communication, wherein the first and second transmit/receive circuitry are configured to establish wireless communication between one another within the microelectronic package sufficient to enable the integrated circuitry on the integrated circuitry die to operate in a designed manner, wherein the integrated circuit die has physical-electrical connection structure securing it to the integrated circuitry-supporting substrate, said structure supplying electrical connections only for power and ground. 14. The microelectronic device of claim 13, wherein the second transmit/receive circuitry is disposed on a second integrated circuit die supported by the integrated circuitry-supporting substrate. 15. The microelectronic device of claim 13, wherein the second transmit/receive circuitry is supported by the integrated circuitry-supporting substrate. 16. The microelectronic device of claim 13, wherein the device is hand-transportable. 17. The microelectronic device of claim 13, further comprising ind