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Method and apparatus for bias deposition in a modulating electric field 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-014/34
  • C23C-016/00
  • C23F-001/02
출원번호 US-0846581 (2001-05-01)
발명자 / 주소
  • Stimson, Bradley O.
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Moser, Patterson & Sheridan, LLP
인용정보 피인용 횟수 : 26  인용 특허 : 43

초록

The present invention provides a method and apparatus for achieving conformal step coverage of one or more materials on a substrate using sputtered ionized material. In one embodiment, a chamber having one or more current return plates, a support member, an electromagnetic field generator and a supp

대표청구항

The present invention provides a method and apparatus for achieving conformal step coverage of one or more materials on a substrate using sputtered ionized material. In one embodiment, a chamber having one or more current return plates, a support member, an electromagnetic field generator and a supp

이 특허에 인용된 특허 (43)

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  42. Xu Zheng (Foster City CA), Synchronous modulation bias sputter method and apparatus for complete planarization of metal films.
  43. Yao Tse-Yong ; Xu Zheng ; Ngan Kenny King-tai ; Chen Xing ; Urbahn John ; Bourget Lawrence P., Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition.

이 특허를 인용한 특허 (26)

  1. Metzner, Craig R.; Kher, Shreyas S.; Gopal, Vidyut; Han, Shixue; Athreya, Shankarram A., ALD metal oxide deposition process using direct oxidation.
  2. Metzner, Craig R.; Kher, Shreyas S.; Gopal, Vidyut; Han, Shixue; Athreya, Shankarram A., ALD metal oxide deposition process using direct oxidation.
  3. Brown,Karl M.; Pipitone,John; Mehta,Vineet, Apparatus and method for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece.
  4. Brown,Karl M.; Pipitone,John; Mehta,Vineet, Apparatus for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece.
  5. Brown, Karl M.; Pipitone, John; Mehta, Vineet; Hofmann, Ralf, Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas.
  6. Narwankar, Pravin K.; Higashi, Gregg, Formation of a silicon oxynitride layer on a high-k dielectric material.
  7. Chua, Thai Cheng; Hung, Steven; Liu, Patricia M.; Sato, Tatsuya; Paterson, Alex M.; Todorov, Valentin; Holland, John P., Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system.
  8. Olsen, Christopher Sean; Chua, Thai Cheng; Hung, Steven; Liu, Patricia M.; Sato, Tatsuya; Paterson, Alex M.; Todorow, Valentin; Holland, John P., Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system.
  9. Brcka, Jozef, Method and apparatus of distributed plasma processing system for conformal ion stimulated nanoscale deposition process.
  10. Brown,Karl M.; Pipitone,John; Mehta,Vineet, Method for forming a barrier layer in an integrated circuit in a plasma with source and bias power frequencies applied through the workpiece.
  11. Brown, Karl M.; Pipitone, John; Mehta, Vineet, Method for plasma-enhanced physical vapor deposition of copper with RF source power applied to the target.
  12. Chua, Thai Cheng; Paterson, Alex M.; Hung, Steven; Liu, Patricia M.; Sato, Tatsuya; Todorow, Valentin; Holland, John P., Method of fabricating a high dielectric constant transistor gate using a low energy plasma apparatus.
  13. Chistyakov, Roman; Abraham, Bassam Hanna, Method of ionized physical vapor desposition sputter coating high aspect-ratio structures.
  14. Brown, Karl M.; Pipitone, John; Mehta, Vineet, Method of performing physical vapor deposition with RF plasma source power applied to the target using a magnetron.
  15. Brown, Karl M.; Pipitone, John; Mehta, Vineet, Physical vapor deposition plasma reactor with RF source power applied to the target and having a magnetron.
  16. Brown,Karl M.; Pipitone,John; Mehta,Vineet; Hofmann,Ralf; Wang,Wei W.; Sherstinsky,Semyon, Physical vapor deposition plasma reactor with VHF source power applied through the workpiece.
  17. Brown, Karl M.; Sherstinksy, Semyon; Mehta, Vineet H.; Wang, Wei W.; Pipitone, John A.; Ahmann, Kurt J.; Valverde, Jr., Armando, Physical vapor deposition plasma reactor with arcing suppression.
  18. Koshiishi, Akira; Sugimoto, Masaru; Hinata, Kunihiko; Kobayashi, Noriyuki; Koshimizu, Chishio; Ohtani, Ryuji; Kibi, Kazuo; Saito, Masashi; Matsumoto, Naoki; Iwata, Manabu; Yano, Daisuke; Yamazawa, Yohei, Plasma processing apparatus and method.
  19. Koshiishi, Akira; Sugimoto, Masaru; Hinata, Kunihiko; Kobayashi, Noriyuki; Koshimizu, Chishio; Ohtani, Ryuji; Kibi, Kazuo; Saito, Masashi; Matsumoto, Naoki; Iwata, Manabu; Yano, Daisuke; Yamazawa, Yohei, Plasma processing apparatus and method.
  20. Koshiishi, Akira; Sugimoto, Masaru; Hinata, Kunihiko; Kobayashi, Noriyuki; Koshimizu, Chishio; Ohtani, Ryuji; Kibi, Kazuo; Saito, Masashi; Matsumoto, Naoki; Iwata, Manabu; Yano, Daisuke; Yamazawa, Yohei, Plasma processing apparatus and method.
  21. Gopalraja, Praburam; Fu, Jianming; Tang, Xianmin; Forster, John C.; Kelkar, Umesh, Self-ionized and capacitively-coupled plasma for sputtering and resputtering.
  22. Gopalraja,Praburam; Fu,Jianming; Tang,Xianmin; Forster,John C.; Kelkar,Umesh, Self-ionized and capacitively-coupled plasma for sputtering and resputtering.
  23. Ding, Peijun; Tao, Rong; Xu, Zheng; Lubben, Daniel C.; Rengarajan, Suraj; Miller, Michael A.; Sundarrajan, Arvind; Tang, Xianmin; Forster, John C.; Fu, Jianming; Mosely, Roderick C.; Chen, Fusen; Gopalraja, Praburam, Self-ionized and inductively-coupled plasma for sputtering and resputtering.
  24. Ding, Peijun; Tao, Rong; Xu, Zheng; Lubben, Daniel C.; Rengarajan, Suraj; Miller, Michael A.; Sundarrajan, Arvind; Tang, Xianmin; Forster, John C.; Fu, Jianming; Mosely, Roderick C.; Chen, Fusen; Gopalraja, Praburam, Self-ionized and inductively-coupled plasma for sputtering and resputtering.
  25. Ding, Peijun; Tao, Rong; Xu, Zheng; Lubben, Daniel C.; Rengarajan, Suraj; Miller, Michael A.; Sundarrajan, Arvind; Tang, Xianmin; Forster, John C.; Fu, Jianming; Mosely, Roderick C.; Chen, Fusen; Gopalraja, Praburam, Self-ionized and inductively-coupled plasma for sputtering and resputtering.
  26. Yamada, Takakazu; Irino, Osamu; Kagami, Tsuyoshi, Thin film production apparatus and inner block for thin film production apparatus.
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