초록 ▼

A method for making a ULSI MOSFET includes depositing a high-k gate insulator on a silicon substrate and then depositing a field oxide layer over the gate insulator. The field oxide layer is masked with photoresist and the photoresist patterned to establish first gate windows, and the oxide below th

A method for making a ULSI MOSFET includes depositing a high-k gate insulator on a silicon substrate and then depositing a field oxide layer over the gate insulator. The field oxide layer is masked with photoresist and the photoresist patterned to establish first gate windows, and the oxide below the windows is then etched away to establish first gate voids in the oxide. The first gate voids are filled with a first metallic gate electrode material that is suitable for establishing a gate electrode of, e.g., an N-channel MOSFET. Second gate voids are similarly made in the oxide and filled with a second gate electrode material that is suitable for establishing a gate electrode of, e.g., an P-channel MOSFET or another N-channel MOSFET having a different threshold voltage than the first MOSFET. With this structure, plural threshold design voltages are supported in a single ULSI chip that uses high-k gate insulator technology.

대표청구항 ▼

1. A semiconductor device, comprising: at least one high-k gate insulator deposited on the substrate; a first field effect transistor comprising a first metal gate electrode on a semiconductor substrate, the first gate electrode including a first material; and a second field effect transisto

1. A semiconductor device, comprising: at least one high-k gate insulator deposited on the substrate; a first field effect transistor comprising a first metal gate electrode on a semiconductor substrate, the first gate electrode including a first material; and a second field effect transistor comprising a second metal gate electrode on a semiconductor substrate, the second gate electrode including a second material, and wherein the second material is different from the first material, and wherein at least one of the metal gate electrodes comprises a material selected from a group consisting of titanium (Ti), tantalum (Ta), and tantalum nitride (TaN). 2. A digital processing apparatus comprising the semiconductor device of claim 1. 3. A semiconductor device, as recited in claim 1, wherein the gate insulator comprises a dielectric constant of at least twenty-five (≥25). 4. A semiconductor device, as recited in claim 1, wherein the gate insulator comprises a material selected from a group consisting of titania (TiO2) and tantala (Ta2O5). 5. A semiconductor device, as recited in claim 1, wherein at least one of the metal gate electrodes further comprises a material selected from a group consisting of tungsten (W), titanium nitride (TiN), and molybdenum (Mo). 6. A semiconductor device, as recited in claim 1, further comprising a plurality of isolation trenches formed in the substrate, each FET being disposed substantially equidistant from two trenches.