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Methods and apparatus for mounting a semiconductor to a heat sink. A clamp is provided comprising a spring beam mounted to a clamp body, wherein the body restricts the spring beam ends and the spring beam has a convex curvature relative to an adjacent power semiconductive module. The portion of the

Methods and apparatus for mounting a semiconductor to a heat sink. A clamp is provided comprising a spring beam mounted to a clamp body, wherein the body restricts the spring beam ends and the spring beam has a convex curvature relative to an adjacent power semiconductive module. The portion of the spring beam near its apex contacts the module, applying force to bias a heat-transmitting surface of the module against a heat sink. When temperature increases, the spring beam expands to add additional clamping force to the module. Further embodiments provide making the spring beam from a material having a high coefficient of thermal expansion and the clamp body from a material having a low coefficient of thermal expansion, further increasing the force that may be applied by the spring beam with increases in temperature. The spring beam may comprise layers of different materials to increase the applied force.

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Methods and apparatus for mounting a semiconductor to a heat sink. A clamp is provided comprising a spring beam mounted to a clamp body, wherein the body restricts the spring beam ends and the spring beam has a convex curvature relative to an adjacent power semiconductive module. The portion of the

Methods and apparatus for mounting a semiconductor to a heat sink. A clamp is provided comprising a spring beam mounted to a clamp body, wherein the body restricts the spring beam ends and the spring beam has a convex curvature relative to an adjacent power semiconductive module. The portion of the spring beam near its apex contacts the module, applying force to bias a heat-transmitting surface of the module against a heat sink. When temperature increases, the spring beam expands to add additional clamping force to the module. Further embodiments provide making the spring beam from a material having a high coefficient of thermal expansion and the clamp body from a material having a low coefficient of thermal expansion, further increasing the force that may be applied by the spring beam with increases in temperature. The spring beam may comprise layers of different materials to increase the applied force. capacitor. 8. The apparatus of claim 1 comprising second conductive paths connecting in parallel a first portion of a second conductive contact spanning a second surface of the capacitor to a second external conductive contact exposed at a second surface of the package substantially parallel to the first surface of the package, the second surface of the capacitor being opposite the first surface of the capacitor. 9. The apparatus of claim 1, the capacitor comprising third and fourth surfaces substantially perpendicular to the first and second surfaces of the capacitor, and each contact of the capacitor having a second portion that covers at least a part of the third surface of the capacitor and a third portion that covers at least a part of the fourth surface of the capacitor. 10. The apparatus of claim 9 wherein the second and third portions of each contact of the capacitor respectively have a surface area less than a surface area of the first portion of the contact. 11. The apparatus of claim 1 wherein the capacitor has an industry standard form factor. 12. The apparatus of claim 1 wherein the capacitor comprises a multi-layer ceramic chip capacitor. 13. An apparatus comprising: a package having a first surface; a die having a first conductive die contact proximate the first surface of the package; a capacitor located inside the package, the capacitor having a first conductive contact exposed at a first surface of the capacitor, a first portion of the first conductive contact spanning a width of the first surface of the capacitor, the first surface of the capacitor being substantially parallel to the first surface of the package; and a first conductive path connecting the first portion of the first conductive contact of the capacitor to the first conductive die contact. 14. The apparatus of claim 13 comprising first conductive paths connecting in parallel the first portion of the first conductive contact of the capacitor to the first conductive die contact. 15. The apparatus of claim 13 comprising a second conductive path connecting the first portion of the first conductive contact of the capacitor to a power supply. 16. The apparatus of claim 13 comprising second conductive paths connecting in parallel the first portion of the first conductive contact of the capacitor to a power supply. 17. The apparatus of claim 13 comprising a second conductive path connecting the first portion of the first conductive contact of the capacitor to a first external conductive contact exposed at a second surface of the package substantially parallel to the first surface of the package. 18. The apparatus of claim 13 comprising a second conductive path connecting a first portion of a second conductive contact spanning a width of a second surface of the capacitor to a second conductive contact of the die, exposed at the first surface of the package, the second surface of the capacitor being substantially parallel to the first surface of the package. 19. The apparatus of claim 13 comprising second conductive paths connecting in parallel a first portion of a second conductive contact spanning the width of a second surface of the capacitor to a second conductive contact of the die, exposed at the first surface of the package, the second surface of the capacitor being substantially parallel to the first surface of the package. 20. The apparatus of claim 13 comprising a second conductive path connecting a first portion of a second conductive contact spanning the width of a second surface of the capacitor to a power supply, the second surface of the capacitor being substantially parallel to the first surface of the package. 21. The apparatus of claim 13 comprising second conductive paths connecting in parallel a first portion of a second conductive contact spanning the width of a second surface of the capacitor to a power supply, the second surface of the capacitor being substantially parallel to the first surface of the package. 22. The appar