최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
DataON 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Edison 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0544593 (2000-04-06) |
발명자 / 주소 |
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 | 피인용 횟수 : 669 인용 특허 : 223 |
A sensor designed to determine the amount and concentration of analyte in a sample having a volume of less than about 1 μL. The sensor has a working electrode coated with a non-leachable redox mediator. The redox mediator acts as an electron transfer agent between the analyte and the electrode. In a
A sensor designed to determine the amount and concentration of analyte in a sample having a volume of less than about 1 μL. The sensor has a working electrode coated with a non-leachable redox mediator. The redox mediator acts as an electron transfer agent between the analyte and the electrode. In addition, a second electron transfer agent, such as an enzyme, can be added to facilitate the electrooxidation or electroreduction of the analyte. The redox mediator is typically a redox compound bound to a polymer. The preferred redox mediators are air-oxidizable. The amount of analyte can be determined by coulometry. One particular coulometric technique includes the measurement of the current between the working electrode and a counter or reference electrode at two or more times. The charge passed by this current to or from the analyte is correlated with the amount of analyte in the sample. Other electrochemical detection methods, such as amperometric, voltammetric, and potentiometric techniques, can also be used. The invention can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum. An enzyme capable of catalyzing the electrooxidation or electroreduction of the biomolecule is provided as a second electron transfer agent.
A sensor designed to determine the amount and concentration of analyte in a sample having a volume of less than about 1 μL. The sensor has a working electrode coated with a non-leachable redox mediator. The redox mediator acts as an electron transfer agent between the analyte and the electrode. In a
A sensor designed to determine the amount and concentration of analyte in a sample having a volume of less than about 1 μL. The sensor has a working electrode coated with a non-leachable redox mediator. The redox mediator acts as an electron transfer agent between the analyte and the electrode. In addition, a second electron transfer agent, such as an enzyme, can be added to facilitate the electrooxidation or electroreduction of the analyte. The redox mediator is typically a redox compound bound to a polymer. The preferred redox mediators are air-oxidizable. The amount of analyte can be determined by coulometry. One particular coulometric technique includes the measurement of the current between the working electrode and a counter or reference electrode at two or more times. The charge passed by this current to or from the analyte is correlated with the amount of analyte in the sample. Other electrochemical detection methods, such as amperometric, voltammetric, and potentiometric techniques, can also be used. The invention can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum. An enzyme capable of catalyzing the electrooxidation or electroreduction of the biomolecule is provided as a second electron transfer agent. ble medium containing a program that, when executed, performs an operation comprising: connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate; immersing the substrate into the electrolyte solution; and biasing the seed layer with a positive voltage relative to the anode as the substrate is being immersed into the electrolyte solution. 7. A method of electroplating a substrate, comprising: connecting an electric source between an anode immersed in an electrolyte solution and a seed layer formed on the substrate; biasing the electric source to a reverse voltage bias in which a first voltage level of the seed layer equals or is more positive than a second voltage level of the anode; immersing the substrate into the electrolyte solution; and biasing the electric source to a plating voltage bias in which the voltage level of the anode equals or exceeds the voltage level of the seed layer. 8. The method of claim 7, further comprising: biasing the electric source to a second reverse voltage bias in which a third voltage level of the seed layer equals or is more positive than a fourth voltage level of the anode; and removing the seed layer from the electrolyte solution. 9. The method of claim 7, further comprising rotating the substrate as the substrate is immersed into the electrolyte solution. 10. The method of claim 7, further comprising selectively controlling biasing the voltage of the electric source. 11. A computer readable medium containing a program that, when executed, performs an operation comprising: connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate; applying a first reverse bias voltage in which a voltage level of the seed layer is equal to or more positive than a voltage level of the anode; immersing the substrate into the electrolyte solution; and applying a plating voltage in which the voltage level of the anode exceeds the voltage level of the seed layer. 12. The computer readable medium of claim 11, wherein the operation further comprises: applying a second reverse bias voltage in which the voltage level of the seed layer is equal to or more positive than the voltage level of the anode; and removing the substrate from the electrolyte solution. 13. The computer readable medium of claim 11, wherein the operation further comprises rotating the substrate as the substrate is being immersed into the electrolyte solution. 14. A method of removing a substrate from electrolyte solution, comprising: connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate; biasing a first voltage level of the seed layer to be equal or more positive than a second voltage level of the anode; immersing the substrate into the electrolyte solution; biasing a third voltage level of the seed layer to be more negative than a fourth voltage level of the anode; biasing a fifth voltage level of the seed layer to equals or more positive than a sixth voltage level of the anode; and removing the substrate from the electrolyte solution. 15. The method of claim 14, wherein the voltage level of the anode equals or exceeds the voltage level of the seed layer after the substrate is immersed in the electrolyte solution but before the substrate is removed from the electrolyte solution to enhance the electric current density applied to the seed layer. 16. The method of claim 14, wherein after the changing the biasing after the substrate is immersed in the electrolyte solution, the voltage level of the seed layer equals or exceeds the voltage level of the anode by an amount sufficient to limit the deposition of a metal film on the seed layer. 17. The method of claim 14, wherein after the changing the biasing after the substrate is immersed in the electrolyte solution, the voltage level of the seed layer equals or exceeds the voltage level of the anode by an amount sufficient to limit the variation of the electric current density applied across the seed layer. 18. An electroplating system for plating a substrate, comprising: an electric source configured to be connected between an anode immersed in an electrolyte solution and a seed layer formed on the substrate; a controller configured to control electric biasing of the electric source to a reverse voltage bias in which a first voltage level of the seed layer equals or is more positive than a second voltage level of the anode; and a substrate holder system configured to immerse the substrate into the electrolyte solution, wherein following immersion, the controller is configured to bias the electric source to a plating voltage bias in which the voltage level of the anode equals or exceeds the voltage level of the seed layer. 19. The electroplating system of claim 18, wherein following immersion, the controller is configured to control the electric source to apply a second reverse bias voltage in which the voltage level of the seed layer is equal to or is more positive than the voltage level of the anode. 20. The electroplating system of claim 19, wherein the substrate holder system is configured to remove the substrate from the electrolyte solution following the application of the second reverse bias voltage. 21. The electroplating system of claim 18, wherein the substrate holder system is configured to rotate the substrate as the substrate is immersed into the electrolyte solution. 22. A method of electroplating a substrate, comprising: applying a reverse bias voltage between one or more electric contacts and an anode immersed in an electrolyte solution containing metal ions as the substrate is being immersed into the electrolyte solution, the electric contacts being configured to provide electrical bias to a seed layer formed on the substrate; and applying a plating voltage to the contacts following immersion. 23. The method of claim 22, wherein a polarity of the reverse bias voltage is opposite of a polarity of the plating voltage. 24. The method of claim 22, wherein the reverse bias voltage represents a positive voltage relative to the anode and the plating voltage represents a negative voltage relative to the anode. 25. The method of claim 22, wherein the reverse bias voltage is configured to limit the metal ions from depositing on the electric contacts while the substrate is being immersed into the electrolyte solution. 26. The method of claim 22, further comprising applying the reverse bias voltage between the contacts and the anode as the substrate is removed from the electrolyte solution. 27. The method of claim 22, wherein applying the reverse bias voltage comprises applying the reverse bias voltage for less than about 30 seconds. 28. A method of electroplating a substrate, comprising: connecting an electric source between an anode immersed in an electrolyte solution and a seed layer formed on the substrate; applying a first reverse bias voltage in which a voltage level of the seed layer is equal to or more positive than a voltage level of the anode; immersing the substrate into the electrolyte solution; and applying a plating voltage in which the voltage level of the anode exceeds the voltage level of the seed layer. 29. The method of claim 28, further comprising: applying a second reverse bias voltage in which the voltage level of the seed layer is equal to or more positive than the voltage level of the anode; and removing the substrate from the electrolyte solution. 30. An electroplating system for plating a substrate, comprising: an electric source configured to be connected between an anode immersed in an electrolyte solution and a seed layer formed on the substrate; a controller configured to control the electric source to apply a reverse bias voltage in which a voltage level of the seed layer is equal to or more positive than a voltage l
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