IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
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| 국제특허분류(IPC7판) |
|
| 출원번호 |
US-0941217
(2001-08-29)
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발명자
/ 주소 |
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| 출원인 / 주소 |
- Closure Medical Corporation
|
| 대리인 / 주소 |
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| 인용정보 |
피인용 횟수 :
47 인용 특허 :
26 |
초록
▼
A microapplicator for dispensing and applying an adhesive or sealant material comprises a handle portion, an applicator tip connected to the handle portion, and a microreservoir at the applicator tip arranged to hold a small amount, about 20 microliters or less, of an adhesive/sealant material until
A microapplicator for dispensing and applying an adhesive or sealant material comprises a handle portion, an applicator tip connected to the handle portion, and a microreservoir at the applicator tip arranged to hold a small amount, about 20 microliters or less, of an adhesive/sealant material until dispensing. In embodiments, the applicator tip has a width of about 1 mm. The microapplicator may include a second reservoir, containing the adhesive/sealant material, that is arranged to supply the adhesive/sealant material to the microreservoir at the applicator tip. The second reservoir may comprise a frangible ampoule disposed in the handle portion, a container, such as a syringe, connected to the handle portion, or the handle portion itself. The applicator tip may comprise one of a polymer loop, a spatula, a rolling ball, a grate, a porous material, such as a swab, a foam pad or a mesh, and a brush.
대표청구항
▼
A microapplicator for dispensing and applying an adhesive or sealant material comprises a handle portion, an applicator tip connected to the handle portion, and a microreservoir at the applicator tip arranged to hold a small amount, about 20 microliters or less, of an adhesive/sealant material until
A microapplicator for dispensing and applying an adhesive or sealant material comprises a handle portion, an applicator tip connected to the handle portion, and a microreservoir at the applicator tip arranged to hold a small amount, about 20 microliters or less, of an adhesive/sealant material until dispensing. In embodiments, the applicator tip has a width of about 1 mm. The microapplicator may include a second reservoir, containing the adhesive/sealant material, that is arranged to supply the adhesive/sealant material to the microreservoir at the applicator tip. The second reservoir may comprise a frangible ampoule disposed in the handle portion, a container, such as a syringe, connected to the handle portion, or the handle portion itself. The applicator tip may comprise one of a polymer loop, a spatula, a rolling ball, a grate, a porous material, such as a swab, a foam pad or a mesh, and a brush. e for detecting the presence of the photosensitive material in order to control an operation of the drive section. 6. The photosensitive material processing device according to claim 3, wherein the moving mechanism is provided with a drive section for moving the shutter section, and a sensor provided upstream from the transit aperture for detecting the presence of the photosensitive material in order to control an operation of the drive section. ssing chamber; b) a source that routes a wafer treatment material into the wafer processing chamber for removing a coating from an exposed surface of the at least one wafer; and c) receiving optics mounted to the chamber near a first edge of said wafer for monitoring concentrations of a reactant product of said coating and said wafer treatment material by monitoring optical emission spectra originating from above said at least one wafer, said receiving optics are recessed from said interior region of the wafer processing chamber. 7. A wafer processing system comprising: a) a wafer processing chamber including a support for positioning at least one wafer within an interior region of the wafer processing chamber, said wafer processing chamber has a slot extending into a sidewall of the wafer processing chamber; b) a source that routes a wafer treatment material into the wafer processing chamber for removing a coating from an exposed surface of the at least one wafer; c) receiving optics mounted to the chamber near a first edge of said wafer for monitoring concentrations of a reactant product of said coating and said wafer treatment material by monitoring optical emission spectra originating from above said at least one wafer; and d) a viewing dump mounted to said wafer processing chamber, said viewing dump is mounted to said wafer processing chamber near the slot to absorb light entering said slot. 8. A wafer processing system comprising: a) a wafer processing chamber including a support for positioning at least one wafer within an interior region of the wafer processing chamber; b) a source that routes a wafer treatment material into the wafer processing chamber for removing a coating from an exposed surface of the at least one wafer; c) receiving optics mounted to the chamber near a first edge of said wafer for monitoring concentrations of a reactant product of said coating and said wafer treatment material by monitoring optical emission spectra originating from above said at least one wafer; and d) a viewing dump mounted to said wafer processing chamber, the viewing dump comprises a box and a light capturing device. 9. A wafer processing system comprising: a) a wafer processing chamber including a support for positioning at least one wafer within an interior region of the wafer processing chamber; b) a source that routes a wafer treatment material into the wafer processing chamber for removing a coating from an exposed surface of the at least one wafer; and c) receiving optics mounted to the chamber near a first edge of said wafer for monitoring concentrations of a reactant product of said coating and said wafer treatment material by monitoring optical emission spectra originating from above said at least one wafer, said receiving optics comprise multiple fiber optic fibers having a input ends that are configured in a fan shaped array, said receiving optics focused within 0.6 inches of a surface of said wafer. 10. A wafer processing system comprising: a) a wafer processing chamber including a support for positioning at least one wafer; b) a source that routes a wafer treatment material into the processing chamber for removing a coating from said at least one wafer; and c) receiving optics mounted to the chamber, said receiving optics including a lens and a plurality of fiber optic fibers each of said fiber optic fibers positioned with respect to said lens to monitor light emitted by a local concentration of a reactant product of said coating and said wafer treatment material on a surface of said at least one wafer, such that said optics monitor a representative distribution of points on said surface. 11. The optical system of claim 10 further comprising a viewing dump mounted to said wafer processing chamber. 12. A wafer processing system comprising: a) a wafer processing chamber including a support for positioning at least one wafer within an interior region of the wafer processing chambe
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