초록 ▼

Real time kinematic (RTK) global positioning system (GPS) technology is integrated with precision farming methodologies to provide highly accurate seeding, cultivating, planting and/or harvesting operations. RTK GPS systems are used to control fully or semi-autonomous vehicles in these operations an

Real time kinematic (RTK) global positioning system (GPS) technology is integrated with precision farming methodologies to provide highly accurate seeding, cultivating, planting and/or harvesting operations. RTK GPS systems are used to control fully or semi-autonomous vehicles in these operations and may allow for precision planting of seeds (e.g., from a seeder equipped with an RTK GPS receiver and related equipment) and/or precision weed removal (e.g., using a vehicle fitted with weed eradication mechanisms such as augers and/or herbicide sprayers). Crop specific fertilizer/pesticide application is also enabled through the use of centimeter-level accurate positioning techniques.

대표청구항 ▼

Real time kinematic (RTK) global positioning system (GPS) technology is integrated with precision farming methodologies to provide highly accurate seeding, cultivating, planting and/or harvesting operations. RTK GPS systems are used to control fully or semi-autonomous vehicles in these operations an

Real time kinematic (RTK) global positioning system (GPS) technology is integrated with precision farming methodologies to provide highly accurate seeding, cultivating, planting and/or harvesting operations. RTK GPS systems are used to control fully or semi-autonomous vehicles in these operations and may allow for precision planting of seeds (e.g., from a seeder equipped with an RTK GPS receiver and related equipment) and/or precision weed removal (e.g., using a vehicle fitted with weed eradication mechanisms such as augers and/or herbicide sprayers). Crop specific fertilizer/pesticide application is also enabled through the use of centimeter-level accurate positioning techniques. nufacturing Multi-Chip Modules from semiconductor wafers comprising: fabricating a plurality of semiconductor devices on each semiconductor wafer of a plurality of semiconductor wafers, each semiconductor device comprising a Dynamic Random Access Memory; causing each of the semiconductor devices on each semiconductor wafer of the plurality of semiconductor wafers to store a substantially unique identification code; storing data in association with the substantially unique identification code of each semiconductor device of the plurality of semiconductor devices for identifying manufacturing procedures for the plurality of semiconductor devices, the storing data including storing data for identifying repairs performed on each semiconductor device and for identifying spare rows and columns available to effect repairs in each semiconductor device; separating each semiconductor device of the plura