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Apparatus and method for temperature control of IC device during test 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-031/02
출원번호 US-0616895 (2000-07-14)
발명자 / 주소
  • DiBattista, Larry
  • Malinoski, Mark
  • Shitara, Tomoya
출원인 / 주소
  • Delta Design, Inc.
대리인 / 주소
    Foley & Lardner
인용정보 피인용 횟수 : 70  인용 특허 : 15

초록

An apparatus for controlling the temperature, during testing, of IC devices formed on a wafer includes a chuck for locating the devices during testing and multiple temperature control devices arranged on the chuck to correspond with the arrangement of the devices being tested on the wafer. The chuck

대표청구항

An apparatus for controlling the temperature, during testing, of IC devices formed on a wafer includes a chuck for locating the devices during testing and multiple temperature control devices arranged on the chuck to correspond with the arrangement of the devices being tested on the wafer. The chuck

이 특허에 인용된 특허 (15)

  1. Lipp Robert J. (15881 Rose Ave. Los Gatos CA 95030), Apparatus for heating and controlling temperature in an integrated circuit chip.
  2. Mark F. Malinoski ; Thomas P. Jones ; Brian Annis ; Jonathan E. Turner, Apparatus, method and system of liquid-based, wide range, fast response temperature control of electronic device.
  3. Hashinaga Tatsuya (Yokohama JPX) Nishiguchi Masanori (Yokohama JPX), Burn-in apparatus and method which individually controls the temperature of a plurality of semiconductor devices.
  4. Jones Elmer R. (North Reading MA), Burn-in module.
  5. Fu Deng-Yuan (Sunnyvale CA), Computer-implemented method and system for precise temperature control of a device under test.
  6. Lewis David A. (Carmel NY) Narayan Chandrasekhar (Hopewell Junction NY), Device to monitor and control the temperature of electronic chips to enhance reliability.
  7. Miyata Eiji (Fuchu JPX) Sugiyama Masahiko (Nirasaki JPX) Kohno Masahiko (Yamanashi JPX) Hatta Masataka (Yamanashi JPX), Electric probing-test machine having a cooling system.
  8. Kiyokawa Toshiyuki (Kitakatsushika JPX) Hayama Hisao (Gyoda JPX), IC test equipment.
  9. Taraci Richard (Phoenix AZ) Taraci Brian (Laguna Niguel CA) Gorgenyi Imre (Scottsdale AZ), Method and apparatus for maintaining electrically operating device temperatures.
  10. Kreiger Walter C. (Underhill VT) Wilder Donald L. (South Hero VT), Probe for wafer burn-in test system.
  11. Eager George (Cambridge MA) Selverstone Pater (Cambridge MA), Temperature control for device under test.
  12. Hamilton Harold E., Temperature control for high power burn-in for integrated circuits.
  13. Tustaniwskyj Jerry Ihor ; Babcock James Wittman, Temperature control system for an electronic device which achieves a quick response by interposing a heater between the.
  14. Jones Elmer R. (North Reading MA), Thermal control system for a semi-conductor burn-in.
  15. Kufis James C. (Sunnyvale CA) Semken Robert S. (Sunnyvale CA), Thermal fixture for testing integrated circuits.

이 특허를 인용한 특허 (70)

  1. Reitinger, Klemens, Apparatus for conditioning semiconductor chips and test method using the apparatus.
  2. Di Stefano, Thomas H., Apparatus to control device temperature utilizing multiple thermal paths.
  3. Di Stefano, Thomas H., Apparatus to control device temperature utilizing multiple thermal paths.
  4. Malinoski, Mark F.; Jones, Thomas P.; Annis, Brian; Turner, Jonathan E., Apparatus, method and system of liquid-based, wide range, fast response temperature control of electric devices.
  5. Itakura,Katsuhiro; Natsuhara,Masuhiro; Nakata,Hirohiko, Body for keeping a wafer, heater unit and wafer prober.
  6. Dunklee, John, Chuck for holding a device under test.
  7. Dunklee, John, Chuck for holding a device under test.
  8. Dunklee, John, Chuck for holding a device under test.
  9. Dunklee,John, Chuck for holding a device under test.
  10. Dunklee,John, Chuck for holding a device under test.
  11. Dunklee,John, Chuck for holding a device under test.
  12. Stewart, Craig; Lord, Anthony; Spencer, Jeff; Burcham, Terry; McCann, Peter; Jones, Rod; Dunklee, John; Lesher, Tim; Newton, David, Chuck for holding a device under test.
  13. Stewart,Craig; Lord,Anthony; Spencer,Jeff; Burcham,Terry; McCann,Peter; Jones,Rod; Dunklee,John; Lesher,Tim; Newton,David, Chuck for holding a device under test.
  14. Andrews, Peter; Froemke, Brad; Dunklee, John, Chuck with integrated wafer support.
  15. Andrews,Peter; Froemke,Brad; Dunklee,John, Chuck with integrated wafer support.
  16. Andrews,Peter; Froemke,Brad; Dunklee,John, Chuck with integrated wafer support.
  17. Ho, Shun-Bon, Device and method for controlling IC temperature.
  18. Kinsley, Tom, Electronic apparatus having IC temperature control.
  19. Kinsley, Tom, Electronic apparatus having IC temperature control.
  20. Dunklee, John; Norgden, Greg; Cowan, C. Eugene, Guarded tub enclosure.
  21. Dunklee,John; Norgden,Greg; Cowan,C. Eugene, Guarded tub enclosure.
  22. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.
  23. McFadden,Bruce, Localizing a temperature of a device for testing.
  24. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  25. Di Stefano, Thomas H., Method and apparatus for controlling temperature.
  26. Di Stefano, Peter T.; Di Stefano, Thomas H., Method and apparatus for setting and controlling temperature.
  27. Aube, Francois; Curtin, Timothy M.; Grady, Matthew S.; Scanlon, Thomas P.; Smith, Eric N., Method for monitoring thermal control.
  28. Haji-Sheikh, Michael J.; Biard, James R.; Rabinovich, Simon; Guenter, James K.; Hawkins, Bobby M., Methods of conducting wafer level burn-in of electronic devices.
  29. Harris,Daniel L.; McCann,Peter R., Optical testing device.
  30. Jeserer, Gunther; Varol, Efe, Plunger for holding and moving electrical components.
  31. Schaule, Max; Thiel, Stefan; Pichl, Franz; Jeserer, Günther; Wiesböck, Andreas; Bauer, Alexander, Plunger for holding and moving electronic components in particular ICS.
  32. Kinsley, Tom, Power sink for IC temperature control.
  33. Nordgren, Greg; Dunklee, John, Probe station.
  34. Nordgren, Greg; Dunklee, John, Probe station.
  35. Peters, Ron A.; Hayden, Leonard A.; Hawkins, Jeffrey A.; Dougherty, R. Mark, Probe station having multiple enclosures.
  36. Peters,Ron A.; Hayden,Leonard A.; Hawkins,Jeffrey A.; Dougherty,R. Mark, Probe station having multiple enclosures.
  37. Peters,Ron A.; Hayden,Leonard A.; Hawkins,Jeffrey A.; Dougherty,R. Mark, Probe station having multiple enclosures.
  38. Cowan, Clarence E.; Tervo, Paul A.; Dunklee, John L., Probe station thermal chuck with shielding for capacitive current.
  39. Cowan,Clarence E.; Tervo,Paul A.; Dunklee,John L., Probe station thermal chuck with shielding for capacitive current.
  40. Dunklee,John; Cowan,Clarence E., Probe station with low inductance path.
  41. Dunklee,John; Cowan,Clarence E., Probe station with low inductance path.
  42. Lesher, Timothy; Miller, Brad; Cowan, Clarence E.; Simmons, Michael; Gray, Frank; McDonald, Cynthia L., Probe station with low noise characteristics.
  43. Lesher,Timothy; Miller,Brad; Cowan,Clarence E.; Simmons,Michael; Gray,Frank; McDonald,Cynthia L., Probe station with low noise characteristics.
  44. Navratil,Peter; Froemke,Brad; Stewart,Craig; Lord,Anthony; Spencer,Jeff; Runbaugh,Scott; Fisher,Gavin; McCann,Pete; Jones,Rod, Probe station with two platens.
  45. Lesher, Timothy E., Probe testing structure.
  46. Lesher,Timothy E., Probe testing structure.
  47. Sugiyama,Masahiko; Inoue,Yoshinori, Prober and probe testing method for temperature-controlling object to be tested.
  48. Sugiyama,Masahiko; Inoue,Yoshinori, Prober and probe testing method for temperature-controlling object to be tested.
  49. Haji-Sheikh, Michael J.; Biard, James R.; Guenter, James K.; Hawkins, Bobby M., Providing current control over wafer borne semiconductor devices using overlayer patterns.
  50. Haji-Sheikh, Michael J.; Biard, James R.; Guenter, James K.; Hawkins, Bobby M., Providing current control over wafer borne semiconductor devices using trenches.
  51. Haji-Sheikh, Michael J.; Biard, James R.; Guenter, James K.; Hawkins, Bobby M., Providing photonic control over wafer borne semiconductor devices.
  52. Dunklee,John, Switched suspended conductor and connection.
  53. Dunklee,John, Switched suspended conductor and connection.
  54. Strid,Eric W.; Schappacher,Jerry B.; Carlton,Dale E.; Gleason,K. Reed, System for evaluating probing networks.
  55. Andrews, Peter; Hess, David, System for testing semiconductors.
  56. Haji Sheikh,Michael J.; Biard,James R.; Rabinovich,Simon; Guenter,James K.; Hawkins,Bobby M., Systems for wafer level burn-in of electronic devices.
  57. Ando, Masakazu; Takahashi, Hiroyuki; Yamashita, Tsuyoshi; Hashimoto, Takashi, Temperature control device and temperature control method.
  58. Ando, Masakazu; Takahashi, Hiroyuki; Yamashita, Tsuyoshi; Hashimoto, Takashi, Temperature control device and temperature control method.
  59. Jones, Thomas P.; Turner, Jonathan E.; Malinoski, Mark F., Temperature control of electronic devices using power following feedback.
  60. Luebs, Richard J., Temperature-controlled rework system.
  61. Stone, William M., Temperature-controlled thermal platform for automated testing.
  62. Stone, William M., Temperature-controlled thermal platform for automated testing.
  63. Negishi, Kazuki; Hansen, Mark, Test apparatus for measuring a characteristic of a device under test.
  64. Rumbaugh,Scott, Thermal optical chuck.
  65. Rumbaugh,Scott, Thermal optical chuck.
  66. Schwindt, Randy J.; Harwood, Warren K.; Tervo, Paul A.; Smith, Kenneth R.; Warner, Richard H., Wafer probe station having a skirting component.
  67. Schwindt,Randy J.; Harwood,Warren K.; Tervo,Paul A.; Smith,Kenneth R.; Warner,Richard H., Wafer probe station having a skirting component.
  68. Schwindt,Randy J.; Harwood,Warren K.; Tervo,Paul A.; Smith,Kenneth R.; Warner,Richard H., Wafer probe station having a skirting component.
  69. Harwood, Warren K.; Tervo, Paul A.; Koxxy, Martin J., Wafer probe station having environment control enclosure.
  70. Harwood,Warren K.; Tervo,Paul A.; Koxxy,Martin J., Wafer probe station having environment control enclosure.
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