초록 ▼

The invention relates to a mounting arrangement for a heatsink for cooling a microelectronic device contained within a chassis. The mounting arrangement includes a heatsink, a motherboard incorporating the microelectronic device thereon and securing means adapted to position both the heatsink and th

The invention relates to a mounting arrangement for a heatsink for cooling a microelectronic device contained within a chassis. The mounting arrangement includes a heatsink, a motherboard incorporating the microelectronic device thereon and securing means adapted to position both the heatsink and the motherboard in a mounting configuration so that the motherboard is held in fixed relation to the chassis and the heatsink is biased in thermal contact with the microelectronic device by means of a biasing means adapted to engage with both the securing means and the heatsink, whereby the weight of the heatsink thereby is substantially supported by the chassis by way of the securing means. The securing devices in a preferred embodiment correspond to pins which pass through the heatsink, through the motherboard, while simultaneously anchoring same to the chassis, and are attached to the chassis. A biasing device is interposed between each pin and the heatsink, so that as the pins are secured, the heatsink is pressed gently against the device. Suitable applications include PCs, servers and other computer architectures.

대표청구항 ▼

1. A mounting arrangement including: a heatsink; a motherboard incorporating a microelectronic device thereon; and securing means adapted to position both the heatsink and the motherboard in a mounting configuration so that the heatsink is biased in thermal contact with the microelectronic devi

1. A mounting arrangement including: a heatsink; a motherboard incorporating a microelectronic device thereon; and securing means adapted to position both the heatsink and the motherboard in a mounting configuration so that the heatsink is biased in thermal contact with the microelectronic device by means of biasing means adapted to engage with both the securing means and the heatsink, whereby the weight of the heatsink thereby is substantially supported by a chassis member by way of the securing means and wherein the securing means is in the form of a plurality of pins, each pin having a chassis engagement means at a chassis end thereof, a heatsink engagement means at a heatsink end thereof, and a motherboard engagement section adapted so as to engage the motherboard so that it is held at a fixed position in relation to the chassis member. 2. A mounting arrangement as claimed in claim 1 wherein the heatsink is biased against the microelectronic device by means of the biasing means positioned and adapted so that any relative movement between the securing means and the heatsink is cushioned. 3. A mounting arrangement as claimed in claim 1 wherein the motherboard is held immediately adjacent the chassis member. 4. A mounting arrangement as claimed in claim 1 wherein each pin includes an overhanging lip at the heatsink end which is shaped to engage the biasing means, the biasing means in the form of a coil spring, through which the pin penetrates, in such a way that the location of the heatsink in relation to the microelectronic device is kept substantially constant. 5. A mounting arrangement as claimed in claim 1 wherein the heatsink is in the form a heat exchange device mounted on a plate, the plate having a plurality of apertures, each corresponding to a securing means, wherein the securing means, in the mounting configuration, penetrate the plate and the motherboard and are fixed to the chassis member in such a way that the motherboard is held in a fixed position in relation to the chassis member, and the plate, while being free to move on the securing means, is biased against the microelectronic device by way of the securing means while damping relative movement between the chassis member and the heatsink. 6. A pin in the form of an elongate member having a chassis member engagement means at a first end, a heatsink engagement means at a second end and an engagement lip at a point between the first and second end, the elongate member and engagement lip adapted so that the pin can pass through and engage the heatsink at the second end and penetrate and engage with an aperture in a motherboard by means of the lip so as to retain the motherboard in fixed relation to the chassis member wherein the pin further includes a biasing means located between the heatsink engagement means and, when in use, the heatsink so that when the engagement lip engages with the motherboard aperture, the heatsink and motherboard are held at a substantially fixed separation while any movement between the two is damped by the biasing means. 7. A pin as claimed in claim 6 wherein the pin is constructed in a plurality of sections. 8. A pin as claimed in claim 6 wherein the biasing means is a coil spring. 9. A pin as claimed in claim 6 wherein the heatsink engagement means comprises an overhanging lip adapted to engage the heatsink by way of compressing the biasing means wherein the biasing means is interposed between the heatsink and the lip.