[특허]Pressure-sensitive conductive ink composition

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01B-001/24 H01B-001/18 B32B-005/16
출원번호	US-0753230 (2000-12-28)
우선권정보	JP-0373330 (1999-12-28)
발명자 / 주소	Ueda, Tsutomu Ooue, Toshikazu
출원인 / 주소	Nitta Corporation
대리인 / 주소	Darby & Darby
인용정보	피인용 횟수 : 23 인용 특허 : 5

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A pressure-sensitive conductive ink composition includes a thermoplastic resin and a conductive filler. The thermoplastic resin is added with a curing agent capable of a partial crosslinkable reaction. The resulting composition maintains its pressure-sensitive characteristics, even at elevated tempe

A pressure-sensitive conductive ink composition includes a thermoplastic resin and a conductive filler. The thermoplastic resin is added with a curing agent capable of a partial crosslinkable reaction. The resulting composition maintains its pressure-sensitive characteristics, even at elevated temperatures.

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A pressure-sensitive conductive ink composition includes a thermoplastic resin and a conductive filler. The thermoplastic resin is added with a curing agent capable of a partial crosslinkable reaction. The resulting composition maintains its pressure-sensitive characteristics, even at elevated tempe

A pressure-sensitive conductive ink composition includes a thermoplastic resin and a conductive filler. The thermoplastic resin is added with a curing agent capable of a partial crosslinkable reaction. The resulting composition maintains its pressure-sensitive characteristics, even at elevated temperatures. sound waves during said deposition process comprises actuating at least one acoustic generator to generate sound waves continuously during said deposition process. 7. The method of claim 1, wherein said openings have an aspect ratio of at least 4:1. 8. A method, comprising: providing a substrate having a layer of insulating material formed thereabove, said layer of insulating material having a plurality of openings formed therein; performing a deposition process to form a layer of metal at least in said openings in said layer of insulating material; and actuating at least one acoustic generator to generate supersonic sound waves during said deposition process. 9. A method, comprising: providing a substrate having a layer of insulating material formed thereabove, said layer of insulating material having a plurality of openings formed therein; performing a deposition process to form a layer of metal at least in said openings in said layer of insulating material; and actuating at least one acoustic generator to generate subsonic sound waves during said deposition process. 10. A method, comprising: providing a substrate having a layer of insulating material formed thereabove, said layer of insulating material having a plurality of openings formed therein; performing a deposition process to form a layer of metal at least in said openings in said layer of insulating material; and actuating at least one acoustic generator to generate sound waves intermittently during said deposition process. 11. A method, comprising: providing a substrate having a layer of insulating material formed thereabove, said layer of insulating material having a plurality of openings formed therein; performing a deposition process to form a layer of metal at least in said openings in said layer of insulating material; actuating at least one acoustic generator to generate sound waves during said deposition process; and varying a frequency of said sound waves. 12. A method, comprising: providing a substrate having a layer of insulating material formed thereabove, said layer of insulating material having a plurality of openings formed therein; performing a deposition process to form a layer of metal at least in said openings in said layer of insulating material; actuating at least one acoustic generator to generate sound waves during said deposition process; and varying an energy level of said sound waves. 13. A method, comprising: providing a substrate comprised of silicon having a layer of insulating material formed thereabove, said layer of insulating material being comprised of a material having a dielectric constant less than 5.0, said layer of insulating material having a plurality of openings formed therein; positioning said substrate in a deposition chamber; performing a deposition process in said deposition chamber to form a layer of metal at least in said openings in said layer of insulating material; and actuating at least one of a plurality of acoustic generators positioned within said chamber to generate sound waves during said deposition process and to direct said sound waves toward said substrate during said deposition process. 14. The method of claim 13, wherein performing a deposition process in said deposition chamber to form a layer of metal at least in said openings comprises performing at least one of a physical vapor deposition process, an ionized metal physical vapor deposition process and a high density plasma physical vapor deposition process in said deposition chamber to form a layer of metal at least in said openings. 15. The method of claim 13, wherein performing a deposition process in said deposition chamber to form a layer of metal at least in said openings in said layer of insulating material comprises performing a deposition process in said deposition chamber to form a layer of metal comprised of at least one of copper, tantalum, gold, titanium, titanium nitride and tungsten at least i

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이 특허에 인용된 특허 (5) 인용/피인용 타임라인 분석

Martin Frank W. (Baldwin Place NY) Shahbazi Samson (Yonkers NY), Conductive compositions that are directly solderable and flexible and that can be bonded directly to substrates.
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Frentzel Richard L. (Chino Hills CA) Chen Andrew (Covina CA), Highly conductive polymer thick film compositions.
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Krivopal Boris, Pressure sensitive ink means, and methods of use.
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Mashimo Satoshi (Akashi JPX) Nagayasu Susumu (Kobe JPX) Yamaguchi Yoshio (Kobe JPX) Noguchi Toru (Kobe JPX) Nakajima Masayoshi (Ashiya JPX) Kakiuchi Hajime (Itami JPX) Tanida Kijuro (Ashiya JPX), Pressure-responsive variable electrical resistive rubber material.
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Chan Man-Sheung ; Dorfman Jay Robert, Water based thick film conductive compositions.
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[미국특허] Pressure-sensitive conductive ink composition 원문보기

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